GBZ41275.23-2023 English PDFUS$694.00 · In stock
Delivery: <= 6 days. True-PDF full-copy in English will be manually translated and delivered via email. GBZ41275.23-2023: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies Status: Valid
Basic dataStandard ID: GB/Z 41275.23-2023 (GB/Z41275.23-2023)Description (Translated English): Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies Sector / Industry: National Standard Classification of Chinese Standard: V25 Classification of International Standard: 49.025.01 Word Count Estimation: 38,324 Date of Issue: 2023-12-28 Date of Implementation: 2024-07-01 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GBZ41275.23-2023: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. GB /Z 41275:23-2023: Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronic Products ICS 49:025:01 CCSV25 National Standardization Guiding Technical Documents of the People's Republic of China Avionics Process Management Aerospace and defense electronic systems containing lead-free solders Part 23: Rework of lead-free and mixed electronic products/ Repair guide (IEC /T S62647-23:2013,IDT) Published on 2023-12-28 and implemented on 2024-07-01 State Administration for Market Regulation Released by the National Standardization Administration Committee Table of contentsPreface III Introduction IV 1 Scope 1 2 Normative references 1 3 Terms, definitions and abbreviations 1 3:1 Terms and definitions 1 3:2 Abbreviations 6 4 Lead-free related issues 7 4:1 General 7 4:2 Reliability 7 4:3 Configuration management 9 4:4 Risk Management 9 4:5 Tin whiskers 9 4:6 Copper dissolution (erosion) 9 5 materials10 5:1 Solder 10 5:2 Flux 11 5:3 Part 11 5:4 Printed circuit board/printed circuit board 12 5:5 Conformal coating 12 6 Welding equipment12 6:1 General 12 6:2 Hand welding equipment 13 6:3 Jet welding equipment 14 6:4 Convection welding equipment 15 7 Rework/Repair Considerations16 7:1 General 16 7:2 Determination of rework/repair procedures16 7:3 Technical training16 7:4 Lead-free rework/repair 17 8 Rework/repair preprocessing 18 8:1 Identification of alloys 18 8:2 Parts and CCA preparation 20 9 Rework/Fix21 9:1 General 21 9:2 Manual welding 21 9:3 Convection welding 22 10 Rework/Post-repair processing 23 10:1 Cleaning 23 10:2 Inspection 24 10:3 Restoration of conformal coating 24 Appendix A (informative) Terminal plating 25 Appendix B (informative) Tin Whisker 27 Reference 31ForewordThis document complies with the provisions of GB/T 1:1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting: This document is Part 23 of GB/T (Z) 41275 "Aviation Electronics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder" point: GB/T (Z)41275 has released the following parts: ---Part 2: Reducing the harmful effects of tin; ---Part 3: System performance test methods containing lead-free solder and lead-free pins; ---Part 4: Ball Grid Array Ball Planting; ---Part 21: Transition Guide to Lead-Free Electronics; ---Part 22: Technical Guidelines; ---Part 23: Guidelines for rework/repair of lead-free and mixed electronic products: This document is equivalent to IEC /T S62647-23:2013 "Aviation Electronics Process Management of Lead-free Solders for Aerospace and Defense Electronics" System Part 23: Guidelines for Rework/Repair of Lead-Free and Mixed Electronic Products, the file type is adjusted from IEC ’s technical specifications to my country’s national National standardization guidance technical documents: This document has made the following minimal editorial changes: ---Deleted the expression Fahrenheit (℉) in IEC /T S62647-23:2013; --- Corrigendum to the definition of term 3:1:29 "repair"; ---Added "note" in 4:2:2:2: Please note that some content in this document may be subject to patents: The publisher of this document assumes no responsibility for identifying patents: This document is proposed and coordinated by the National Avionics Process Management Standardization Technical Committee (SAC/TC427): This document was drafted by: State-owned Wuhu Machinery Factory, China Aviation Technology Research Institute, China Aviation Industry Corporation Leihua Electronic Technology Technical Research Institute, Aviation Industry Corporation of China Luoyang Electro-Optical Equipment Research Institute, Aviation Industry Corporation of China Shenyang Aircraft Design Institute, Taiyuan Aviation Instrument Co:, Ltd:, Guangzhou Hanyuan Microelectronics Packaging Materials Co:, Ltd: The main drafters of this document: Liu Peng, Li Shanshan, Ren Haitao, Tang Yuanyuan, Liu Yaojun, Shan Yimeng, Hu Chen, Liu Gang, Zhang Xiaolei, Li Jinmeng, Lu Bing, Liu Zhanping, Li Xiaofei, Yu Miao, Du Wenjie, Ning Jiangtian:IntroductionGB/T (Z) 41275 specifies the management and technical requirements for lead-free aerospace, national defense and high-performance electronic systems: Consists of 7 parts: ---Part 1: Preparation of lead-free control plan: The purpose is to provide for lead-free control of programming of aerospace, defense and high-performance electronic systems: plan goals and requirements: ---Part 2: Reducing the harmful effects of tin: The purpose is to regulate aerospace, defense and high-performance electronic systems to reduce the harmful effects of tin: The technical methods adopted for the impact: ---Part 3: System performance test methods containing lead-free solder and lead-free pins: The purpose is to regulate lead-free solder and lead-free tubing Performance test methods and test procedures for aerospace, defense, and high-performance electronic systems: ---Part 4: Ball Grid Array Ball Planting: The purpose is to regulate aerospace, defense and high-performance electrical products containing lead-free solder and lead-free leads: Requirements for subsystem replacement of ball grid array (BGA) component solder balls: ---Part 21: Transition Guide to Lead-Free Electronics: The purpose is to provide for aerospace and defense electronic system project management or system A guide for engineering management to manage the transition to lead-free electronics: ---Part 22: Technical Guidelines: The purpose is to provide for aerospace, defense and high-performance electronic systems to ensure continued performance, quality, Technical guidance for reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability: ---Part 23: Guidelines for rework/repair of lead-free and mixed electronic products: The purpose is to specify aerospace, defense and high performance electronics Technical guidelines for disassembly and replacement of parts (including components) during system rework/repair: This document is intended to facilitate the development of procedures and processes for use in the rework/repair of aerospace, defense, and high performance electronic systems: This document package Charges containing equipment processes that support tin-lead or lead-free solder alloys, tin-lead or lead-free components, and printed circuit boards/printed wiring board plating, or combinations thereof information: Avionics Process Management Aerospace and defense electronic systems containing lead-free solder Part 23: Rework of lead-free and mixed electronic products/ Repair guide1 ScopeThis document provides technical background, procurement guidance, engineering procedures, and guidance to assist organizations developing aerospace and high-performance electronic systems Rework/repair, whether assembled or returned using conventional alloys (Sn-Pb or lead-free alloys) or a combination of solder and surface plating Worked/repaired system: This document contains a review of known effects and issues and rework/repair procedures, with an emphasis on service technicians performing tasks: Provide technical architecture for the service: This document provides guidelines for component removal and replacement: The term "rework/repair" in this document is as defined in 3:1:29 and 3:1:30 use: The information contained in this document is based on the current knowledge of the industry at the time of publication: Due to the rapid changes in the knowledge base, this document is for guidance only: Note 1: In this document, if the element "lead" is implied, then Pb, lead (Pb) or tin-lead will be used: If referring to component terminals or terminal "leads" such as flat package or dual in-line package, the term lead/terminal or lead-terminal will be used: Note 2: The processes identified in this document are suitable for rework or repair: This document is applicable to the aerospace and defense electronic system industries, and other high-performance and high-reliability industries can be used as a reference:2 Normative reference documentsThe contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, dated citations For documents, only the version corresponding to the date applies to this document; for undated referenced documents, the latest version (including all modification orders) applies in this document: IEC /T S62647-1:2012 Avionics process management Aerospace and defense electronic systems containing lead-free solders Part 1: None taininglead-freesolder-Part 1:Preparationforalead-freecontrolplan) 3 Terms, definitions and abbreviations 3:1 Terms and definitions The following terms and definitions apply to this document: 3:1:1 Alloy compositionaloycomposition The total composition of an alloy, defined by weight as a percentage: Note: For example, 63Sn-37Pb is equivalent to a mixture of 63% tin (by weight) and 37% lead (by weight): [Source: GB /Z 41275:22-2023,3:1:1] ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GBZ41275.23-2023_English be delivered?Answer: Upon your order, we will start to translate GBZ41275.23-2023_English as soon as possible, and keep you informed of the progress. 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