GB/T 5226.33-2017 English PDF

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GB/T 5226.33-2017: Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
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Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 5226.33-2017	1919	Add to Cart	8 days	Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment	Valid

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GB/T 12265   GB/T 5226.1   GB/T 8196   GB/T 5226.7   GB/T 5226.34   GB/T 5226.32   

Basic data

Standard ID: GB/T 5226.33-2017 (GB/T5226.33-2017)
Description (Translated English): Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: J09
Classification of International Standard: 29.020
Word Count Estimation: 96,917
Date of Issue: 2017-10-14
Date of Implementation: 2018-05-01
Quoted Standard: GB/T 4025-2010; GB/T 4026-2010; GB/T 4205-2010; GB 4793.1-2007; GB/T 7974-2010; GB/T 12668.201-2013; GB/T 13002-2008; GB/T 16842-2016; GB/T 16895.5-2012; GB/T 16895.21-2011; GB/T 16895.23-2012; GB/T 18209.1-2010; GB/T 18216.3-2012; GB/T 19212.7-2012; GB 2
Adopted Standard: IEC 60204-33-2009, IDT
Regulation (derived from): National Standard Announcement 2017 No. 26
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies the semiconductor equipment manufacturing, measuring, assembly and testing of electrical, electronic and programmable electronic equipment and system safety requirements. This section refers to the device from the introduction of machinery and electrical power supply Department began (see 5.1) This Part applies to electrical equipment or electrical equipment components, the nominal voltage does not exceed 1000Va.c. Or 1500Vd.c., Rated frequency does not exceed 200 Hz. For higher voltages or frequencies, special requirements may be required. This section includes protective measures for electrical safety hazards and electrical interlock protection circuit for non-electrical safety hazards, but does not cover all the requirements for personal safety protection (such as chemical hazards, mechanical hazards, radiation harm)

GB/T 5226.33-2017: Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Electrical safety of machinery. Electrical equipment of machines. Part 33. Requirements for semiconductor fabrication equipment ICS 29.020 J09 National Standards of People's Republic of China Mechanical Electrical Safety Mechanical Electrical Equipment Part 33. Technical specifications for semiconductor equipment Part 33.Requirementsforsemiconductorfabricationequipment (IEC 60204-33.2009, Safety of manufacturing-Electric appliance equipment-machinery- Part 33.Requirementsforsemiconductorfabricationequipment, IDT) 2017-10-14 Published 2018-05-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released Directory Introduction Ⅶ 1 Scope 1 2 Normative references 1 3 Terms and definitions 3 4 basic requirements 11 4.1 General principles 11 4.2 Selection of electrical equipment 11 4.3 Power Supply 11 4.4 The actual environment and operating conditions 12 4.5 Transportation and storage 12 4.6 equipment handling 12 4.7 Installation 12 5 Introduce the power cord termination method and disconnect switch 12 5.1 Introduction of the power cord termination method 12 5.2 Connect the terminal of the external protective earthing system 13 5.3 power cut off (isolation) switch 13 5.4 additional cutting device 15 5.5 Protection from unauthorized, negligent and wrong connections 15

6 electric shock protection

6.1 Overview 16 6.2 direct contact protection 16 6.3 Indirect contact protection 17 6.4 Protection with PELV 18 6.5 Prevent skilled workers and trainees from touching hazardous live parts 19 7 Protection of Electrical Equipment 19 7.1 Overview 19 7.2 Overcurrent protection 20 7.3 Motor overheating protection 22 7.4 motor speeding protection 22 7.5 Detection of abnormal temperature 23 7.6 Protection against interruption of power supply or subsequent restoration of voltage drop 23 7.7 Ground fault/residual current protection 23 7.8 Phase Sequence Protection 23 7.9 Lightning and Switch Surge Protection Overvoltage Protection 23 7.10 electrolytic capacitor 23 8 equipotential bonding 23 8.1 Overview 23 8.2 Protection circuit 25 8.3 Functional Linkages 27 8.4 Limit the impact of large leakage current measures 27 9 control circuit, emergency disconnect (EMO) and protection interlock circuit 27 9.1 Control Circuit 27 9.2 Emergency Disconnect (EMO) 28 9.3 Operations other than emergency disconnection 29 9.4 Interlocking protection 30 9.5 Suspension of safety functions and/or protective measures 31 10 control panel and control device 31 mounted on the machine 10.1 General Regulations 31 10.2 button 32 10.3 Indicators 33 10.4 Cursor buttons 34 10.5 Rotate the control device 34 10.6 Start Device 34 10.7 Emergency disconnect device 34 10.8 Emergency stop device 35 10.9 Enable Control Device 35 11 Control Equipment. Location, Installation and Electrical Cabinets 35 11.1 General requirements 35 11.2 Location and Installation 35 11.3 Degree of protection 36 11.4 Panel 36 12 conductor and cable 38 12.1 General requirements 38 12.2 Insulation 39 12.3 Current carrying capacity 39 12.4 Wire and Cable Voltage Drops 39 12.5 Flexible Cable 39 13 Wiring Technology 40 13.1 Connection and Cabling 40 13.2 Multi-Socket Assembly 42 13.3 Plug/Socket Assembly 42 13.4 Lead Identification 42 13.5 outside the cabinet wiring 43 13.6 Pipes, junction boxes and other junction boxes Motor and related equipment 46 14.1 General requirements 46 14.2 Remotely mounted motor 46 14.3 Motor Size 46 14.4 Motor Mounting and Compartment 46 15 Accessories and lighting 46 15.1 Annex 46 15.2 Local Lighting of Semiconductor Equipment 46 16 marks, warning signs and reference code 47 16.1 Overview 47 16.2 Shock hazard warning signs 47 16.3 Function Recognition 47 16.4 Equipment nameplate 48 16.5 Refer to code 48 Technical documents 48 17.1 General 48 17.2 Information provided 48 17.3 Requirements applicable to all documents 49 17.4 Installation Documents 49 17.5 Sketch Map and Function Chart 50 17.6 Circuit Diagram 50 17.7 Operating Documents 50 17.8 Repair Documents 50 18 Test 51 18.1 Overview 51 18.2 Ground Continuity and Protection Bonding Circuit Continuity Test 51 18.3 Test of contact current of integrated power cord 52 18.4 pressure test 52 18.5 Cable Pull Test 53 18.6 Short circuit test of electrical output 54 18.7 Interlock protection circuit function test 54 18.8 Storage capacitor discharge test (see 6.2.4) 54 18.9 Temperature Test 55 18.10 cabinet strength test; 30N stability test 55 18.11 Electrical cabinet strength test; 250N stability test 56 18.12 Finger test 56 18.13 Wire bending test 56 18.14 Insulation resistance test 57 18.15 EMO Functional Test 57 18.16 Input Current Test 57 18.17 Other safety circuit experiments 57 18.18 Motor Temperature Test 57 Appendix A (Normative) Basic protection in TN system (indirect contact protection) (from GB/T 16895.21-2011 And GB/T 16895.23-2012) 59 Appendix B (Normative) Protection of indirect contacts in TT systems (from GB/T 16895.21-2011 and GB/T 16895.23-2012) 62 Appendix C (Normative) Conductor current carrying capacity, clearance and creepage distance 64 Appendix D (Normative) Standard Trial Version 70 Appendix E (informative) system grounding type (cited from IEC 60364-1.2005) 72 References 86 Figure 1 Equipotential grounding electrical equipment example 24 Figure 2 front of the electrical enclosure space 38 Figure A.1 Typical configuration of faulty loop impedance measurement 61 Figure D.1 Rigid test finger 70 Figure D.2 Hinged test finger 71 Figure E.1 The overall system neutral and protective conductor is a separate TN-S system 73 Figure E.2 Entire system grounding conductor and protective conductor are separate TN-S systems 73 Figure E.3 TN-S System with Protective Earth Without Distribution Neutral Conductor Figure E.4 In a TN-CS three-phase, four-wire system, PEN is separated from N by somewhere in the installation 74 Figure E.5 In a three-phase, four-wire TN-CS system, the PEN is split into PE and N 75 at the incoming terminal Figure E.6 In a single-phase, two-wire TN-CS system, the PEN is split into PE and N 75 at the incoming terminal Figure E.7 TN-C system The whole system of neutral conductor and protective conductor 76 Figure E.8 TN-CS multi-supply system for protecting conductors and neutrals in electrical consumers 77 Figure E.9 TN Multi-Power System with Two-Phase or Three-Phase Load, Whole System with Conductor Protection and Without Centerline 78 Figure E.10 TT system with neutral and protective conductors separated throughout the installation 79 Figure E.11 TT system with a grounded protective conductor throughout the installation without centerline 79 Figure E.12 All exposed conductive parts are interconnected by a common ground protective conductor IT system 80 Figure E.13 IT System with Exposed Conductive Portions Grounded or Individually Grounded 80 Figure E.14 TN-S DC System 81 Figure E.15 TN-C DC System 82 Figure E.16 TN-CS DC System 83 Figure E.17 TT DC System 84 Figure E.18 IT DC System 85 Table 1 transformer thermal protection without over-current protection 21 Table 2 Transformer Overcurrent Protection with Thermal Protection 22 Table 3 button actuator color code and its meaning 32 Table 4 Button Symbol 33 Table 5 Indicator Colors and Their Meaning with respect to Semiconductor Device Status 34 Table 6 Acceptable temperature of electrical equipment components 55 Table A.1 TN system, the longest cut-off time 59 Table B.1 the longest cut-off time 63 Table C.1 conductor carrying capacity of AWG30-4, ambient temperature 30 ℃ 64 Table C.2 25mm2 ~ 600kcmil conductor carrying capacity, ambient temperature 30 ℃ 65 Table C.3 Derating Capacity (According to Table C.1 and Table C.2) 0.050mm2 ~ 4.00mm2 65 Table C.4 Ambient temperature correction factor 66 Table C.5 Uninsulated busbar size 66 Table C.6 Clearances and creepage distances at cleanroom class 1000 or lower 68 Table C.7 Printed Wiring Board (PWB) Creepage 68 Table C.8 Clearances and creepage distances 69 above cleanroom class 1000

Foreword

GB/T 5226 "mechanical and electrical safety mechanical and electrical equipment" to be divided into sections published, has released the following sections. --- Part 1. General technical conditions; --- Part 6. Construction machinery and technical conditions; --- Part 11. Technical conditions for high-voltage equipment with voltage higher than 1000Va.c. Or 1500Vd.c. But not exceeding 36kV; --- Part 31 - Special safety and electromagnetic compatibility requirements for sewing machines, sewing units and systems; --- Part 32. General technical requirements for lifting machinery; --- Part 33. Semiconductor equipment technical conditions. This section GB/T 5226 Part 33. This section drafted according to GB/T 1.1-2009 given rules. This section uses the translation method identical with IEC 60204-33.2009 "Mechanical safety machinery and electrical equipment Part 33. Semiconductor equipment Preparation of technical conditions "(1st edition, English version). The documents of our country that are consistent with the corresponding international documents that are normative references in this section are as follows. --- GB/T 156-2007 standard voltage (IEC 60038.2002, MOD) --- GB/T 4208-2017 Enclosure rating (IP code) (IEC 60529.2001, IDT) --- GB/T 4728 (all parts) Electrical diagrams with graphical symbols [IEC 60617 (all parts)] --- GB 4943.1-2011 Information technology equipment safety Part 1. General requirements (IEC 60950-1.2005, MOD) --- GB/T 5169.16-2008 Fire hazard testing for electrician and electronic products - Part 16. Test flame 50W level and vertical Straight flame test method (IEC 60695-11-10.2003, IDT) --- GB/T 5465 (all parts) Graphical symbols for electrical equipment [IEC 60417 (all parts)] --- GB/T 16855 (all parts) Mechanical safety control systems related to safety components [ISO 13849 (all parts)] --- GB/T 16855.1-2008 Safety of Machinery for Safety of Machinery-Part 1. Design Principles (ISO 13849- 1.2006, IDT) --- GB/T 18209 (All Parts) Mechanical Safety Instructions, Signs and Operations [IEC 61310 (All Parts)] --- GB/T 19212.1-2016 Safety of transformers, reactors, power supply units and combinations - Part 1. General requirements and tests Inspection (IEC 61558-1.2009, MOD) --- GB/T 19671-2005 mechanical safety two-hand control device functional status and design principles (ISO 13851.2002, MOD) --- GB/T 20438 (all parts) Functional safety of electrical/electronic/programmable electronic safety-related systems [IEC 61508 section)] This section made the following editorial changes. --- Standard name changed to "mechanical and electrical safety machinery and electrical equipment Part 33. Semiconductor equipment, technical conditions." This part is proposed by China Machinery Industry Federation. This part of the National Industrial Machinery Electrical System Standardization Technical Committee (SAC/TC231) centralized. This section is responsible for drafting unit. Semiconductor Devices (Shanghai) Co., Ltd.. This section participates in the drafting unit. Beijing Machine Tool Research Institute, Shanghai Microelectronics Equipment Co., Ltd., Beijing North Microelectronics Base Equipment Technology Research Center Co., Ltd., Shenyang Tuo Jing Technology Co., Ltd., Beijing Seven Star Huachuang Electronics Co., Ltd., Sheng photoelectric equipment Sea) Co., Ltd., Ideal Solar (Shanghai) Co., Ltd., Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. The main drafters of this section.Li Tianxiao, Huang Zuguang, Wang Haitao, Tian Bao Xia, Guo Heping, Shen Hong, Sun Dongxi, Pan Jufeng, Sun Yan, Liu Zhongwu, Zhang Zhiqiang, Li Zhong, Xue Ruijuan. Mechanical Electrical Safety Mechanical Electrical Equipment Part 33. Technical specifications for semiconductor equipment

1 Scope

This section GB/T 5226 specifies the manufacture, measurement, assembly and testing of semiconductor equipment related to electrical, electronic and programmable electronic Equipment and system safety requirements. Note 1. The term "electrical" in this section includes three aspects of electrical, electronic and programmable electronic equipment (such as electrical equipment refers to electrical equipment, electronic equipment and programmable Electronic equipment). NOTE 2 For the purposes of this standard, the term "Person" generally refers to any individual including the person assigned, used and managed by the user or his agent. The equipment referred to in this section starts from the power lead-in of mechanical and electrical equipment (see 5.1). Note 3. GB/T 16895 series of standards for building electrical installations are given. This section applies to electrical equipment or electrical equipment components, the nominal voltage does not exceed 1000Va.c. Or 1500Vd.c., rated frequency Not more than.200Hz. For higher voltages or frequencies, special requirements may be required. Note 4. Electrical equipment within the derived voltage exceeds the supply voltage limit is still within the scope of this section. This section includes protective measures for electrical safety hazards and electrical interlock protection circuit for non-electrical safety hazards, but does not cover All requirements for personal safety protection (such as chemical, mechanical and radiation hazards) as prescribed by other standards or regulations. Each type The machinery meets its specific requirements to provide adequate safety. The following electrical installations for semiconductor manufacturing equipment shall provide additional and special technical requirements. --- Use, processing or production of explosive materials; --- Used in flammable and explosive environment; --- There is a special risk when producing or using a material; --- As lifting machinery (included in IEC 60204-32). This section does not include semiconductor equipment performance or functional specifications. This section does not involve may have an impact on human health from Semiconductor equipment emissions (such as electromagnetic fields, noise). This section does not specify the electromagnetic compatibility (EMC) requirements.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this edition file. For undated references, the latest edition (including all amendments) applies to this document. GB/T 4025-2010 man-machine interface markings of the basic and safety rules Indicator and operating device coding rules (IEC 60073.2002, IDT) GB/T 4026-2010 man-machine interface signs the basic and safety rules Identification of equipment terminals and conductor terminals (IEC 60445.2006, IDT) GB/T 4205-2010 man-machine interface mark the basic rules and safety rules of operation (IEC 60447.2004, IDT) GB 4793.1-2007 Safety requirements for electrical equipment for measurement, control and laboratory use - Part 1. General requirements (IEC 61010- 1.2001, IDT) Basic and safety rules for marking of human machine interfaces - Conductor color or alphanumeric identification (IEC 60446). 2007, IDT) ......

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