YS/T 543: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| YS/T 543-2025 | English | RFQ |
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3 days [Need to translate]
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Aluminum-1% silicon filament for semiconductor bonding
| Valid |
YS/T 543-2025
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| YS/T 543-2015 | English | 329 |
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Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding
| Valid |
YS/T 543-2015
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| YS/T 543-2006 | English | 279 |
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3 days [Need to translate]
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Semiconductor bonded aluminum -1% silicon filaments
| Obsolete |
YS/T 543-2006
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Basic data | Standard ID | YS/T 543-2025 (YS/T543-2025) | | Description (Translated English) | Aluminum-1% silicon filament for semiconductor bonding | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H61 | | Classification of International Standard | 77.150.10 | | Date of Issue | 2025-04-10 | | Date of Implementation | 2025-11-01 | | Older Standard (superseded by this standard) | YS/T 543-2015 | | Issuing agency(ies) | Ministry of Industry and Information Technology | YS/T 543-2015: Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
(Semiconductor bonded aluminum silicon filament -1%)
ICS 29.045
H61
People's Republic of China Nonferrous Metals Industry Standard
Replacing YS/T 543-2006
Semiconductor bonded aluminum silicon filaments -1%
Standardspecificationforfinealuminum-1% siliconwire
Issued on. 2015-04-30
2015-10-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
Instead of the standard YS/T 543-2006 "semiconductor bonded aluminum-1% silicon filaments."
Compared with this standard YS/T 543-2006, the main technical changes are as follows.
--- To increase and adjust the grades, categories, sizes;
--- Increasing the chemical composition requirements Mg, B, V impurity element;
--- Increase the tensile force, the Elongation fluctuation;
--- Added Appendix A, the filament surface informative typical defects;
--- Increasing the normative Appendix B, the filament length measurement method;
--- Increased normative appendix C, filament surface quality inspection method.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points.
This standard is mainly drafted by. public and Xinjiang Co., Ltd., Beijing Institute of Nonferrous Metals Rare Earth and application of Jiangyin City, ultra-fine aluminum
Plastic Co., Ltd., Shandong Yankuang Light Alloy Co., Ltd., Beijing Dubbo brazing alloys, limited liability company, Northeast Light Alloy Co., Ltd.
the company.
The main drafters of this standard. Wu Bin, SONG, efforts ancient, Shi Xiumei, Xuyue Xing Yang Xiao, Jiao Lei, Wen Wei Xinyu high, Du Lianmin.
This standard replaces the standards previously issued as follows.
--- YS/T 543-2006.
Semiconductor bonded aluminum silicon filaments -1%
1 Scope
This standard specifies the semiconductor device is bonded to 1% of aluminum silicon filaments requirements, test methods, inspection rules, packaging, labeling, transportation, storage
Keeping and quality certificate with your order (or contract) content.
This standard applies to semiconductor inner lead (hereinafter referred to as filaments) Drawn or extruded aluminum - 1% silicon filaments.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 3199 aluminum and aluminum alloy products - Packing, marking, transportation and storage
GB/T 7999 aluminum and aluminum alloys Optical emission spectroscopy method
GB/T 8170 repair value expressed about the rules and limit values and judgment
GB/T 10573 non-ferrous metal filament tensile test method
GB/T 17432 Wrought aluminum and aluminum alloys - Methods of sampling
GB/T 20975 (all parts), chemical analysis of aluminum and aluminum alloys
Determination glow YS/T 871 Chemical analysis methods of high purity aluminum trace elements discharge mass spectrometry
3 Requirements
3.1 Categories
3.1.1 grade, status, Dimensions
Filaments grades, state, sizes are shown in Table 1.
Table 1 grades, status, type, dimensions
Grade status
Dimensions
A typical diameter/mm typical length/m
Al-1% Si 0, H18
0.013,0.018,0.020,0.025,0.030,0.032,0.035,
0.038,0.040,0.045,0.050,0.060,0.070,0.080,
0.100
100-1000
3.1.2 tag example
Filaments marked by product name, standard number, grade, status, and sizes of the order of representation. Tag example as follows.
Example. Grades Al-1% Si, state H18, having a diameter of 0.013mm, length 100m filaments, marked.
Filaments YS/T 543-Al-1% SiH18-φ0.013 × 100
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