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GB/T 29847-2025 English PDF

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Q: Should I purchase the latest version GB/T 29847-2025?

Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 29847-2025 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.

US$599.00 · In stock
Delivery: <= 5 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 29847-2025: Test methods for copper foil used for printed boards
Status: Valid

GB/T 29847: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 29847-2025	599	Add to Cart	5 days	Test methods for copper foil used for printed boards	Valid
GB/T 29847-2013	719	Add to Cart	6 days	Test methods for copper foil used for printed boards	Valid

Similar standards

GB/T 41203 GB/T 37406 GB/T 29848 GB/T 29844

Basic data

Standard ID: GB/T 29847-2025 (GB/T29847-2025)
Description (Translated English): Test methods for copper foil used for printed boards
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L90
Classification of International Standard: 31.030
Word Count Estimation: 30,331
Date of Issue: 2025-03-28
Date of Implementation: 10/1/2025
Older Standard (superseded by this standard): GB/T 29847-2013
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 29847-2025: Test methods for copper foil used for printed boards

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.030 CCSL90 National Standard of the People's Republic of China Replaces GB/T 29847-2013 Test methods for copper foil for printed circuit boards Released on 2025-03-28 2025-10-01 Implementation State Administration for Market Regulation The National Standardization Administration issued

Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Test conditions 2 5 Sampling method 2 6 Appearance and dimensional test methods 2 7 Physical properties test methods 7 8 Process performance test methods 13 Appendix A (Informative) Preparation method of microsection specimen 22

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. This document replaces GB/T 29847-2013 "Test methods for copper foil for printed boards". Compared with GB/T 29847-2013, except for the structural adjustment In addition to the integration and editorial changes, the main technical changes are as follows. a) Added the terms "pinhole" and "penetration point" (see 3.5, 3.6); deleted the term "profile factor" (see 3.1 of the.2013 edition); The terms "treatment" and "arithmetic mean deviation of profile" are changed to "surface treatment" and "surface roughness" (see 3.1, 3.2,.2013 edition) 3.2, 3.3); the definition of the term "micro roughness" has been changed (see 3.3, 3.4 of the.2013 edition); b) The sampling method has been changed (see Chapter 5, Chapter 5 of the.2013 edition); c) The permissible error of magnifying glass or microscope instruments has been changed (see Chapter 6, 6.1.2 of the.2013 edition); d) Added discoloration points in surface inspection (see 6.1.3.4); e) The pinhole inspection (penetrant method) has been modified (see Chapter 6, 6.2 of the.2013 edition); f) Deleted "the total thickness and outline factor of treated or untreated copper foil" in the appearance and size test methods (see 6.3 of the.2013 edition); g) Increased roughness (laser method) (see 6.7); h) Deleted bending fatigue and ductility (see 7.2 of the.2013 edition); i) increased bending resistance (see 7.2); j) increased flexural resistance (see 7.3); k) Deleted "Peel strength measurement after thermal stress" (see 7.3.3.3 of the.2013 edition); l) Deleted "Peel strength measurement after exposure to process solution" (see 7.3.3.4 of the.2013 edition); m) Added "peel strength after solvent resistance" (see 7.4.3.3); n) Added "solder heat resistance" (see 7.5); o) Added "high temperature oxidation resistance" (see 8.7); p) Deleted "Purity of copper foil or copper plating" (see 9.1 of the.2013 edition); q) Added “Chemical composition of copper foil” (see 8.8). Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203). This document was drafted by. China Electronics Technology Standardization Institute, Sichuan Mingfeng Electronic Materials Technology Co., Ltd., Shanxi Beitong New Materials Technology Co., Ltd., Guangdong Yinghua Electronic Technology Co., Ltd., Jiangsu Mingfeng Electronic Materials Technology Co., Ltd., Chongqing Yulong Optoelectronics Technology Co., Ltd. Co., Ltd., Shenzhen Huike New Materials Co., Ltd., Lingbao Jinyuan Chaohui Copper Co., Ltd., Junxuan New Materials (Hangzhou) Co., Ltd., Shaanxi Baoyu Technology Industry Co., Ltd., Shenzhen Linghangda Electronics Co., Ltd., and Jiangxi Jiangxi Copper Foil Technology Co., Ltd. The main drafters of this document are. Cao Kewei, Wang Pengju, Wu Ting, Li Xueping, Zhang Baoshuai, Shi Zeyuan, Ming Zhiyao, Zhao Junsha, Wu Yiran, Xu Jianwei, Zhao Xiaohui, Tang Jianming, Zeng Zhaofeng, Xu Jiaolong, Qian Yan, Chai Shengli, Wang Chunwen, Yu Kemiao. This document was first published in.2013 and this is the first revision. Test methods for copper foil for printed circuit boards

1 Scope

This document describes the test methods for the appearance, dimensions, physical properties, processing properties, and other properties of copper foil for printed boards. This document applies to the testing of copper foil for rigid or flexible printed boards.

2 Normative references

The contents of the following documents constitute essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. GB/T 2036 Terminology for printed circuits GB/T 3131 Tin-lead solder GB/T 4723 Copper-clad phenolic paper laminate for printed circuits GB/T 5121.1 Chemical analysis methods for copper and copper alloys Part 1.Determination of copper content GB/T 5121.2 Chemical analysis methods for copper and copper alloys Part 2.Determination of phosphorus content GB/T 5121.3 Chemical analysis methods for copper and copper alloys Part 3.Determination of lead content GB/T 5121.4 Chemical analysis methods for copper and copper alloys Part 4.Determination of carbon and sulfur content GB/T 5121.5 Chemical analysis methods for copper and copper alloys Part 5.Determination of nickel content GB/T 5121.6 Chemical analysis methods for copper and copper alloys Part 6.Determination of bismuth content GB/T 5121.7 Chemical analysis methods for copper and copper alloys Part 7.Determination of arsenic content GB/T 5121.8 Chemical analysis methods for copper and copper alloys Part 8.Determination of oxygen content GB/T 5121.9 Chemical analysis methods for copper and copper alloys Part 9.Determination of iron content GB/T 5121.10 Chemical analysis methods for copper and copper alloys Part 10.Determination of tin content GB/T 5121.11 Chemical analysis methods for copper and copper alloys Part 11.Determination of zinc content GB/T 5121.15 Chemical analysis methods for copper and copper alloys Part 15.Determination of cobalt content GB/T 5121.16 Chemical analysis methods for copper and copper alloys Part 16.Determination of chromium content GB/T 5121.27 Chemical analysis methods for copper and copper alloys Part 27.Inductively coupled plasma optical emission spectrometry GB/T 13557-2017 Test methods for flexible copper clad materials for printed circuits

3 Terms and definitions

The terms and definitions defined in GB/T 2036 and the following apply to this document. 3.1 Surface treatment surface treatment An electrical, mechanical or chemical process applied to the surface of copper foil. Note. Used to improve surface oxidation resistance, corrosion resistance or adhesion to laminate substrates and other properties. 3.2 Surface roughness Ra ......

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Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 29847-2025_English be delivered?

Answer: Upon your order, we will start to translate GB/T 29847-2025_English as soon as possible, and keep you informed of the progress. The lead time is typically 3 ~ 5 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 29847-2025_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 29847-2025_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.

Question 5: Should I purchase the latest version GB/T 29847-2025?

Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 29847-2025 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.