GB/T 43035-2023 English PDFUS$404.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 43035-2023: Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination Status: Valid
Basic dataStandard ID: GB/T 43035-2023 (GB/T43035-2023)Description (Translated English): Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L57 Classification of International Standard: 31.200 Word Count Estimation: 22,249 Date of Issue: 2023-09-07 Date of Implementation: 2023-09-07 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 43035-2023: Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. ICS 31.200 CCSL57 National Standards of People's Republic of China Semiconductor devices integrated circuits part 20. General specification for film integrated circuits and hybrid film integrated circuits Part One. Internal Visual Inspection Requirements (IEC 60748-20-1.1994,IDT) Published on 2023-09-07 Implemented on 2023-09-07 State Administration for Market Regulation Released by the National Standardization Administration Committee Table of contentsPrefaceⅠ Introduction II 1 Scope 1 1.1 Purpose 1 1.2 Check sequence 1 1.3 Check equipment 1 1.4 Check environment 1 1.5 magnification 1 1.6 Description 1 1.7 Alternative inspection methods 1 2 Normative reference documents 2 3 Terms and Definitions 2 4 Film-forming substrate-low magnification 3 4.1 Substrate 3 4.2 Film layer 3 5 Assembly - Mechanical installation and electrical connection of components on the substrate 5 5.1 External components 5 5.2 Assembly method-low magnification inspection 5 6 Assembly - Mechanical mounting and electrical connection of substrate in package - Low magnification 6 6.1 General 6 6.2 Welding and organic bonding 6 7 Internal lead 7 7.1 General 7 7.2 Gold wire ball bonding and wedge bonding 7 7.3 Gold wire ball bonding 7 7.4 Tailless bonding (crescent shape) 7 7.5 Wedge bonding 7 7.6 Composite bonding 8 7.7 Beam lead 8 7.8 Lead 8 8 Package 8 9 excess 8ForewordThis document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. This document is Part 20-1 of "Semiconductor Devices Integrated Circuits", a series that has released the following parts. ---Part 1.General provisions; ---Part 2.Digital integrated circuits; ---Part 3.Analog integrated circuits; ---Part 5.Semi-custom integrated circuits; ---Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits); ---Part 20.General specifications for film integrated circuits and hybrid film integrated circuits; ---Part 21.Sub-Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits (using identification and approval procedures); ---Part 22.Sub-Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits (Adopting Capability Approval Process); This document is equivalent to IEC 60748-20-1.1994 "Semiconductor Devices Integrated Circuits Part 20.Film Integrated Circuits and Hybrid Film General Specification for Integrated Circuits Part 1.Internal Visual Inspection Requirements. This document adds a chapter "Normative References". Adjust "1.6 Definitions" to "3 Terms and Definitions". Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This document was drafted by. China Electronics Technology Group Corporation No. 43 Research Institute, China Electronics Technology Standardization Institute. The main drafters of this document. Wang Tingting, Lu Hongjie, Feng Lingling, Wang Qi, Li Linsen, Lei Jian, and Zhang Yajuan.IntroductionSemiconductor devices are common basic products in the electronics industry chain and are the most basic units in electronic systems. "Semiconductor Devices Collection" "Integrated circuit" is a basic and universal standard for semiconductor devices, which plays an important role in evaluating and assessing the quality and reliability of semiconductor device integrated circuits. It plays an important role and is planned to be composed of 10 parts. ---Part 1.General principles. The purpose is to specify general guidelines for film integrated circuits and hybrid film integrated circuits. ---Part 2.Digital integrated circuits. The purpose is to give standards for subclasses of digital integrated circuits. ---Part 3.Analog integrated circuits. The purpose is to give standards for subclasses of analog integrated circuits. ---Part 4.Interface integrated circuits. The purpose is to give standards for subclasses of interfacing integrated circuits. ---Part 5.Semi-custom integrated circuits. The purpose is to provide standards for subclasses of semi-custom integrated circuits. ---Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits). The purpose is to specify packaged semiconductor integrated circuits Quality assessment procedures, inspection requirements, screening sequences, sampling requirements, testing and measurement procedures. ---Part 20.General specifications for film integrated circuits and hybrid film integrated circuits. The purpose is to specify film integrated circuits and hybrid film integrated circuits Road terminology, basic ratings, characteristics, and test methods. ---Part 21.Specifications for film integrated circuits and hybrid film integrated circuits (using the identification and approval process). The purpose is to provide ratings and characteristics Provide priority values for performance, select appropriate test and measurement methods from the general specification, and give film integrated circuits developed in accordance with this standard. Detailed specification of general performance requirements for circuit and hybrid film integrated circuits. ---Part 22.Sub-Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits (Adopting Capability Approval Process). The purpose is to provide optimal First, select appropriate test and measurement methods from the general specification, and give film integrated circuits and hybrids developed in accordance with this part. General performance requirements for use in membrane integrated circuit detailed specifications. ---Part 23.Hybrid integrated circuits and membrane structures. The purpose is to specify general guidelines for hybrid integrated circuits and membrane structures. Equivalent to the IEC 60748-20-1 series, ensuring that semiconductor device testing methods are consistent with international standards and achieving semiconductor device inspection Methods, reliability evaluation, and quality levels are in line with international standards. Through the formulation of this series of standards, unified test methods and stresses are determined to evaluate semiconductor The environmental adaptability of semiconductor devices is of great significance to the research, production, inspection and use of semiconductor devices, and it also supplements and improves semiconductor devices. The standard system plays a guiding role in the development of the semiconductor device industry. Semiconductor devices integrated circuits part 20. General specification for film integrated circuits and hybrid film integrated circuits Part One. Internal Visual Inspection Requirements1 Scope1.1 Purpose The purpose of this document is to examine the internal materials, Structure and manufacturing process. This inspection is usually performed before capping or packaging to find and eliminate devices with internal defects. This defect will cause the device Ineffective in normal applications. Other acceptance criteria should be agreed with the purchaser or supplier. 1.2 Check sequence When conducting internal visual inspection, it is not required to follow the order used in this test and can be adjusted according to the requirements of the contractor. possible due to subsequent assembly Wherever you can see it, inspect it before assembling it. 1.3 Check the equipment The equipment used in this test includes optical instruments with specified magnification and some auxiliary visual inspection standards or instruments (such as rulers, charts paper, photographs, etc.), these devices are required for effective inspection and enable the operator to make an objective judgment on the acceptability of the device being inspected. Provide appropriate fixtures during the inspection process to facilitate operation, improve inspection efficiency and avoid damage to the device. 1.4 Check the environment Under consideration. 1.5 magnification "High magnification" (100x to.200x) inspection usually refers to the device under lighting conditions, with the microscope vertically aligned with the surface to be observed. Inspections carried out. "Low magnification" (10x to 100x) inspection usually refers to using a single tube, binoculars or Examination using a stereomicroscope. 1.6 Description The "presentation" mentioned here means that the visual image or visual appearance of the device being inspected indicates that the condition exists and does not require any verification. How to confirm again. 1.7 Alternative inspection methods The visual inspection methods given below are not the only methods that can be used during visual inspection. However, manufacturers should meet the requirements of the National Authority (NAI) that any alternative methods will be subject to the same quality assurance, otherwise The benchmark method should be used for testing. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 43035-2023_English be delivered?Answer: Upon your order, we will start to translate GB/T 43035-2023_English as soon as possible, and keep you informed of the progress. The lead time is typically 2 ~ 4 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 43035-2023_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 43035-2023_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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