SJ/T 11200-2016 English PDF

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SJ/T 11200-2016: (Environmental testing Part 2-58: Tests - Test Td: surface mount components solderability, dissolution of metallization layers and resistance to soldering heat resistance test method)
Status: Valid

SJ/T 11200: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
SJ/T 11200-2016	459	Add to Cart	4 days	(Environmental testing Part 2-58: Tests - Test Td: surface mount components solderability, dissolution of metallization layers and resistance to soldering heat resistance test method)	Valid
SJ/T 11200-1999	519	Add to Cart	3 days	Environmental testing. Part 2: Tests Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices	Obsolete

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GB/T 14092.2   GB/T 14092.1   GB/T 14522   

Basic data

Standard ID: SJ/T 11200-2016 (SJ/T11200-2016)
Description (Translated English): (Environmental testing Part 2-58: Tests - Test Td: surface mount components solderability, dissolution of metallization layers and resistance to soldering heat resistance test method)
Sector / Industry: Electronics Industry Standard (Recommended)
Classification of Chinese Standard: A21
Classification of International Standard: 19.040
Word Count Estimation: 20,221
Date of Issue: 2016-04-05
Date of Implementation: 2016-09-01
Older Standard (superseded by this standard): SJ/T 11200-1999
Adopted Standard: IEC 60068-2-58:2004, MOD
Regulation (derived from): The Ministry of Industry and Notice No. 2016 in 2016; industry standard record announcement 2016 No. 7 (total 199)
Issuing agency(ies): Ministry of Industry and Information Technology
Summary: This standard applies to surface-assembled components and provides standard test methods for solderability of lead-free solder, eutectic or near-eutectic tin-lead solder, corrosion resistance of metallized layers, and solder heat resistance. It is specified that when the solder bath method is not applicable, the test is performed by reflow soldering.

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