GB/T 17473.7-2022 (GB/T 17473.7-2008) PDF EnglishUS$70.00 · In stock · Download in 9 seconds
GB/T 17473.7-2008: Test methods of precious metals pastes used for microelectronics -- Determination of solderability and solderelaching resistance Delivery: 9 seconds. True-PDF full-copy in English & invoice will be downloaded + auto-delivered via email. See step-by-step procedure Status: Obsolete GB/T 17473.7: Historical versions
Similar standardsGB/T 17473.7-2008: Test methods of precious metals pastes used for microelectronics -- Determination of solderability and solderelaching resistance---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT17473.7-2008 GB NATIONAL STANDARD OF THE PEOPLE’S REPUBLIC OF CHINA ICS 77.120.99 H 68 Replacing GB/T 17473.7-1998 Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance [should be. solderleaching] Issued on: MARCH 31, 2008 Implemented on: SEPTEMBER 01, 2008 Issued by. General Administration of Quality Supervision, Inspection and Quarantine of PRC; Standardization Administration of PRC. Table of ContentsForeword... 3 1 Scope... 5 2 Method principle... 5 3 Material... 5 4 Instruments and equipment... 6 5 Measurement procedure... 6 6 Description of measurement results... 7 7 Test report... 8ForewordThis standard is an integrated revision of GB/T 17473-1998 " Test methods of precious metal pastes used for thick film microelectronics" (all parts). It is divided into 7 parts. - GB/T 17473.1-2008 Test methods of precious metals pastes used for microelectronics - Determination of solids content; - GB/T 17473.2-2008 Test methods of precious metals pastes used for microelectronics - Determination of fineness; - GB/T 17473.3-2008 Test methods of precious metals pastes used for microelectronics - Determination of sheet resistance; - GB/T 174743.4-2008 Test methods of precious metals pastes used for microelectronics - Determination of adhesion; - GB/T 174743.5-2008 Test methods of pastes used for microelectronics - Determination of viscosity; - GB/T 174743.6-2008 Test methods of precious metal pastes used for microelectronics - Determination of resolution; - GB/T 174743.7-2008 Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderleaching resistance. This Part is Part 7 of GB/T 17473-2008. This part replaces GB/T 17473.7-1998 "Test methods of precious metal pastes used for thick film microelectronics - Determination of solderability and solderleaching resistance". Compared with GB/T 17473.7-1998, this Part mainly has the following changes. - In the Scope, DELETE the content that "the non-precious metal weldable pastes can also be implemented with reference to this standard"; - CHANGE the original standard name into "Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderleaching resistance"; - CHANGE the "Thick film tunnel sintering furnace, which has a temperature range from room temperature to 1000 °C" in the original standard into "Thick film tunnel sintering furnace, which has a highest use temperature of 1000 °C AND a control accuracy of ±5 °C"; Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderleaching resistance1 ScopeThis standard specifies the method for determining the solderability and solderleaching resistance of precious metal solder pastes, which are used in microelectronics technology. This standard is applicable to the determination of solderability and solderleaching resistance of precious metal solderable pastes, which are used in microelectronics technology.2 Method principleAccording to the degree of immersion saturation of the molten solder on the conductor film, the solderability can be determined visually, through a magnifying glass. According to the change of the area, before and after the metal conductor film is etched in the molten solder, the solderleaching resistance is determined by visual inspection, through a magnifying glass.3 Material3.1 Substrate. Alumina substrate, which has a purity of not less than 95%, AND a surface roughness of 0.5 μm ~ 1.5 μm (measured at a measuring distance of 10 mm). 3.2 Solder. HLSn60PbA or HLSn60PbB solder and lead-free solder SnAg3.0Cu0.5. 3.3 Flux. Rosin alcohol solution, which has a mass concentration of 0.15 g/mL ~ 0.3 g/mL. 3.4 Solder cleaning agent. Ethanol. 5.5.8 Under a magnifying glass, observe the conductor film of the printed pattern on the solder-impregnated substrate. 5.6 Solderleaching test 5.6.1 Determine the solder temperature, based on the melting temperature of the solder. 5.6.2 The solder test is carried out, in accordance with the operating steps 5.5.1 ~ 5.5.6 and 5.5.8. 5.6.3 Determine the immersion time, according to different pastes. 5.6.4 Under the magnifying glass, observe the condition of the conductor film of the printed pattern on the substrate receiving the solder.6 Description of measurement results6.1 Solderability 6.1.1 When observed under a magnifying glass, if the area of the printed pattern conductive film on the substrate, that accepts solder, is not less than 9/10 of the pattern area, THEN the solderability is good; if it is less than 9/10, the solderability is poor. 6.1.2 If the printed pattern on the substrate has 1/10 of the unsoldered area, the solderability is poor. 6.1.3 If a specimen with poor weldability appears in a batch of specimens, take the double quantity of samples for test again, to repeat the operations 5.5.1 ~ 5.5.8.If there is no situation of 6.1.2 occurred on the specimen, the solderability is good; if there is one specimen with poor solderability in the double quantity of specimens, this batch of specimens are poor in solderability. 6.2 Solderleaching 6.2.1 When observed under a magnifying glass, if the area of the printed pattern conductive film on the substrate, that accepts solder, is not less than 9/10 of the pattern area, THEN the solderleaching is good; if it is less than 9/10, the solderleaching is poor. 6.2.2 If the printed pattern on the substrate has 1/10 of the unsoldered area, the solderleaching is poor. 6.2.3 If a specimen with poor solderleaching appears in a batch of specimens, take the double quantity of samples for test again, to repeat the operations 5.6.1 ~ 5.6.4.If there is no situation of 6.2.2 occurred on the specimen, the ......Source: Above contents are excerpted from the full-copy PDF -- translated/reviewed by: www.ChineseStandard.net / Wayne Zheng et al. |
