YS/T 24-2016 English PDFUS$179.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. YS/T 24-2016: Test methods for spike of epitaxial layers YS/T 24: Historical versions
Basic dataStandard ID: YS/T 24-2016 (YS/T24-2016)Description (Translated English): Test methods for spike of epitaxial layers Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended) Classification of Chinese Standard: H21 Classification of International Standard: 29.045 Word Count Estimation: 5,542 Date of Issue: 2016-04-05 Date of Implementation: 2016-09-01 Older Standard (superseded by this standard): YS/T 24-1992 Regulation (derived from): The Ministry of Industry and Notice No. 2016 in 2016; the industry standard for the record 2016 No. 6 Issuing agency(ies): Ministry of Industry and Information Technology YS/T 24-2016: Test methods for spike of epitaxial layers---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.Test methods for spike of epitaxial layers ICS 77.040 H21 People's Republic of China Nonferrous Metals Industry Standard Replacing YS/T 24-1992 Test Method for Defects of Epitaxial Nails 2016-04-05 release 2016-09-01 implementation Issued by the Ministry of Industry and Information Technology of the People's Republic of China ForewordThis standard is drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces YS/T 24-1992 "Inspection method for extension nail defects". Compared with YS/T 24-1992, this standard changes mainly as follows. - Added "normative reference documents" and "terms and definitions"; --- Added "Method 2 lossless test". This standard is proposed by the National Committee for Standardization of Nonferrous Metals (SAC/TC243). The drafting of this standard unit. Nanjing Guosheng Electronics Co., Ltd., research semiconductor materials Co., Ltd., Shanghai Crystal Union Silicon Materials Co., Ltd. The main drafters of this standard. Ma Linbao, Yang Fan, Sun Yan, Xu Xinhua. This standard replaced the previous version of the standard release. --- YS/T 24-1992. Test Method for Defects of Epitaxial Nails1 ScopeThis standard specifies the inspection method for the extension of the nail defect. This standard applies to determine whether there is a nail defect with a height of not less than 4 mm on the silicon epitaxial wafer. If the number of nail defects is relatively small and he This is not connected, the nail defect can be counted. This standard can not measure the height of nail defects.2 normative reference documentsThe following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article Pieces. For undated references, the latest edition (including all modifications) applies to this document. GB/T 14264 terminology for semiconductor materials3 terms and definitionsGB/T 14264 The definitions and definitions of the following terms and definitions apply to this document. 3.1 Nail defect spikes The surface protrusions formed during epitaxial growth are usually due to the surface of the substrate leading to the epitaxial silicon protrusions. 4 Method 1 Lossy test 4.1 Method Summary Damage test is a polyester plastic film in three different directions pushed through the test surface, in two or more than the direction of the table The surface protrusions were judged to be nail defects. 4.2 Materials 4.2.1 Vacuum suction device or tweezers. 4.2.2 Polyester plastic film, the thickness of 25mm, an area of 50mm × 50mm. 4.3 Test procedure 4.3.1 With the vacuum suction device to suck the back of the sample, or with tweezers to hold the sample, for arbitration detection, the test extension can also face up On the clean surface. 4.3.2 The thumb and index finger clamp the polyester plastic film so that the film extends about 25 mm under the thumb and is inclined at 45 ° to the specimen surface. 4.3.3 face to face in the main reference, the polyester plastic film and the sample contact, as shown in Figure 1. ...... |
