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GB/T 18290.4-2015 English PDF

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GB/T 18290.4-2015: Solderless connections -- Part 4: Solderless non-accessible insulation displacement connections -- General requirements, test methods and practical guidance
Status: Valid

GB/T 18290.4: Evolution and historical versions

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 18290.4-2015English694 Add to Cart 4 days [Need to translate] Solderless connections -- Part 4: Solderless non-accessible insulation displacement connections -- General requirements, test methods and practical guidance Valid GB/T 18290.4-2015
GB/T 18290.4-2000English919 Add to Cart 4 days [Need to translate] Solderless connections. Part 4: Solderless non-accessible insulation displacement connections. General requirements, test methods and practical guidance Obsolete GB/T 18290.4-2000

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Basic data

Standard ID GB/T 18290.4-2015 (GB/T18290.4-2015)
Description (Translated English) Solderless connections -- Part 4: Solderless non-accessible insulation displacement connections -- General requirements, test methods and practical guidance
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L23
Classification of International Standard 31.220.10
Word Count Estimation 35,337
Date of Issue 2015-12-31
Date of Implementation 2016-07-01
Older Standard (superseded by this standard) GB/T 18290.4-2000
Regulation (derived from) State Standard Announcement 2015 No.43
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 18290.4-2015: Solderless connections -- Part 4: Solderless non-accessible insulation displacement connections -- General requirements, test methods and practical guidance


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Solderless connections - Part 4. Solderless non-accessible insulation displacement connections - General requirements, test methods and practical guidance ICS 31.220.10 L23 National Standards of People's Republic of China Replacing GB/T 18290.4-2000 Solderless connections - Part 4. Solderless non - accessible insulation Displacement connections - General requirements, test methods and Guidelines for the use Part 4. Solderlessnon-accessibleinsulationdisplacementconnections- Generalrequirements, testmethodsandpracticalguidance (IEC 60352-4.1994, IDT) Issued on. 2016-07-01 2015-12-31 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Table of Contents

Introduction Ⅲ Introduction Ⅳ The first chapter General 1 Scope 1 2 Objective 1 3 Normative references 1 4 Terms and definitions 2 5 Models 4 The second claim 6 processing quality 5 7 Tools 5 8 insulation displacement terminations (ID terminations) 5 9 6 wire 10 Do not touch the insulation displacement connection (non-contact ID connection) 6 Third test 11 Test 6 12 type tests 7 13 Test List 12 Title IV Use Guidelines 14 Overview 19 15 19 Information Tools Profile 20 16 terminations 17 wire data 21 18 connection information 22 19 open housing structure connection ID 24 20 closed shell structure connection ID 26 Additional Information 21 General as part of the multi-pin connector 27 connected to the relevant ID 22 Note 28

Foreword

GB/T 18290 "solderless connection" consists of the following components. --- Part 1. solderless connection about connections - General requirements, test methods and practical guidance; --- Part 2. solderless connection crimped connections - General requirements, test methods and practical guidance; --- Part 3. solderless connector solderless accessible insulation displacement connections - General requirements, test methods and guidelines; --- Part 4. solderless connection untouchable solderless insulation displacement connections - General requirements, test methods and guidelines; --- Part 5. solderless connection push-in connections - General requirements, test methods and guidelines; --- Part 6. solderless connector insulation displacement connections - General requirements, test methods and guidelines; --- Part 7. solderless connection spring clamp connections - General requirements, test methods and guidelines; --- Part 8. solderless connection clamping mount connections - General requirements, test methods and practical guidance. This section GB/T Part of 418,290. This section drafted in accordance with GB/T 1.1-2009 given rules. This Part replaces GB/T 18290.4-2000 "Solderless connections - Part 4. Solderless non - accessible insulation displacement connections - General requirements, Test methods and guidelines. " Section compared with the GB/T 18290.4-2000, major changes in the following. --- Description product and its use increases the material's impact on the natural environment in the introduction; --- Delete "industrial atmospheric corrosion" experimental use "Flowing mixed gas corrosion test" instead (see 12.4.3); --- Adjusted Table 3. Number of test samples, such as the test sample number "22 (optional)" is replaced by "20 and 2 (optional)" and so on (see 13.1.2); --- Rearrange use guidelines, and changes in the content, such as increasing the connection ID advantage, refine current carrying capacity, increasing the open And closed shell structure and connection ID as a general multi-pin connector Additional Information section about connection ID, etc. (see para. Four). This section uses the translation method is equivalent to using IEC 60352-4.1994 and amendments 1 (2000), "solderless connection Part 4. Not available Contacting solderless insulation displacement connections - General requirements, test methods and practical guidance. " For ease of use, this section made the following editorial changes. --- Remove the imperial units. Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents. This part is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This section is under the jurisdiction of the National electronic equipment Electromechanical components for Standardization Technical Committee (SAC/TC166). This part by the Guizhou Space Appliance Co., Ltd., Shenzhen Electronics Co. Alto, responsible for China Electronics Standardization Institute Drafted. The main drafters of this section. Hu Mingxing, Liu election, Qiu Rongbang, Austrian Chen Ding Ran. This part of the standard replaces the previous editions are. --- GB/T 18290.4-2000.

Introduction

In terms of solderless insulation displacement connection by the GB/T 18290 of the following two parts. --- Part 3. Solderless accessible insulation displacement connections - General requirements, test methods and guidelines; --- Part 4. Solderless non - accessible insulation displacement connections - General requirements, test methods and practical guidance. These include requirements, testing and use of guidance material. This section provides two test procedures. --- Basic test schedule. This section applies to meet all the requirements of the second part of the insulation displacement connection, these requirements are based on this even Successful experience using the access proposed; --- Comprehensive test schedule. for not fully meet the second part of this part of the insulation displacement connection all the requirements, for example In the second There are no provisions in the manufacture of the materials used or the surface coating. The principle of using these two test procedures are. taking into account the cost and time for the non-contact established solderless insulation displacement connection Effective performance verification, using the basic test schedule limited; requirements for performance verification in a larger range, the use of extended surface completely Test schedule. Note. In this section, the term "insulation displacement" is abbreviated as "ID", such as "ID connection" "ID terminations." Figure 1 may contact and non-contact insulation displacement connection example IEC Guide 109.1995 to promote products to reduce the impact on the natural environment in the product life cycle. This section allowed the use of some materials may have a negative impact on the environment. In order to guide technically replace these materials, which will disappear in this section. Solderless connections - Part 4. Solderless non - accessible insulation Displacement connections - General requirements, test methods and Guidelines for the use The first chapter General

1 Scope

This section GB/T 18290 applies to press the third test and measurement connection ID is untouchable, and this even Then it is. --- Design appropriate ID terminations; --- Having a solid round conductor (nominal diameter of 0.25mm ~ 3.6mm) wire; --- Having a stranded conductor (cross-section of 0.05mm2 ~ 10mm2) wire. This connection is used for communication devices and similar electronic equipment technology. Further, in order to obtain a stable electrical connection under specified environmental conditions, in addition to the test procedure, this section also provides the industry from making Some experience with the reality of data. Objective 2 The purpose of this section is. --- Determine the applicability of non-contact ID connections under specified mechanical, electrical and atmospheric conditions; --- When the tool is used to connect the design or process is not the same, there is provided a method comparable test results. In use ID terminations have different structures and materials. In this regard, only the provisions of the basic parameters of the terminations, as well as require all aspects Details Particular requirements and complete the wire connections.

3 Normative References

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 2421.1-2008 Environmental testing for electric and electronic products overview and guidance (IEC 6068-1. 1988, IDT) GB/T 4210-2001 Electrotechnical terminology Electromechanical components for electronic equipment (idt IEC 60050 (581). 1978) GB/T 5095.1-1997 electronic equipment - Basic testing procedures and measuring methods - Electromechanical components - Part 1. General (idt IEC 60512-1.1994) GB/T 5095.2-1997 electronic equipment - Basic testing procedures and measuring methods - Electromechanical components - Part 2. General examination, electrical Continuity and contact resistance tests, insulation tests and voltage stress test (idt IEC 60512-2. 1985) GB/T 5095.4-1997 electronic equipment - Basic testing procedures and measuring methods - Electromechanical components - Part 4. Dynamic stress test Test (idt IEC 60512-4. 1976) GB/T 5095.5-1997 electronic equipment - Basic testing procedures and measuring methods - Electromechanical components - Part 5. Impact tests (from By the member), static load tests (fixed components), endurance tests and overload tests (idt IEC 60512-5.1992) GB/T 5095.6-1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6. Climatic tests and

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