GB/T 13062-2018 English PDFUS$264.00 ยท In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 13062-2018: Semiconductor devices -- Integrated circuits -- Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures Status: Valid GB/T 13062: Historical versions
Basic dataStandard ID: GB/T 13062-2018 (GB/T13062-2018)Description (Translated English): Semiconductor devices -- Integrated circuits -- Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L57 Classification of International Standard: 31.200 Word Count Estimation: 14,124 Date of Issue: 2018-12-28 Date of Implementation: 2019-07-01 Older Standard (superseded by this standard): GB/T 13062-1991 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 13062-2018: Semiconductor devices -- Integrated circuits -- Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Semiconductor devices--Integrated circuits--Part 21--1. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualifying procedures ICS 31.200 L57 National Standards of People's Republic of China Replace GB/T 13062-1991 Semiconductor device integrated circuit Part 21-1. Membrane integrated circuits and hybrid film integration Detailed specification of circuit blanks (using accreditation approval procedure) Part 21-1. Blankdedespecificationforfilmintegratedcircuitsandhybridfilm (IEC 60748-21-1.1997, IDT) 2018-12-28 released.2019-07-01 implementation State market supervision and administration China National Standardization Administration issued ForewordThe Semiconductor Device IC has or plans to release the following sections. --- GB/T 16464-1996 Semiconductor device integrated circuits - Part 1. General (idtIEC 60748-1.1984); --- GB/T 17574-1998 Semiconductor device integrated circuits - Part 2. Digital integrated circuits (idtIEC 60748-2. 1985); --- GB/T 17940-2000 Semiconductor device integrated circuits - Part 3. Analog integrated circuits (idtIEC 60748-3. 1986); --- GB/T 18500.1-2001 Semiconductor device integrated circuits - Part 4. Interface integrated circuits - Part 1 Word/Analog Converter (DAC) Blank Detail Specification (idtIEC 60748-4-1.1993); --- GB/T 18500.2-2001 Semiconductor device integrated circuits - Part 4. Interface integrated circuits - Part 2 Quasi-digital converter (ADC) blank detail specification (idtIEC 60748-4-2.1993); --- GB/T 20515-2006 Semiconductor device integrated circuits Part 5. Semi-custom integrated circuits (idtIEC 60748-5); --- GB/T 12750-2006 Semiconductor device integrated circuits Part 11. Semiconductor integrated circuit sub-specification (excluding mixed Combined circuit) (idtIEC 60748-11.1990); ---GB/T 8976-1996 General specification for membrane integrated circuits and hybrid film integrated circuits (idtIEC 60748-20.1988); --- GB/T 11498-2018 Semiconductor device integrated circuits - Part 21. Membrane integrated circuits and hybrid film integrated circuits Specification (using accreditation approval procedures) (IEC 60748-21.1997, IDT); Blank detail specification (using accreditation approval procedure) (IEC 60748-21-1.1997, IDT); ---GB/T 16465-1996 Membrane integrated circuit and hybrid film integrated circuit sub-specification (using capability approval procedure) (idt IEC 60748-22); ---GB/T 16466-1996 Membrane integrated circuit and hybrid film integrated circuit blank detailed specification (using capability approval procedure) (idt IEC 60748-22-1). This part is part 21-1 of the "Semiconductor Device Integrated Circuit". This part is drafted in accordance with the rules given in GB/T 1.1-2009. This part replaces GB/T 13062-1991 "film integrated circuit and hybrid film integrated circuit blank detail specification (using the appraisal approval process) Preface), compared with GB/T 13062-1991, the main technical changes are as follows. --- Modified the qualification test procedure, from one program to two procedures. program A and program B (see Table 4, Table 5,.1991 edition) Table 2, Table 3); --- Removed the "relevant documents" provisions (see Chapter 3 of the.1991 edition); --- Added two test items "visual inspection before capping" and "electrical durability" (see Table 2); --- Added "4.5.10 solderability" test (see Table 3b). This part uses the translation method equivalent to IEC 60748-21-1.1997 "Semiconductor device integrated circuits Part 21-1. Membrane integration Blank detail specification for circuits and hybrid film integrated circuits (using the approval approval procedure). The documents of our country that have a consistent correspondence with the international documents referenced in this part are as follows. ---GB/T 8976-1996 General specification for membrane integrated circuits and hybrid film integrated circuits (idtIEC 60748-20.1988); --- GB/T 11498-2018 Semiconductor device integrated circuits - Part 21. Membrane integrated circuits and hybrid film integrated circuits Specification (using the accreditation approval procedure) (IEC 60748-21.1997, IDT). This section has made the following editorial changes. --- Table 3b in the flammability test "D/ND" column to add a footnote, it is recommended that the test should be specified as a destructive test (see Table 3b); ---IEC 60748-21-1.1997 B8 group "4.4.14 electrical durability" in Table 4b, wrong, changed to "4.5.14 electrical durability" (see Table 4b). Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section drafted by. China Electronics Technology Group Corporation, the 43rd Research Institute, China Electronics Technology Standardization Institute. The main drafters of this section. Feng Lingling, Chen Yuxi, Lei Jian, Wang Qi, Wang Tingting, Guan Songlin. The previous versions of the standards replaced by this section are. ---GB/T 13062-1991. Semiconductor device integrated circuit Part 21-1. Membrane integrated circuits and hybrid film integration Detailed specification of circuit blanks (using accreditation approval procedure)IntroductionThe IEC electronic component quality assessment system follows the IEC regulations and works under the authority of the IEC . The purpose of the system is to determine the quality review In this way, an electronic component that is released by the participating countries in accordance with relevant regulations is required for further testing without further testing. Participating countries also accept. In the preparation of detailed specifications, the contents of 2.3 and 3.2 of the general specification and sub-specifications are taken into account. This blank detail specification is one of a series of blank detail specifications for semiconductor devices and is used with the following standards. IEC 60748-20 Semiconductor device integrated circuits - Part 20. General specification for film integrated circuits and hybrid integrated circuits (Semi- conductordevices-Integratedcircuits-Part 20.Genericspecificationforfilmintegratedcircuitsand Hybridfilmintegratedcircuits) IEC 60748-20-1 Semiconductor device integrated circuits - Part 20-1. General specification for film integrated circuits and hybrid film integrated circuits Part 1. Internal Visual Inspection Requirements (Semiconductordevices-Integratedcircuits-Part 20. Genericspecification forfilmintegratedcircuitsandhybridfilmintegratedcircuits-Section1.Requirementsforinternal Visualexamination) IEC 60748-21 Semiconductor device integrated circuits - Part 21. s Identification approval procedure) (Semiconductordevices-Integratedcircuits-Part 21. Sectionalspecificationforfilm Integratedcircuitsandhybridfilmintegratedcircuitsonthebasisofqualificationapprovalprocedures) a) For the circuits in the catalog, detailed specifications have been published, and the format and minimum content shall comply with the requirements of Tables 2 to 4; b) For custom circuits, no detailed specifications are published, the format and content of which are optional; however, custom circuits and their appearance, installation Requirements related to functional aspects, etc., must be verified and specified in the maintenance test procedures approved by the appraisal, or in the detailed specification. Provisions, or a combination of the two; c) For CQCs, detailed specifications have not been published, and their format and content should meet the requirements of Tables 2 to 4. This section specifies the basic requirements for the preparation of blank detail specifications for membrane integrated circuits and hybrid film integrated circuits (using the approval process). This part is one of the blank detail specifications for membrane integrated circuits and hybrid film integrated circuits, and should be compatible with IEC 60748-20 and IEC 60748-21. use together. Request information The numbers in square brackets on this page and on the next page correspond to the information required for the following items, which should be entered in the corresponding column of the detailed specification. The clauses given in square brackets in this section constitute the first page of the detailed specification, which is intended to guide the preparation of detailed specifications and should not be included. Detailed specifications. When any of the articles guides writing may cause confusion, it should be stated in square brackets. Detailed specification [1] The name of the national standardization body authorized to issue detailed specifications. [2] Detailed specification of the IEC Q number, date of publication, and any further information required by the national standard system. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 13062-2018_English be delivered?Answer: Upon your order, we will start to translate GB/T 13062-2018_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 13062-2018_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 13062-2018_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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