YS/T 893-2013 English PDFUS$239.00 ยท In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. YS/T 893-2013: High-purity sputtering titanium target used in electronic film Status: Valid
Basic dataStandard ID: YS/T 893-2013 (YS/T893-2013)Description (Translated English): High-purity sputtering titanium target used in electronic film Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended) Classification of Chinese Standard: H64 Classification of International Standard: 77.150.50 Word Count Estimation: 9,967 Quoted Standard: GB/T 1031; GB/T 4698.7; GB/T 4698.14; GB/T 4698.15; GB/T 6394; GJB 1580A; YS/T 837; YS/T 891; YS/T 892 Regulation (derived from): Ministry of Industry and Information Technology Bulletin No. 52, 2013; industry standard for filing Notice No. 1 of 2014 (No. 169 overall) Issuing agency(ies): Ministry of Industry and Information Technology Summary: This standard specifies the electronic film sputtering target with a high titanium requirements, test methods, inspection rules and signs, packaging, transportation, storage and quality certificates and contracts (orders) and so on. This standard applies YS/T 893-2013: High-purity sputtering titanium target used in electronic film---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.High-purity sputtering titanium target used in electronic film ICS 77.150.50 H64 People's Republic of China Nonferrous Metals Industry Standard Electronic film with high titanium sputtering target Issued on. 2013-10-17 2014-03-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released ForewordThis standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard by the National Standardization Technical Committee Nonferrous Metals (SAC/TC243) centralized. This standard was drafted. Yes REVIEW billion of the new Materials Co., Ltd., Ningbo Jiang Feng Electronic Materials Co., Ltd. The main drafters of this standard. He Jinjiang, Dong Ting Yi, Flaw, Luo Junfeng, Teng Haitao, Yu Jie, He Xin, money Hongbing, Chen Zhou, Liu Dan, Luling Zhi, Wang Xueze, Xiong. Electronic film with high titanium sputtering target1 ScopeThis standard specifies the electronic film was highly pure titanium sputtering target requirements, test methods, inspection rules and signs, packaging, transportation, storage and Quality certification and contract (order) and so on. This standard applies to all types of titanium sputtering targets used in the manufacture of electronic film.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 1031 Geometrical product specifications (GPS) Surface texture Profile method Surface roughness parameters and their values GB/sponge titanium, titanium and titanium alloys - oxygen, nitrogen determination of T 4698.7 GB/T 4698.14 Sponge titanium, titanium and titanium alloys - Determination of carbon contents Determination of GB/T 4698.15 Sponge titanium, titanium and titanium alloys the amount of hydrogen GB/T 6394 Determination of average grain size of metal GJB1580A deformation of the metal ultrasonic inspection method YS/T 837 sputtering targets - back binding quality ultrasonic inspection Determination glow YS/T 891 high titanium chemical analysis of trace elements in the discharge mass spectrometry Inductively coupled plasma mass spectrometry YS/T 892 high titanium chemical analysis of trace elements3 Terms and DefinitionsThe following terms and definitions apply to this document. 3.1 Target target In sputter deposition techniques cathode portion. The cathode material is positively charged cations Struck with molecules, atoms or ions form Formula from the cathode and the anode surface deposition. 3.2 Target blanks targetblank Used as a cathode sputtering material part. 3.3 Backplane backingplate For supporting or part of a fixed target. Backplane can target blanks by welding (such as brazing, diffusion bonding, etc.), mechanical composite, bonding and other parties Connection.4 Requirements4.1 Categories 4.1.1 According to the structure and form into a composite of the two monomers, shown in Figure 1. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of YS/T 893-2013_English be delivered?Answer: Upon your order, we will start to translate YS/T 893-2013_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. 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