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GB/T 11364-2008 English PDF

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GB/T 11364-2008: Test method of wettability for brazing filler metals
Status: Valid

GB/T 11364: Historical versions

Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 11364-2008209 Add to Cart 3 days Test method of wettability for brazing filler metals Valid
GB/T 11364-1989199 Add to Cart 2 days Test method of spreadability and clearance filling ability for filler metal Obsolete

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GB/T 11345   GB/T 12467.1   GB/T 11363   GB/T 13815.1   GB/T 10859.1   

Basic data

Standard ID: GB/T 11364-2008 (GB/T11364-2008)
Description (Translated English): Test method of wettability for brazing filler metals
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: J33
Classification of International Standard: 25.160.50
Word Count Estimation: 9,942
Date of Issue: 2008-05-06
Date of Implementation: 2008-11-01
Older Standard (superseded by this standard): GB/T 11364-1989
Quoted Standard: GB/T 8170
Adopted Standard: ISO 5179-1983, NEQ
Regulation (derived from): National Standard Approval Announcement 2008 No.7 (Total No.120)
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies test methods and Sealant spreading Test Method for hard solder wettability. This standard applies to hard solder wetting performance assessment.

GB/T 11364-2008: Test method of wettability for brazing filler metals

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test method of wettability for brazing filler metals ICS 25.160.50 J33 National Standards of People's Republic of China Replacing GB/T 11364-1989 Solder wettability test method (ISO 5179. 1983, Investigationofbrazeabilityusing avaryinggaptestpiece, NEQ) Posted 2008-05-06 2008-11-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Foreword

This standard corresponds to ISO 5179. 1983 "change gap specimen solderability research" (in English), the degree of consistency with ISO 5179 Non-equivalent, the main differences are as follows. --- Increased Chapter 3, "Terms and Definitions", Chapter 6, "heating device" and 7.1 "spreading test." This standard replaces GB/T 11364-1989 "solder spreadability and clearance filling test methods", and GB/T 11364-1989 compared to major Changes are as follows. --- Standard name was changed to "solder wettability test method"; --- Modify the scope of the presentation content; --- Added "normative references"; --- Deleted "caulking" of the definition, increase the "wetting", "spreading factor" is defined; --- Revised technical requirements caulk resistance test (4.2.2 and 7.2); --- Increased spreadability test results evaluation (7.1.5); --- Modify the test results record (Chapter 8). The standard proposed by China Machinery Industry Federation. This standard by the National Standardization Technical Committee welded (SAC/TC55) centralized. This standard was drafted. Harbin Institute of Technology, Shenzhen billion Cheng Industrial Co., Ltd., Beijing Institute of Aeronautical Materials, Sun East Electronic Technology (Shenzhen) Co., Ltd. Changshu City Huayin solder, Harbin Welding Institute. The main drafters of this standard. Ho Peng, Ma Xin, Cheng Yaoyong, Shi Jianwei, Gu Wenhua, Lv Xiaochun. This standard replaces the standards previously issued as follows. --- GB/T 11364-1989. Solder wettability test method

1 Scope

This standard specifies the test methods and spreading caulking Test Method for hard solder wettability. This standard applies to hard solder wetting performance assessment.

2 Normative references

The following documents contain provisions which, through reference in this standard and become the standard terms. For dated references, subsequent Amendments (not including errata content) or revisions do not apply to this standard, however, encourage the parties to the agreement are based on research Whether the latest versions of these documents. For undated reference documents, the latest versions apply to this standard. GB/T 8170 numerical rounding rules

3 Terms and Definitions

The following terms and definitions apply to this standard. 3.1 When brazing, liquid solder base metal infiltration and adhesion ability. 3.2 A criterion for evaluation of solder wettability.

4 specimens

4.1 General Requirements Test specimen surface should be smooth, without burrs. Test surface application of appropriate methods to clean, degrease and oxide impurities. 4.2 Shape and size 4.2.1 solder spread test as shown by the shape and dimensions of the specimen 1. Millimeters

1 solder spreading specimen shape and size schematic

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