GB/T 4721-2021 English PDF

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GB/T 4721-2021: General rules for rigid copper clad laminates for printed circuits
Status: Valid

GB/T 4721: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 4721-2021	339	Add to Cart	3 days	General rules for rigid copper clad laminates for printed circuits	Valid
GB/T 4721-1992	359	Add to Cart	3 days	General rules for copper-clad laminated sheets for printed circuits	Obsolete

Similar standards

GB/T 12631   GB/T 4725   GB/T 4722   

Basic data

Standard ID: GB/T 4721-2021 (GB/T4721-2021)
Description (Translated English): General rules for rigid copper clad laminates for printed circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Word Count Estimation: 18,116
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 4721-2021: General rules for rigid copper clad laminates for printed circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
General rules for rigid copper clad laminates for printed circuits ICS 31.180 CCSL30 National Standards of People's Republic of China Replace GB/T 4721-1992 General rules for rigid copper clad laminates for printed circuits Released on 2021-11-26 2022-06-01 implementation State Administration for Market Regulation Issued by the National Standardization Management Committee

Table of contents

Foreword Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 Model, naming and marking 2 4.1 Model 2 4.2 Naming 2 4.3 Identification 2 5 Material 4 5.1 Copper foil 4 5.2 Reinforcing fiber 4 5.3 Resin system 4 6 Requirements 4 6.1 General requirements 4 6.2 Appearance 5 6.3 Size 6 6.4 Flammability class 8 6.5 Performance requirements 8 7 Test method 9 8 Quality Assurance 9 8.1 Inspection classification 9 8.2 Appraisal and inspection 9 8.3 Quality consistency inspection 11 8.4 Certificate of conformity 12 8.5 Material Safety Data Sheet (MSDS) 12 9 Packaging, marking, transportation and storage 12 9.1 Sign 12 9.2 Packaging, transportation and storage 12 10 Ordering documents 12 Appendix A (informative) Corresponding table of copper clad laminate model 13

Foreword

This document was drafted in accordance with GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents". This document replaces GB/T 4721-1992 "General Rules for Copper Clad Laminates for Printed Circuits", compared with GB/T 4721-1992, In addition to structural adjustments and editorial changes, the main technical changes are as follows. a) The scope of the regulations has been changed (see Chapter 1, Chapter 1 of the.1992 edition); b) The normative references have been changed (see Chapter 2, Chapter 2 of the.1992 edition); c) The terms "copper-clad surface", "adhesive surface" and "laminated surface" have been deleted (see 3.1, 3.2, 3.3 of the.1992 edition); d) The definition of the terms "cellulose paper", "whole board" and "cutting board" has been added (see 3.1, 3.4, 3.5); e) The content of the model representation method has been added. The representation methods of three resins such as cyanate ester, polyphenylene ether and polyester are CE, PO, PE (see 4.1.2); f) Added the representation method of QC quartz fiber cloth and PC polyester fiber fabric (see 4.1.3); g) Added product identification system (see 4.3.1); h) The requirements for reinforcing fiber and resin system have been added (see 5.2, 5.3); i) The appearance requirements and thickness and tolerances have been changed (see 6.2, 6.3.4, Chapter 6 and 7.2 of the.1992 edition); j) The recommended size of the copper clad laminate has been changed (see 6.3.1, 7.1 of the.1992 edition); k) The requirements for the length and width deviation of the shear plate have been added (see 6.3.2); l) Inapplicable test items such as "surface corrosion", "edge corrosion", "peel strength after simulated electroplating" and "peel strength after dry heat" have been deleted Items (see Table 8 of the.1992 edition); m) Added regulations for the classification of combustibility (see 6.4); n) The machinability is changed, and it is now specified in the applicable copper clad laminate sub-specification (see 6.5, Chapter 9 of the.1992 edition); o) Changed the name of "Inspection Rules" to "Quality Assurance" and adjusted the position (see Chapter 8, Chapter 10 of the.1992 edition); p) Added "dimensional stability", "glass transition temperature", "Z-axis expansion coefficient", "thermal decomposition temperature", "thermal stratification time", "heat resistance" and "phase Test items such as specific tracking index, "halogen content", and "thermal conductivity" (see Table 10); q) The storage conditions of copper clad laminates have been changed (see Chapter 9.2, Chapter 11 of the.1992 edition); r) Added the requirements for order information (see Chapter 10); s) Modified the model correspondence table in Appendix A, deleted 7 inapplicable models, and added 14 models according to market demand (see table A.1, Table A1) of the.1992 edition. Please note that some of the contents of this document may involve patents. The issuing agency of this document is not responsible for identifying patents. This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47). Drafting organizations of this document. Guangdong Shengyi Technology Co., Ltd., National Electronic Circuit Base Material Engineering Technology Research Center, Suzhou Shengyi Branch Technology Co., Ltd., Shaanxi Shengyi Technology Co., Ltd. The main drafters of this document. Su Xiaosheng, Yang Zhongqiang, Cai Qiaoer, Yang Yan, Liu Shenxing, Wang Jinrui, Luo Penghui, Wang Airong. The previous releases of this document and the documents it replaced are as follows. ---First released as GB 4721-1984 in 1984; --- The first revision in.1992 changed the mandatory national standard to the recommended national standard, and the degree of consistency with the international standard was not Equivalent; ---This is the second revision and does not adopt international standards. General rules for rigid copper clad laminates for printed circuits

1 Scope

This document specifies the terms and definitions, classification and model, naming and marking of rigid copper clad laminates, as well as materials, appearance, dimensions, and quality. Common requirements such as quantity assurance, packaging, marking, transportation and storage. This document applies to rigid copper clad laminates for printed circuits (hereinafter referred to as copper clad laminates). This document does not apply to special copper clad laminates such as metal base and ceramic base.

2 Normative references

The content of the following documents constitutes an indispensable clause of this document through normative references in the text. Among them, dated quotations Only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to This document. GB/T 1913.2 Bleached wood pulp paper for printed boards GB/T 2036 Terminology for Printed Circuits GB/T 4722-2017 Test method for rigid copper clad laminates for printed circuits GB/T 5230 Electrolytic copper foil for printed boards GB/T 18373 E glass fiber cloth for printed boards SJ/T 11282 Specification for "E" Fiberglass Paper for Printed Boards

3 Terms and definitions

The following terms and definitions defined in GB/T 2036 apply to this document. 3.1 Cellulose paper nonwovencelulosepaper Products made from wood pulp, cotton pulp, or a mixture of wood pulp and cotton pulp, through a wet papermaking process. 3.2 Coldpunching The copper clad laminate is punched at the board temperature below 60°C. 3.3 Hotpunching The copper clad laminate is punched when the board temperature is 60°C and above. 3.4 Fabricatedsheet The copper clad laminate is cut according to the manufacturer's standard size. 3.5 Cut-to-sizepanel The copper clad laminate cut by the manufacturer according to the size of the user's special requirements is generally smaller than the entire board. ......

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