| Standard ID | YS/T 1637-2023 (YS/T1637-2023) |
| Description (Translated English) | (Fine tin-based alloy solder powder) |
| Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) |
| Classification of Chinese Standard | H62 |
| Classification of International Standard | 77.150.60 |
| Word Count Estimation | 9,918 |
| Date of Issue | 2023-12-20 |
| Date of Implementation | 2024-07-01 |
| Summary | This standard specifies the classification and labeling, technical requirements, test methods, inspection rules, marking, packaging, packaging, transportation, storage and accompanying documents and order form content of fine tin-based alloy solder powder. This standard applies to fine tin-based alloy solder powder for electronic packaging and electronic circuit interconnection. |