GB/T 14619-2013 English PDF

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GB/T 14619-2013: Alumina ceramic substrates for thick film integrated circuits
Status: Valid

GB/T 14619: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 14619-2013	349	Add to Cart	3 days	Alumina ceramic substrates for thick film integrated circuits	Valid
GB/T 14619-1993	359	Add to Cart	3 days	Alumina ceramic substrates for thick film integratedcircuits	Obsolete

Similar standards

GB/T 11446.7   GB/T 11446.6   GB/T 11446.8   GB/T 31379.1   GB/T 29847   GB/T 14620   

Basic data

Standard ID: GB/T 14619-2013 (GB/T14619-2013)
Description (Translated English): Alumina ceramic substrates for thick film integrated circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L90
Classification of International Standard: 31.030
Word Count Estimation: 15,148
Older Standard (superseded by this standard): GB/T 14619-1993
Quoted Standard: GB/T 1958; GB/T 2413; GB/T 2828.1; GB/T 2829; GB/T 5593; GB/T 5594.3; GB/T 5594.4; GB/T 5594.5; GB/T 5594.7; GB/T 5598; GB/T 6062; GB/T 6569; GB/T 6900; GB/T 9531.1-1988; GB/T 16534-2009; GJB 548B-2005; GJB 1201.1-1991
Regulation (derived from): National Standards Bulletin No. 22 of 2013
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies: thick film circuits using alumina ceramic substrates requirements, test methods, inspection rules, marking, packaging, transport and storage. This standard applies to: thick film integrated with alumina ceramic substrate productio

GB/T 14619-2013: Alumina ceramic substrates for thick film integrated circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Alumina ceramic substrates for thick film integrated circuits ICS 31.030 L90 National Standards of People's Republic of China Replacing GB/T 14619-1993 Thick film integrated with an alumina ceramic substrate Issued on. 2013-11-12 2014-04-15 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard replacement GB/T 14619-1993 "thick film integrated with an alumina ceramic substrate," and GB/T 14619-1993 compared to primary Technological change to the following. --- Increasing the terms and product identification (see Chapters 3 and 4); --- When using a nominal increase of the alumina content of the substrate type represents the actual value of the alumina content requirements (see 4.3); --- Increasing the diameter of pits (see Table 1); --- 96% increase in the classification of non-alumina ceramic, and gives the index (see Table 5); --- Increasing the bore requirements (see 5.2.2); --- Refine the size requirements of the substrate after the index crossed (see 5.2.3); --- Test substrate warpage will be described in detail (see Appendix A). The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. The standard by the China Electronics Standardization Institute. This standard was drafted. China Electronics Standardization Institute. Drafters of this standard. Cao Yi, T.. This standard replaces the standards previously issued as follows. --- GB/T 14619-1993. Thick film integrated with an alumina ceramic substrate

1 Scope

This standard specifies the thick film integrated circuit with an alumina ceramic substrate requirements, test methods, inspection rules, marking, packaging, transport and Storage. This standard applies to thick film integrated with an alumina ceramic substrate production and procurement, the use of thick film technology of chip components alumina Ceramic substrate (hereinafter referred to as substrate) can also refer to use.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 1958 Geometrical Product Specifications (GPS) and a positional deviation detecting a predetermined shape GB/T 2413 piezoelectric ceramic material bulk density measurement method GB/T 2828.1 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch inspection sampling plan GB/T 2829 Periodic inspection Sampling procedures and sample forms (for checking the stability of the production process) GB/T 5593 structure ceramic electronic components GB/T 5594.3 Electronic Component structure ceramic average linear expansion coefficient Test Method Test Method Test GB/T 5594.4 electronic structure ceramic component test method dielectric constant and dielectric loss tangent values method GB/T 5594.5 electronic structure ceramic components volume resistivity test methods Test Method GB/T 5594.7 electronic structure ceramic components liquid permeability test method Test Method GB/T 5598 beryllium oxide ceramic thermal conductivity measurement method GB/T 6062 Geometrical product specifications (GPS) Surface texture Profile method of contact (stylus) instruments nominal characteristics GB/T 6569 fine ceramic bending strength test method GB/T 6900 LAS Chemical analysis of refractories GB/T 9531.1-1988 electronic ceramic parts technical conditions GB/T 16534-2009 Test method for hardness of fine ceramics at room temperature GJB548B-2005 test methods and procedures for microelectronics GJB1201.1-1991 solid material at high temperature thermal diffusivity test methods

3 Terms and Definitions

The following terms and definitions apply to this document. 3.1 Alumina ceramic substrate aluminaceramicsubstrate; aluminasubstrate Can be printed on the surface of the conductor pattern, the membrane element or paste a chip support alumina ceramic electronic components, referred to as substrate. ......

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