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GB/T 34649-2017: Magnetron sputtering ruthenium target
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| GB/T 34649-2017 | English | 199 |
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Magnetron sputtering ruthenium target
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GB/T 34649-2017
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Basic data | Standard ID | GB/T 34649-2017 (GB/T34649-2017) | | Description (Translated English) | Magnetron sputtering ruthenium target | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 10,128 | | Date of Issue | 2017-09-29 | | Date of Implementation | 2018-04-01 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | GB/T 34649-2017: Magnetron sputtering ruthenium target---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Magnetron sputtering ruthenium target
ICS 77.150.99
H68
National Standards of People's Republic of China
Ruthenium targets for magnetron sputtering
2017-09-29 Posted
2018-04-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
China National Standardization Administration released
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard is proposed by China Nonferrous Metals Industry Association.
This standard by the National Non-ferrous Metal Standardization Technical Committee (SAC/TC243) centralized.
This standard is drafted by. There are billion New Materials Co., Ltd., non-ferrous metal technology and Economy Institute.
The drafters of this standard. Luojun Feng, Ding Zhaohong, Li Yongjun, Xiang Lei, Wan Xiaoyong, Liu Shuqin, Xiong Xiaodong, Wang Zhuang, He Xin, Teng Haitao, Gao Yan.
Ruthenium targets for magnetron sputtering
1 Scope
This standard specifies the ruthenium target magnetron sputtering requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificate and
Order (or contract) content.
This standard applies to the field of microelectronics sputtering ruthenium target magnetron sputtering (hereinafter referred to as ruthenium target).
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 1804 General tolerances Tolerances for linear and angular dimensions without tolerances
GB/T 5163 Sintered metal materials (excluding cemented carbide) Permeable sintered metal material density, oil content and open area
Determination
GB/T 6394 metal average grain size determination method
GB/T 14265 metal materials, hydrogen, oxygen, nitrogen, carbon and sulfur analysis methods General
GB/T 23275 Methods for chemical analysis of ruthenium powder Determination of lead, iron, nickel, aluminum, copper, silver, gold, platinum, iridium, palladium, rhodium and silicon glow discharge
Mass spectrometry
YS/T 837 Sputtering target - backplane combined with quality ultrasonic testing methods
3 Terms and definitions
The following terms and definitions apply to this document.
3.1
Magnetron sputtering physical vapor deposition; PVD
A method of physical vapor deposition coating. By introducing an electric field and a magnetic field on the surface of the target, the magnetic field is used to restrict the charged particles
High plasma density, and the use of an electric field of inert gas (usually Ar gas) particles accelerated bombardment of the target surface, thereby sputtering out of the material atoms or
Atomic group, the final deposition to form a film coating.
3.2
Palladium for magnetron sputtering prepared from metallic ruthenium was used to prepare ruthenium film plating.
4 requirements
4.1 Product Classification
4.1.1 ruthenium target divided by chemical composition Ru-99.95, Ru-99.99, Ru-99.995, Ru-99.999 four grades.
4.1.2 According to the target welding method can be divided into single type and welding type, backplane materials, including aluminum, copper and copper alloy.
4.1.3 ruthenium target cross-sectional shape can be divided into round, rectangular and shaped (ring, triangle) and so on.
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