GB/T 4588.4-2017 English PDF

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GB/T 4588.4-2017: Sectional specification for rigid multilayer printed boards
Status: Valid

GB/T 4588.4: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 4588.4-2017	839	Add to Cart	7 days	Sectional specification for rigid multilayer printed boards	Valid
GB/T 4588.4-1996	959	Add to Cart	4 days	Sectional specification. Multilayer printed boards	Obsolete
GB 4588.4-1988	759	Add to Cart	5 days	Specification for multilayer printed boards	Obsolete

Similar standards

GB/T 12631   GB/T 4725   GB/T 4721   

Basic data

Standard ID: GB/T 4588.4-2017 (GB/T4588.4-2017)
Description (Translated English): Sectional specification for rigid multilayer printed boards
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Classification of International Standard: 31.180
Word Count Estimation: 42,413
Date of Issue: 2017-07-31
Date of Implementation: 2018-02-01
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 4588.4-2017: Sectional specification for rigid multilayer printed boards

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Sectional specification for rigid multilayer printed boards ICS 31.180 L30 National Standards of People's Republic of China Replacing GB/T 4588.4-1996 Rigid multilayer printed board sub-standard 2017-07-31 Posted 2018-02-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released Directory Foreword Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 application level 2 5 test methods and requirements 2 5.1 General 2 5.2 Priority 2 5.3 Materials 2 5.4 Design 3 5.5 Appearance and size 3 5.6 Structural Integrity 8 5.7 Chemical Properties 18 5.8 Physical Properties 19 5.9 Electrical Properties 20 5.10 Environmental Adaptability 21 5.11 Other requirements 22 6 Quality Assurance Regulations 22 6.1 General rules 22 6.2 test conditions 22 6.3 Capacity Approval 22 6.4 Identification and approval 22 6.5 Quality consistency test 27 7 Delivery Requirements 32 Appendix A (Normative) Crack definition 33 Appendix B (Normative) Copper coating tensile strength and elongation 34

Foreword

GB/T 4588 has released or plans to release the following section. --- GB/T 4588.1 non-metallic hole single-sided PCB sub-standard; --- GB/T 4588.2 metal double-sided single-sided printed circuit board sub-standard; --- GB/T 4588.3 printed circuit board design and use; --- GB/T 4588.4 rigid multilayer printed circuit board sub-norms; --- GB/T 4588.10 has rigidly rigid double-sided printed circuit board through the connection points specification; --- GB/T 4588.12 prefabricated inner laminate standard (half-made multilayer printed circuit board). This section GB/T 4588 Part 4. This section is GB/T 16261 "Printed Board General Regulations" sub-standard, with the formation of a series of norms of norms. This section drafted in accordance with GB/T 1.1-2009 given rules. This Part replaces GB/T 4588.4-1996 "Multilayer PCB sub-standard", compared with GB/T 4588.4-1996 In addition to editorial changes The main technical changes are as follows. --- Name changed to "rigid multilayer printed circuit board sub-standard"; --- Modify the scope of a chapter (see Chapter 1,.1996 edition of 1.1); --- Normative references have been updated (see Chapter 2,.1996 edition 1.2); --- Added terms and definitions (see Chapter 3); --- Increased printed circuit board performance level (see Chapter 4); --- Added "priority" (see 5.2); --- Increasing the use of PCB materials, repeatable, recyclable or environmentally friendly materials requirements (see 5.3); --- Increasing the design requirements (see 5.4); --- Modify the.1996 version of the form (Table Ⅰ) describes the requirements of the form, the form gives the form of appearance, size, material Reasonable, structural integrity, electrical properties, environmental performance and other aspects of the requirements, and based on the three performance levels were asked (see 5.5 ~ 5.11, Chapter 5 of the.1996 edition); --- Increasing the thermal stress test conditions, test conditions 288 ℃ ± 5 ℃, 10 1 0s, 1 time (see 5.6.1); --- Modify the.1996 version of the quality of consistency test grouping test (divided into A group, B group, C group, D group test), updated to the Batch inspection and periodic inspection (see 6.5.2 and 6.3.3, chapter.1996 of the.1996 edition); --- Remove the.1996 edition of the table III mentioned in the number of allowable failures, in accordance with the new version of GB/T 16261-2017 "PCB General Specifications" Refine the sampling plan; --- Deleted in.1996 version 8.4 is no longer applicable test attachment test graphics; --- Added "quality assurance regulations" (see Chapter 6); --- Added "delivery requirements" (see Chapter 7). Please note that some of this document may be patentable. The issuing agencies of this document do not bear the responsibility of identifying these patents. This part is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part of the National Standardization Technical Committee printed circuit board (SAC/TC47) centralized. This part of the main drafting unit. Shennan Circuit Co., Ltd.. The main drafters of this section. Dai Jiong, Du Yufang, Wu Lei, Xing Guogang. This part replaces the standards previously issued as. --- GB/T 4588.4-1988, GB/T 4588.4-1996. Rigid multilayer printed board sub-standard

1 Scope

GB/T 4588 provisions of this part of rigid multilayer printed circuit board performance requirements, quality assurance requirements and delivery requirements. This section applies to a rigid plated (with or without blind holes or buried holes) rigid multilayer (3 or more conductive layer) PCB, but does not apply to Aerospace and aviation with rigid plates.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. Printed circuit terminology GB/T 2036 GB/T 4588.3 PCB design and use Printed board test methods GB/T 4725 Printed Circuit Copper-clad Epoxy Glass Cloth Laminate GB/T 5230 electrolytic copper foil General specification for printed boards GJB360B -.2009 Test Methods for Electronic and Electrical Components SJ/T 10309 PCB with solder mask SJ/T 11050 multi-layer PCB with epoxy glass fiber cloth prepreg adhesive sheet SJ20810 PCB dimensions and tolerances SJ20828-2002 conformity identification with the test pattern and layout of the general plan

3 Terms and definitions

GB/T 2036 and defined by the following terms and definitions apply to this document. 3.1 Crack cracking The coating layer and the coating layer are cracked or separated and extended to the surface of the bottom layer. The drawings of the cracks are shown in Appendix A. 3.2 Rectangle pad intact area pristineareaofrectangularsurfacemountland 80% of the center width of the pad is multiplied by 80% of the length. 3.3 Round pad intact area pristineareaofroundsurfacemountland The center of the pad diameter, the pad diameter within 80% of the range. 3.4 Laminate evaluation zone evaluatedzoneofthelaminateboard The area between adjacent heated zones in the laminate. ......

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