GB/T 38265.17-2022 English PDFUS$609.00 · In stock
Delivery: <= 5 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 38265.17-2022: Test methods for soft soldering fluxes - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues Status: Valid
Basic dataStandard ID: GB/T 38265.17-2022 (GB/T38265.17-2022)Description (Translated English): Test methods for soft soldering fluxes - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: J33 Classification of International Standard: 25.160.50 Word Count Estimation: 29,269 Date of Issue: 2022-10-12 Date of Implementation: 2022-10-12 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 38265.17-2022: Test methods for soft soldering fluxes - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Test methods for soft soldering fluxes - Part 17.Surface insulation resistance comb test and electrochemical migration test of flux residues ICS 25.160.50 CCSJ33 National Standards of People's Republic of China Soldering Flux Test Methods Part 17. Surface Insulation Resistance Combs for Flux Residues Test and Electrochemical Migration Test (ISO 9455-17.2002, Softsolderingfluxes-Testmethods-Part 17. 2022-10-12 release 2022-10-12 implementation State Administration for Market Regulation Released by the National Standardization Management Committee table of contentsPreface III Introduction V 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Principle 1 5 Reagent 2 6 Instruments and equipment 2 7 Inspection of the test board 7 8 Preparation of Specimen 7 9 Test steps 9 10 reviews 12 11 Precision 12 12 Test report 13 Appendix A (informative) This document is compared with the ISO 9455-17.2002 structure number 14 Appendix B (Informative) SIR Test Guidelines 16 Appendix C (informative) Assessment test report of surface insulation resistance comb test and electrochemical migration test of flux residues 18 Reference 22forewordThis document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules for Standardization Documents" drafting. This document is part 17 of GB/T 38265 "Test Methods for Soldering Flux". GB/T 38265 has released the following parts. --- Part 1.Gravimetric method for the determination of non-volatile matter content; --- Part 2.Determination of non-volatile matter content boiling point method; --- Part 3.Determination of acid value Potentiometric titration and visual titration; --- Part 5.Copper mirror test; --- Part 6.Determination of content of halides (excluding fluorides); --- Part 8.Determination of zinc content; --- Part 9.Determination of ammonia content; --- Part 10.Solder wetting performance spreading test method; --- Part 11.Solubility of flux residues; --- Part 13.Determination of flux splashing; --- Part 14.Evaluation of the adhesiveness of flux residues; --- Part 15.Copper corrosion test; --- Part 16.Solder wetting performance Wetting balance method; --- Part 17.Flux residue surface insulation resistance comb test and electrochemical migration test. This document is modified to adopt ISO 9455-17.2002 "Test methods for soldering flux - Part 17.Surface insulation resistance of soldering flux residues Comb test and electrochemical migration test". Compared with ISO 9455-17.2002, this document has more structural adjustments, and the structure number changes between the two documents are compared at a glance See Appendix A for the table. The technical differences between this document and ISO 9455-17.2002 and their reasons are as follows. ---IEC 60068-2-20 has been deleted, the standard text has directly marked the values of temperature and humidity, and there is no need to quote IEC 60068- 2-20; --- Added reference to HG/T 2892 (see 5.1) to adapt to the technical conditions of our country and increase operability; ---Replace ISO 5725-2 with GB/T 6379.2, which adopts international standards modified (see 6.1, Chapter 11); --- Replace ISO 9453 with GB/T 3131 and GB/T 20422, which adopts international standards (see 6.7.1, 6.7.2); ---Replace ISO 12224-1 (see 6.7.4) with GB/T 41104.1, which adopts the modified international standard; --- Increased the characteristic requirements of "soft brush" in the instrument equipment (see 6.11), to facilitate the application of this document; --- Increased the characteristic requirements of "Soxhlet extractor" in the equipment (see 6.15) to adapt to the technical conditions of our country; --- Added the reference to GB/T 11415 (see 6.15) to adapt to my country's technical conditions and increase operability. The following editorial changes have been made to this document. --- In order to coordinate with existing standards, the name of the standard was changed to "Soldering Flux Test Methods Part 17.Surface Insulation of Flux Residues Resistance Comb Test and Electrochemical Migration Test》 --- Replaced ISO 9454-1 with the informative referenced GB/T 15829 (see Chapter 1). Please note that some contents of this document may refer to patents. The issuing agency of this document assumes no responsibility for identifying patents. This document is proposed and managed by the National Welding Standardization Technical Committee (SAC/TC55). This document was drafted by. Shenzhen Hanxin Electronic Technology Co., Ltd., Harbin Welding Research Institute Co., Ltd., Shenzhen Weite New Materials Co., Ltd., Beijing Kangpu Xiwei Technology Co., Ltd., Yichengda Technology (Jiangxi) Co., Ltd., Yunnan Tin Industry Tin Material Co., Ltd., Suzhou Keshida Electronic Materials Co., Ltd., Zhejiang Yatong Welding Materials Co., Ltd., and Harbin Institute of Technology. The main drafters of this document. Ma Xin, Sun Xiaomei, Li Weijun, Zhao Chaohui, Xu Jinhua, Qin Junhu, Li Chunfang, Zhong Haifeng, He Peng, Gu Xiaolong, Zhang Fuwen, Lu Xiaochun.IntroductionAs the key supporting combination material in the soldering process, soldering agent has a decisive influence on the quality of soldered joints. The strong foundation project being implemented, the national science and technology major project "core electronic devices, high-end general-purpose chips and basic software products" and "ultra-large-scale Technology research and development of core electronic devices, high-end chips and integrated circuit complete sets of technology in the Special Project of Modular Integrated Circuit Manufacturing Equipment and Complete Processes Among them, solder is the key basic material, and the formulation of test method standards for its quality performance evaluation is of great significance. Since.2001, my country has promulgated and implemented "Sn-Pb Solder", "Lead-Free Solder", "Solder Classification and Performance Requirements" and "Soft Solder". Soldering material test method" and other supporting standards, as an important component of soldering material, soldering agent not only plays an important role in the solderability and manufacturability of soldering material It is also critical to the environment, the reliability of the solder joints, and the application. GB/T 38265 "Test Method for Solder Flux" is the The general test method standard of the standard is proposed to be composed of the following parts. --- Part 1.Gravimetric method for the determination of non-volatile matter content. The purpose is to specify the use of gravimetric method to determine the non-volatile Test method for substance content. --- Part 2.Determination of non-volatile matter content Boiling point method. The purpose is to stipulate the determination of the non-volatile oil in solder by the boiling point method. Test method for substance content. --- Part 3.Determination of acid value potentiometric titration and visual titration. The purpose is to specify the use of potentiometric titration and visual titration Standard test method for the determination of acid value in solder. --- Part 5.Copper mirror test. The purpose of this specification is to specify a test method for evaluating the aggressiveness of solder to copper by means of the copper mirror test. --- Part 6.Determination of halide (excluding fluoride) content. The purpose is to specify the use of three quantitative methods for the determination of solder flux Ionic Halide Content and a Qualitative Method Test Method for the Presence of Ionic Halides in Solder Fluxes. --- Part 8.Determination of zinc content. The purpose is to specify the test for the determination of zinc content in soldering flux by EDTA titration method method. --- Part 9.Determination of ammonia content. The purpose of this document is to specify a test method for the determination of ammonia content in solder fluxes by distillation. --- Part 10.Solder wetting performance spreading test method. The purpose is to specify the use of spreading method to evaluate the wetting performance of solder test method. --- Part 11.Solubility of flux residues. The purpose is to specify a qualitative method for the evaluation of solder residues in selected solvents Solubility test method. --- Part 13.Determination of flux splashing. Its purpose is to specify a test method for evaluating the spattering properties of solder fluxes on steel test pieces. --- Part 14.Evaluation of the adhesiveness of flux residues. The purpose is to specify the use of chalk powder for the evaluation of residues after soldering after soldering. Adhesive test method. --- Part 15.Copper corrosion test. The purpose is to specify the qualitative evaluation of the surface of copper plates using the copper corrosion test under controlled environmental conditions. Test method for corrosivity of solder residues. --- Part 16.Solder wetting properties Wetting balance method. The purpose is to specify the use of wetting balance method to evaluate the wettability of solder capable test method. --- Part 17.Flux residue surface insulation resistance comb test and electrochemical migration test. The purpose is to specify the use of surface Insulation resistance comb test and electrochemical migration test to evaluate the corrosion of flux residues on the surface of the test piece after soldering method. This document uses surface insulation resistance test and electrochemical migration test to evaluate the corrosiveness of flux residues after soldering. This method has the advantages of simple operation, strong applicability, accurate and reliable results, etc., and has become an important detection method in soldering flux products. Soldering Flux Test Methods Part 17. Surface Insulation Resistance Combs for Flux Residues Test and Electrochemical Migration Test1 ScopeThis document specifies the test methods for surface insulation resistance and electrochemical migration of flux residues on the surface of test pieces after soldering, including principles, Reagents, instruments and equipment, inspection of test panels, preparation of samples, test procedures, evaluation, precision, test reports, etc. This document is applicable to Type 1 and Type 2 solder fluxes defined in GB/T 15829. Other forms such as solder, preformed solder, solder paste, etc.2 Normative referencesThe contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to this document. GB/T 3131 tin-lead solder GB/T 6379.2 Accuracy of measurement methods and results (trueness and precision) - Part 2.Determination of repeatability of standard measurement methods Basic methods of reliability and reproducibility (GB/T 6379.2-2004, ISO 5725-2.1994, IDT) GB/T 11415 Laboratory sintered (porous) filter pore size, classification and grade (GB/T 11415-1989, ISO 4793- 1980,NEQ) GB/T 20422 Lead-free solder (GB/T 20422-2018, ISO 9453.2014, MOD) GB/T 41104.1 Specifications and test methods for solid and flux-cored solder wires Part 1.Classification and performance requirements (GB/T 41104.1-2021, ISO 12224-1.1997, MOD) HG/T 2892 Chemical Reagent Isopropanol (HG/T 2892-2020, ISO 6353-3.1987, NEQ) IEC 61249-2-7.2002 Materials for printed circuit boards and other interconnecting structures - Part 2-7.Plated and unplated additives Strong Base Materials - Epoxy Interleaved Class E Glass Flame Retardant (Vertical Burning Test) Laminate, Copper Clad [Materialsforprinted IPC-TM-650 Test Method Manual (TM2.6.3.3 Surface Insulation Resistance, Solder Flux) (Test Pattern IPC-B-24) [Test3 Terms and DefinitionsThis document does not have terms and definitions that need to be defined.4 principlesAfter the rigid printed circuit test board is brazed with the specified flux, under the condition of high temperature and high humidity with bias voltage, the resistance value drops by measuring ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 38265.17-2022_English be delivered?Answer: Upon your order, we will start to translate GB/T 38265.17-2022_English as soon as possible, and keep you informed of the progress. 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