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www.ChineseStandard.net Database: 189760 (18 Oct 2025)

GB/T 9491-2021 English PDF

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GB/T 9491-2021: Flux for tin soldering
Status: Valid

GB/T 9491: Evolution and historical versions

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 9491-2021English539 Add to Cart 5 days [Need to translate] Flux for tin soldering Valid GB/T 9491-2021
GB/T 9491-2002English599 Add to Cart 3 days [Need to translate] Liquid flux for soldering (Rosin base) Obsolete GB/T 9491-2002
GB 9491-1988English439 Add to Cart 4 days [Need to translate] Liquid flux for soldering Obsolete GB 9491-1988

PDF similar to GB/T 9491-2021


Standard similar to GB/T 9491-2021

GB/T 12631   GB/T 4725   GB/T 4721   

Basic data

Standard ID GB/T 9491-2021 (GB/T9491-2021)
Description (Translated English) Flux for tin soldering
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L30
Word Count Estimation 28,275
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 9491-2021: Flux for tin soldering

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Flux for tin soldering ICS 31:180 L30 National Standards of People's Republic of China Replacing GB/T 9491-2002 Soldering Flux Published on 2021-12-31 2022-07-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Category 1 5 Technical Requirements 3 6 Test method 5 7 Inspection rules 22 8 Packaging, labelling, transport and storage 23

foreword

This standard was drafted in accordance with the rules given in GB/T 1:1-2009: This standard replaces GB/T 9491-2002 "Liquid Flux for Soldering (Rosin Type)": Compared with GB/T 9491-2002, except for editorial The main technical changes outside the modification are as follows: ---Added the classification of flux, such as rosin type, resin type, organic type, inorganic type, and classified liquid (L), solid state by form (S), paste (P) (see Chapter 4, Chapter 3 of the:2002 edition); --- Increased requirements and test methods for viscosity (see 5:4, 6:5); --- Increased requirements and test methods for electrochemical migration (ECM) (see 5:13, 6:14); --- Increased the requirements and test methods for ion residues on PCB boards (see 5:15, 6:16); --- Increased splash requirements and test methods (see 5:16, 6:17); --- Delete the mold growth requirements and test methods (see 5:13 of the:2002 edition): Please note that some content of this document may involve patents, and the issuing authority of this document does not assume responsibility for identifying these patents: This standard is proposed by the Ministry of Industry and Information Technology of the People's Republic of China: This standard is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47): This standard was drafted by: Institute of Electronic Industry Standardization of the Ministry of Industry and Information Technology, Shenzhen Weiteou New Materials Co:, Ltd:, Beijing Jingchao Bohang Technology Co:, Ltd:, Shenzhen Tongfang Electronic New Material Co:, Ltd:, Guangdong Zhongshi Metal Co:, Ltd:, Dongguan Yongan Technology Co:, Ltd: Company, Kunshan Chengli Soldering Manufacturing Co:, Ltd:, Shenzhen Shanghuang Industrial Co:, Ltd:, Beijing Electronic and Electrical Association, Beijing Xinli Machinery Co:, Ltd: limited liability company: The main drafters of this standard: Liu Yun, Zhang Mingling, Zhang Li, Wang Xiang, Tang Xin, Yang Jiaji, Meng Zhaohui, Xiao Dehua, Fang Xibo, Liang Jingshan, Wu Guoqi, Su Chuanmeng, Hu Yu, Sun Yuxin, Zhao Yongjiang, Ding Fei: The previous editions of the standard replaced by this standard are as follows: ---GB/T 9491-2002: Soldering Flux

1 Scope

This standard specifies the classification, technical requirements, test methods, inspection rules and identification, packaging, transportation and storage of soldering fluxes: This standard applies to soldering flux for electronic products:

2 Normative references

The following documents are essential for the application of this document: For dated references, only the dated version applies to this article pieces: For undated references, the latest edition (including all amendments) applies to this document: GB/T 2040-2017 Copper and copper alloy sheet GB/T 2828:1-2012 Counting Sampling Inspection Procedures Part 1: Lot-by-Lot Inspection Sampling Retrieved by Acceptance Quality Limit (AQL) plan GB/T 2829-2002 Periodic Inspection Counting Sampling Procedure and Table (Applicable to Inspection of Process Stability) GB/T 3131-2020 Tin-lead solder GB/T 4677-2002 Test methods for printed boards GB/T 8145-2003 Gum Rosin

3 Terms and Definitions

The following terms and definitions apply to this document: 3:1 Spreadrate Wetting and spreading characteristics of solder under the action of flux: 3:2 electrochemicalmigration; ECM The phenomenon that the residual ions on the board surface move directionally under the action of an electric field after flux soldering:

4 categories

4:1 Morphological classification Soldering fluxes are divided into: liquid (L), solid (S) and paste (P) according to the form: 4:2 Activity classification See Table 1 for the activity classification of soldering fluxes:

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Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 9491-2021 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.