GB/T 41275.21-2022 English PDF

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GB/T 41275.21-2022: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Guidelines for transition to lead-free electronics
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Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 41275.21-2022	594	Add to Cart	5 days	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Guidelines for transition to lead-free electronics	Valid

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GB/T 28878.10   GB/T 28878.9   GB/Z 41275.23   GB/Z 41275.4   GB/Z 41275.22   

Basic data

Standard ID: GB/T 41275.21-2022 (GB/T41275.21-2022)
Description (Translated English): Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Guidelines for transition to lead-free electronics
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: V25
Word Count Estimation: 30,321
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 41275.21-2022: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Guidelines for transition to lead-free electronics

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21.Guidelines for transition to lead-free electronics ICS 49.025.01 CCSV25 National Standards of People's Republic of China Avionics Process Management Aerospace and Defense Electronic Systems with Lead-Free Solder Part 21.Guidelines for Transitioning to Lead-Free Electronics electronics lead-free electronics, IDT) 2022-03-09 Released 2022-10-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface III Introduction IV 1 Scope 1 2 Normative references 1 3 Terms, Definitions and Abbreviations 1 3.1 Terms and Definitions 1 3.2 Abbreviations 3 4 Comprehensive discussion of project management/system engineering management concerns 4 4.1 Overview 4 4.2 Concern 4 of IEC /T S62647-1 4.3 Additional Project Management/Systems Engineering Management Other Concerns 6 5 Requirements Definition 7 5.1 Overview 7 5.2 Customer Requirements 7 5.3 Additional Main Contractor Requirements7 5.4 Change Control 7 6 Use environment 7 6.1 Impact on the use environment7 6.2 Effects on storage and transport7 7 Decision Criteria7 7.1 Project Decisions Regarding Lead-Free7 7.2 Compliant with IEC /T S62647-1 8 7.3 Selection of Solder Alloy 8 7.4 Other items8 8 Supplier Lead-Free Control Program8 8.1 Overview 8 8.2 Supplier Procurement and Subcontractor Control 8 8.3 Productivity Planning 9 8.4 Production Changes 9 8.5 Production Risk Management 9 8.6 Supplier Lead-Free Implementation Plan 10 9 Requalification/Test Plan 10 9.1 Overview 10 9.2 delta identification or requalification 10 9.3 Acceptance by Analysis/Testing 10 9.4 Acceptance by similarity 10 10 Rework/Repair and Maintenance 10 10.1 Overview 10 10.2 Supplier Recommendations for Rework/Repair of Lead-Free Products10 10.3 Maintenance and training documents 10 11 Risk Management 10 11.1 Overview 10 11.2 Identification of project risk levels 11 11.3 Risk Analysis 11 11.4 Risk Mitigation 11 12 Cost 11 13 Introduction to customers 11 13.1 Overview 11 13.2 Compliance with IEC /T S62647-1 11 13.3 Systems Engineering Management Plan 11 13.4 Other Deliverables to Customers 11 Appendix A (Informative) Relationship Matrix of Tiers and Associated Risks12 Appendix B (Informative) Links to EU Directives and Executive Order 1314814 Appendix C (Informative) General Checklist for Project Managers Addressing Lead-Free Issues15 Appendix D (informative) Manufacturing Process Assessment General Checklist for Assessing Supplier Compliance with IEC /T S62647-1 17 Appendix E (informative) Proposed project language (as agreed upon in the contract) 24 Reference 25

foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents" drafted. This document is part 21 of GB/T 41275 "Avionics Process Management for Aerospace and Defense Electronic Systems Containing Lead-Free Solders". GB/T 41275 has published the following parts. --- Part 2.Reducing the harmful effects of tin; --- Part 3.System performance test methods containing lead-free solder and lead-free pins; --- Part 21.Guidelines for the transition to lead-free electronics. This document is equivalent to IEC /T S62647-21.2013 "Avionics Process Management Containing Lead-Free Solder Aerospace and Defense Electronics System" System Part 21.Project Management Lead-Free Electronic Transition Management System Engineering Guidelines, the document type is adjusted from IEC technical specifications to I country's national standards. The following minimal editorial changes have been made to this document. ---In order to harmonize with existing standards, the standard name was changed to "Avionics Process Management Containing Lead-Free Solder Aerospace and Defense Electronics System" System Part 21.Guidelines for Transitioning to Lead-Free Electronics. Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents. This document is proposed and managed by the National Avionics Process Management Standardization Technical Committee (SAC/TC427). This document is drafted by. China Aviation Comprehensive Technology Research Institute, Aviation Industry Corporation of China Leihua Electronic Technology Research Institute, Guangzhou Xingyuan Technology Co., Ltd. Sen Express Circuit Technology Co., Ltd., Luoyang Electro-optical Equipment Research Institute of Aviation Industry Corporation of China. The main drafters of this document. Shao Wentao, Xu Feng, Jin Ting, Liu Gang, Qiao Shuxiao, Hu Menghai, Lv Bing, Zhao Bingxian, He Mingzhong, Liu Zhanping.

Introduction

GB/T 41275 specifies the management requirements and technical requirements for the realization of lead-free in aerospace, national defense and high-performance electronic systems. composed of parts. --- Part 2.Reducing the harmful effects of tin. The purpose is to regulate aerospace, defense and high performance electronic systems to reduce the harmful effects of tin The technical approach adopted in response. --- Part 3.Test methods for system performance containing lead-free solder and lead-free pins. The purpose is to specify lead-free solder and lead-free pipes Performance test methods and test procedures for aerospace, defense, and high-performance electronic systems for feet. --- Part 21.Guidelines for the transition to lead-free electronics. The purpose is to specify the management or system of the aerospace and defense electronic systems program A working guide for engineering management to manage the transition to lead-free electronics. When buyers and suppliers are not carefully coordinated, aerospace, defense and high performance (ADHP) electronics manufacturers can inadvertently Introduce lead-free elements [including component plating, printed wiring board (PWBs) or printed circuit board (PCB) plating, or assembly solder]. for example, Component manufacturers will not necessarily change part numbers to identify lead-free plating, especially if the original tin-lead plating has been discontinued. case. Detailed inspection of parts and documentation is critical when receiving inspection, but may not be sufficient to identify lead-free parts. Lead-free technology affects any project, whether it is exempt or subject to environmental regulations and is lead-free. lead-free soldering technology Industrial transformation may affect ADHP programs in one or both of the following ways. a) If the project needs to implement lead-free technology (contract requirements, environmental regulations, etc.), the project manager/solder system engineer needs to evaluate The impact of lead-free internal transition on design (product performance using lead-free technology), process (the process of making lead-free products); b) If the products/systems in the project are purchased off-the-shelf (COTS), it is highly likely that these purchased products contain lead-free solder components, printed wiring boards (PWBs), printed circuit boards (PCB), or circuit board assemblies (CCAs). The basic principles described in this document can be used in project management or systems engineering management for any aerospace and high performance project. this document The appendices in describe the tools that can be used in conjunction with this document. Appendix A is a matrix of relationships between product tiers and the risks associated with the transition to lead-free. Appendix B contains links to EU directives referenced in the document. Appendix C contains a general checklist for project managers dealing with lead-free issues, drawn from the summary of this document. Appendix D contains a production process evaluation general checklist for assessing supplier compliance with IEC /T S62647-1. Appendix E is the proposed program language for ensuring the performance, reliability, airworthiness, safety, and certifiability of lead-free products. This document is formulated in accordance with IEC /T S62647-1 and is used to assist projects to ensure product performance, reliability, airworthiness, safety and availability. Authentication. It should be noted that project managers, system engineers and their respective organizations and corresponding enterprise institutions need to work together to ensure that they can understand the All impacts of lead technology introduction, and corresponding risks are mitigated. In this document, "project management (or manager) or systems engineering management (or manager) or corresponding corporate body" is defined as "project manager". Project Managers and Systems Engineering Managers (together with their respective organizations), and appropriate corporate bodies, should work together to ensure the introduction of lead-free All impacts of technology are understood and risks are mitigated accordingly. Avionics Process Management Aerospace and Defense Electronic Systems with Lead-Free Solder Part 21.Guidelines for Transitioning to Lead-Free Electronics

1 Scope

This document specifies the management of the transition of aerospace and defense electronic systems containing lead-free solder at project management or systems engineering management. requirements to ensure product performance and reliability. This document is applicable to the aerospace and defense electronic system industries, and other high-performance and high-reliability industries can be used for reference.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document. IEC /T S62647-1 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 1.Lead-Free Control lead-freesolder-Part 1.Preparationforalead-freecontrolplan) IEC /T S62647-2 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 2.Tin Reduction Note. GB/T 41275.2-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 2.Reducing the Harmful Effects of Tin Impact (IEC /T S62647-2.2012, MOD) 3 Terms, Definitions and Abbreviations 3.1 Terms and Definitions The following terms and definitions apply to this document. 3.1.1 Assemblies Electronic products that require electrical connections, including soldering of leads or component terminals. Example. circuit board and connecting wires. [Source. IEC /T S62647-1.2012,3.1] 3.1.2 Shelf products commercial-off-the-shelf; COTS Products whose design and appearance are determined by the manufacturer and over which the user has no control. Note. Products may be departmental, sub-components, assemblies or systems. [Source. IEC /T S62647-1.2012, 3.3] ......

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