|
Std ID |
Description (Standard Title) |
Detail |
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SJ 21314-2018
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(General requirements for thermal simulation analysis of electronic equipment)
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SJ 21314-2018
|
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SJ 21315-2018
|
(General specifications for spin coating and hot plate equipment)
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SJ 21315-2018
|
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SJ 21316-2018
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(General specification for cleaning and etching stations)
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SJ 21316-2018
|
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SJ 21317-2018
|
(General specification for online plasma cleaners)
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SJ 21317-2018
|
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SJ 21318-2018
|
General specification for vacuum high-temperature ovens
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SJ 21318-2018
|
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SJ 21319-2018
|
(Gluing equipment process verification method)
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SJ 21319-2018
|
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SJ 21320-2018
|
(Micro-assembly wet cleaning equipment process verification method)
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SJ 21320-2018
|
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SJ 21324-2018
|
(Laser seam welding machine general specification)
|
SJ 21324-2018
|
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SJ 21328-2018
|
(Metal casing, sealing process technical requirements)
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SJ 21328-2018
|
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SJ 21330-2018
|
(Metal shell mounting technology requirements)
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SJ 21330-2018
|
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SJ 21331-2018
|
Ceramic packages and metal packages Technical requirements for the heat treatment of the metal parts process
|
SJ 21331-2018
|
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SJ 21332-2018
|
(Ceramic shell and metal shell Technical requirements for electroless nickel plating)
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SJ 21332-2018
|
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SJ 21342-2018
|
(Very low noise test method)
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SJ 21342-2018
|
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SJ 21343-2018
|
(S-parameter test method for microwave components in low temperature environment)
|
SJ 21343-2018
|
|
SJ 21344-2018
|
Test methods for superconducting filters
|
SJ 21344-2018
|
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SJ 21345-2018
|
(Low temperature low noise amplifier test method)
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SJ 21345-2018
|
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SJ 21346-2018
|
(Low temperature low loss transmission line insulation component test method)
|
SJ 21346-2018
|
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SJ 21347-2018
|
(Low temperature device and component extremely low temperature screening test method)
|
SJ 21347-2018
|
|
SJ 21348-2018
|
Environment test methods for superconducting devices
|
SJ 21348-2018
|
|
SJ 21349-2018
|
(Erbium-doped inorganic oxide scintillation crystal specification)
|
SJ 21349-2018
|
|
SJ 21351-2018
|
Process technological requirements for raw material preparation of the cerium doped inorganic oxide scintillation crystals
|
SJ 21351-2018
|
|
SJ 21352-2018
|
Process technological requirements for the cerium doped inorganic oxide scintillation crystal growths
|
SJ 21352-2018
|
|
SJ 21353-2018
|
Process technological requirements for the cerium doped inorganic oxide scintillation crystals
|
SJ 21353-2018
|
|
SJ 21358-2018
|
(Electronic equipment welding process method graphic symbol)
|
SJ 21358-2018
|
|
SJ 21359-2018
|
Model based definition representation of welding process information for electronic equipment
|
SJ 21359-2018
|
|
SJ 21360-2018
|
(General requirements for three-dimensional machine plus process design of electronic equipment)
|
SJ 21360-2018
|
|
SJ 21361-2018
|
(General requirements for 3D assembly process design of electronic equipment)
|
SJ 21361-2018
|
|
SJ 21362-2018
|
(General requirements for three-dimensional sheet metal process design of electronic equipment)
|
SJ 21362-2018
|
|
SJ 21363-2018
|
General requirements of three-dimensional process planning check and change for electronic equipment
|
SJ 21363-2018
|
|
SJ 21364-2018
|
(General requirements for static simulation of electronic equipment structures)
|
SJ 21364-2018
|
|
SJ 21365-2018
|
(General requirements for reliability simulation of electronic equipment structures)
|
SJ 21365-2018
|
|
SJ 21385-2018
|
Multilayer co-fired ceramic-Technical requirements for green sheet framing process
|
SJ 21385-2018
|
|
SJ 21386-2018
|
Multilayer co-fired ceramic-Technical requirements for green sheet via forming process
|
SJ 21386-2018
|
|
SJ 21387-2018
|
Multilayer co-fired ceramic-Technical requirements for green bar thermal cutting process
|
SJ 21387-2018
|
|
SJ 21391-2018
|
Multi-layer co-fired ceramic-Technical requirements for green sheet film process
|
SJ 21391-2018
|
|
SJ 21403-2018
|
(Microelectronics package metal case Glass insulator technology requirements)
|
SJ 21403-2018
|
|
SJ 21404-2018
|
(Microelectronics packaged metal casings)
|
SJ 21404-2018
|
|
SJ 21405-2018
|
(Microelectronics packaged metal casing Aluminum silicon casing plating process technical requirements)
|
SJ 21405-2018
|
|
SJ 21428-2018
|
(Military Information System Concept Modeling Requirements)
|
SJ 21428-2018
|
|
SJ 21429-2018
|
(Digital design requirements for flexible cables for military electronic equipment)
|
SJ 21429-2018
|
|
SJ 21430-2018
|
(General requirements for the construction of military electronic equipment industrial design models)
|
SJ 21430-2018
|
|
SJ 21431-2018
|
General requirements of ergonomic modeling for military electronic equipment
|
SJ 21431-2018
|
|
SJ 21432-2018
|
(Military electronic equipment based on model definitions)
|
SJ 21432-2018
|
|
SJ 21433-2018
|
(Military electronic equipment based on model definition Visual requirements)
|
SJ 21433-2018
|
|
SJ 21434-2018
|
(Military electronic equipment based on model definition T/R component requirements)
|
SJ 21434-2018
|
|
SJ 21435-2018
|
(Military electronic equipment based on model definition)
|
SJ 21435-2018
|
|
SJ 21436-2018
|
(Military electronic equipment based on model definition)
|
SJ 21436-2018
|
|
SJ 21437-2018
|
Requirements of three-dimensional model check for military electronic equipment
|
SJ 21437-2018
|
|
SJ 21438-2018
|
(General requirements for three-dimensional modeling of military electronic equipment cable assemblies)
|
SJ 21438-2018
|
|
SJ 21439-2018
|
(Digital modeling requirements for military electronic equipment production lines)
|
SJ 21439-2018
|
|
SJ 21440-2018
|
(Digital simulation requirements for military electronic equipment production lines)
|
SJ 21440-2018
|
|
SJ 21441-2018
|
Specification for high purity semi-insulating silicon carbide monocrystalline wafers of SiC-HPSI
|
SJ 21441-2018
|
|
SJ 21442-2018
|
(GaN-based SI type semi-insulating gallium nitride single wafer specification)
|
SJ 21442-2018
|
|
SJ 21443-2018
|
(GaN-N type low resistance gallium nitride single wafer specification)
|
SJ 21443-2018
|
|
SJ 21444-2018
|
Specification for gallium oxide monocrystalline wafers of β-Ga203-N
|
SJ 21444-2018
|
|
SJ 21445-2018
|
(CdS-N type infrared/ultraviolet two-color detection cadmium sulfide single wafer specification)
|
SJ 21445-2018
|
|
SJ 21446-2018
|
(CdS-N-T type cadmium sulfide single wafer specification for infrared/ultraviolet two-color detection)
|
SJ 21446-2018
|
|
SJ 21447-2018
|
Specification for cadmium selenide monocrystal of CdSe-N-T01 used for infrared solid state laser
|
SJ 21447-2018
|
|
SJ 21448-2018
|
(Integrated circuit ceramic package pre-bonding inspection requirements)
|
SJ 21448-2018
|
|
SJ 21449-2018
|
(Integrated circuit ceramic package pre-installation inspection requirements)
|
SJ 21449-2018
|
|
SJ 21450-2018
|
(Integrated circuit ceramic package original film thinning process technical requirements)
|
SJ 21450-2018
|
|
SJ 21451-2018
|
(Integrated circuit ceramic package, wafer dicing process technical requirements)
|
SJ 21451-2018
|
|
SJ 21452-2018
|
(Integrated circuit ceramic package, chip adhesive bonding, technical requirements)
|
SJ 21452-2018
|
|
SJ 21453-2018
|
(Integrated circuit ceramic package gold wire bonding process technical requirements)
|
SJ 21453-2018
|
|
SJ 21454-2018
|
(Integrated circuit ceramic package silicon aluminum wire bonding technology technical requirements)
|
SJ 21454-2018
|
|
SJ 21455-2018
|
Integrated circuit ceramic package -- Technical requirements for sealing process with alloy-sintering
|
SJ 21455-2018
|
|
SJ 21456-2018
|
(Military trade electronic system software user manual preparation requirements)
|
SJ 21456-2018
|
|
SJ 21457-2018
|
(Military trade electronic system technical specification preparation requirements)
|
SJ 21457-2018
|
|
SJ 21458-2018
|
(Military trade electronic system product certification document and curriculum requirements)
|
SJ 21458-2018
|
|
SJ 21459-2018
|
(Military trade electronic system operation manual preparation requirements)
|
SJ 21459-2018
|
|
SJ 21460-2018
|
(Military trade electronic system spare parts cataloging requirements)
|
SJ 21460-2018
|
|
SJ 50918/1A-2016
|
(Detailed specification of WJ50 rotary non-wire wound preset potentiometer)
|
SJ 50918/1A-2016
|
|
SJ 50918/2A-2016
|
(Detailed specification of WJ55 rotary non-wire wound preset potentiometer)
|
SJ 50918/2A-2016
|
|
SJ 50918/5-2016
|
(Detailed specification of WJ12 screw drive non-wire wound pre-regulated potentiometer)
|
SJ 50918/5-2016
|
|
SJ 50918/6-2016
|
(Detailed specification of WJ14 screw drive non-wire wound pre-regulated potentiometer)
|
SJ 50918/6-2016
|
|
SJ 50918/7-2016
|
(Detailed specification of WJ22 screw drive non-wire wound pre-regulated potentiometer)
|
SJ 50918/7-2016
|
|
SJ 50918/8-2016
|
(WJ24 type screw drive non-wire wound pre-potentiometer detailed specification)
|
SJ 50918/8-2016
|
|
SJ 50918/9-2016
|
(Detailed specification of WJ26 screw drive non-wire wound preset potentiometer)
|
SJ 50918/9-2016
|
|
SJ 51428/18-2018
|
(GTJ-1B6 + 6T-3 high reliability airborne towed cable detailed specification)
|
SJ 51428/18-2018
|
|
SJ 51428/19-2018
|
(GTJ-1B6 + 6T-1 airborne towed cable detailed specification)
|
SJ 51428/19-2018
|
|
SJ 51428/20-2018
|
(GTS-6B6 + 1T + 2K-1 underwater towed cable detailed specification)
|
SJ 51428/20-2018
|
|
SJ 51428/21-2018
|
(Detailed specification of GZ-1B6b-4 guide optical cable)
|
SJ 51428/21-2018
|
|
SJ 51428/22-2018
|
(GLF-6B6-1 full dielectric cable detailed specification)
|
SJ 51428/22-2018
|
|
SJ 51428/23-2018
|
(Detailed specification of GX-3B6 + 3K-1 tethered cable)
|
SJ 51428/23-2018
|
|
SJ 51428/24-2018
|
(Detailed specification of GTFJY7Y-2B1-2 / 3-2×19×0.26-12T photoelectric composite cable)
|
SJ 51428/24-2018
|
|
SJ 51428/25-2018
|
(Detailed specification of GYFJZU-2B1-2 / 3-2×1×0.3 photoelectric composite cable)
|
SJ 51428/25-2018
|
|
SJ 51428/26-2018
|
(Detailed specification of GYFJZU76-2B1-2 / 3-2×1×0.3 photoelectric composite cable)
|
SJ 51428/26-2018
|
|
SJ 51428/27-2018
|
(Detailed specification of GTFSU-4B1-2 / 3-2×19×0.56-10T photoelectric composite cable)
|
SJ 51428/27-2018
|
|
SJ 51428/28-2018
|
(GTYKU66-10B1-12×19×0.37 steel wire armored optical towline detailed specification)
|
SJ 51428/28-2018
|
|
SJ 51510/10-2018
|
(Ancient band elliptical waveguide assembly detailed specification)
|
SJ 51510/10-2018
|
|
SJ 51510/11-2018
|
(Ķ-band elliptical waveguide assembly detailed specification)
|
SJ 51510/11-2018
|
|
SJ 51510/7-2018
|
(Detailed specification for the small band elliptical waveguide assembly)
|
SJ 51510/7-2018
|
|
SJ 51510/8-2018
|
(C-band elliptical waveguide assembly detailed specification)
|
SJ 51510/8-2018
|
|
SJ 51510/9-2018
|
(Detailed specification of X-band elliptical waveguide components)
|
SJ 51510/9-2018
|
|
SJ 52181/1-2016
|
(20GNC25 aviation cadmium nickel battery pack detailed specification)
|
SJ 52181/1-2016
|
|
SJ 52181/2-2016
|
(20GNC25-(2) Detailed specification for cadmium nickel battery packs for aviation)
|
SJ 52181/2-2016
|
|
SJ 52181/3-2016
|
(20GNC33 Aviation Cadmium Nickel Battery Pack Detailed Specification)
|
SJ 52181/3-2016
|
|
SJ 52181/4-2016
|
(20GNG36-(2) Detailed specification for cadmium nickel battery pack for aviation)
|
SJ 52181/4-2016
|
|
SJ 52181/5-2016
|
(20GNG40A aviation cadmium nickel battery pack detailed specification)
|
SJ 52181/5-2016
|
|
SJ 52181/6-2016
|
(20GNC46 aviation cadmium nickel battery pack detailed specification)
|
SJ 52181/6-2016
|