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Std ID |
Description (Standard Title) |
Detail |
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SJ/T 11460.4-2018
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(Liquid gas forging hammer)
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SJ/T 11460.4-2018
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SJ/T 11684-2018
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(Technical regulations for the design of the surrounding area of the shipbuilding base)
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SJ/T 11684-2018
|
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SJ/T 11720-2018
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High performance computer. Blade server. Compute blade technical requirement for mechanical
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SJ/T 11720-2018
|
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SJ/T 11723-2018
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Electrolyte solution used for lithium ion battery
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SJ/T 11723-2018
|
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SJ/T 11724-2018
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Electrolyte solution used for lithium primary battery
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SJ/T 11724-2018
|
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SJ/T 11726-2018
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Implementation guidance for brand cultivating management system. Electronics and information industry
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SJ/T 11726-2018
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SJ/T 11727-2018
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(Standard penetration test procedure)
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SJ/T 11727-2018
|
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SJ/T 11728-2018
|
Social responsibility management system of information and communication technology industry
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SJ/T 11728-2018
|
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SJ/T 11729-2018
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Specifications of product lifecycle management (PLM)
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SJ/T 11729-2018
|
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SJ/T 11730-2018
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Specification of process data management
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SJ/T 11730-2018
|
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SJ/T 11731-2018
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Specification of steel supply chain collaboration. Requirements and general framework
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SJ/T 11731-2018
|
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SJ/T 11732-2018
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(Ultra long bag pulse bag filter)
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SJ/T 11732-2018
|
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SJ/T 207.1-2018
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Management system for design document--Part 1: Classification and composition of design document
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SJ/T 207.1-2018
|
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SJ/T 2268-2018
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(Nickel-based alloy powder for laser melting in selected area)
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SJ/T 2268-2018
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SJ 20527/10-2016
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(Detailed specification of high-power solid-state amplifier for microwave component WZFD1212-300)
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SJ 20527/10-2016
|
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SJ 20527/11-2016
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(Detailed specification of high-power solid-state amplifier for microwave component WZFD1516-600)
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SJ 20527/11-2016
|
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SJ 20527/12-2016
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(Detailed specification of high-power solid-state amplifier for microwave component WZFD1617-300)
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SJ 20527/12-2016
|
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SJ 20527/9-2016
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(Detailed specification of high-power solid-state amplifier for microwave component WZFD0811-60)
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SJ 20527/9-2016
|
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SJ 21150-2016
|
(Microwave Component Printed Circuit Board Design Guide)
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SJ 21150-2016
|
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SJ 21151-2016
|
(Microwave Component Product Design Guide)
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SJ 21151-2016
|
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SJ 21152-2016
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(Microwave component component selection guide)
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SJ 21152-2016
|
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SJ 21153-2016
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(Microwave component chip mounting process technical requirements)
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SJ 21153-2016
|
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SJ 21154-2016
|
Technique requirements for installation of microwave assembly
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SJ 21154-2016
|
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SJ 21155-2016
|
(Microwave component chip resistors, capacitors, manual soldering process technical requirements)
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SJ 21155-2016
|
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SJ 21156-2016
|
(Microwave module Ω bridge fabrication and installation process technical requirements)
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SJ 21156-2016
|
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SJ 21157-2016
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(Microwave component connection installation process technical requirements)
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SJ 21157-2016
|
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SJ 21158-2016
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(Microwave component capping process technical requirements)
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SJ 21158-2016
|
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SJ 21159-2016
|
(Technical requirements for laser sealing process of microwave components)
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SJ 21159-2016
|
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SJ 21160-2016
|
(Microwave module low pressure leak test method)
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SJ 21160-2016
|
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SJ 21162-2016
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(Microwave filter test method)
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SJ 21162-2016
|
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SJ 21164-2016
|
(Technical requirements for MEMS inertial device wafer thinning and polishing process)
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SJ 21164-2016
|
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SJ 21165-2016
|
(MEMS inertial device wet etching process technical requirements)
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SJ 21165-2016
|
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SJ 21166-2016
|
(MEMS inertial device dicing process technical requirements)
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SJ 21166-2016
|
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SJ 21167-2016
|
(MEMS inertial device wafer bonding process technical requirements)
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SJ 21167-2016
|
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SJ 21168-2016
|
(MEMS inertial device metal film growth process technical requirements)
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SJ 21168-2016
|
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SJ 21169-2016
|
(MEMS inertial device dry etching process technical requirements)
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SJ 21169-2016
|
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SJ 21170-2016
|
(MEMS inertial device dielectric film growth process technical requirements)
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SJ 21170-2016
|
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SJ 21171-2016
|
(MEMS inertial device lithography process technical requirements)
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SJ 21171-2016
|
|
SJ 21172-2016
|
(Printed board safety performance evaluation)
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SJ 21172-2016
|
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SJ 21173-2016
|
(Rigid printed board design requirements)
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SJ 21173-2016
|
|
SJ 21174-2016
|
(Method for inspection of appearance and dimensions of rigid substrates for printed circuits)
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SJ 21174-2016
|
|
SJ 21175-2016
|
(Test method for physical properties of rigid substrates for printed circuits)
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SJ 21175-2016
|
|
SJ 21176-2016
|
(Test method for chemical properties of rigid substrates for printed circuits)
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SJ 21176-2016
|
|
SJ 21177-2016
|
(Test method for electrical properties of rigid substrates for printed circuits)
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SJ 21177-2016
|
|
SJ 21178-2016
|
(Test method for mechanical properties of rigid substrates for printed circuits)
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SJ 21178-2016
|
|
SJ 21179-2016
|
(Environmental test method for rigid substrates for printed circuits)
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SJ 21179-2016
|
|
SJ 21180-2016
|
(Method for inspection of appearance and dimensions of flexible substrates for printed circuits)
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SJ 21180-2016
|
|
SJ 21181-2016
|
(Physical properties test method for flexible substrates for printed circuits)
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SJ 21181-2016
|
|
SJ 21182-2016
|
(Test method for chemical properties of flexible substrates for printed circuits)
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SJ 21182-2016
|
|
SJ 21183-2016
|
(Electrical properties test method for flexible substrates for printed circuits)
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SJ 21183-2016
|
|
SJ 21184-2016
|
(Test method for mechanical properties of flexible substrates for printed circuits)
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SJ 21184-2016
|
|
SJ 21185-2016
|
(Environmental test method for flexible substrates for printed circuits)
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SJ 21185-2016
|
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SJ 21186-2016
|
(Flexible copper clad laminate specification for printed circuits)
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SJ 21186-2016
|
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SJ 21187-2016
|
(Cover specification for flexible printed circuits)
|
SJ 21187-2016
|
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SJ 21188-2016
|
(Specification for bonding materials for flexible printed circuits)
|
SJ 21188-2016
|
|
SJ 21189-2016
|
(Copper clad metal-based laminate specification for printed circuits)
|
SJ 21189-2016
|
|
SJ 21190-2016
|
(Specification for metal foil for printed circuits)
|
SJ 21190-2016
|
|
SJ 21191-2016
|
(Marking ink specification for printed boards)
|
SJ 21191-2016
|
|
SJ 21192-2016
|
(Printed board general specification)
|
SJ 21192-2016
|
|
SJ 21193-2016
|
(Printed board ion migration test methods and requirements)
|
SJ 21193-2016
|
|
SJ 21194-2016
|
(Printed board interconnection stress test methods and requirements)
|
SJ 21194-2016
|
|
SJ 21195-2016
|
(Printed board continuity test method and requirements)
|
SJ 21195-2016
|
|
SJ 21196-2016
|
(Process verification method for low temperature co-fired ceramic degumming sintering furnace)
|
SJ 21196-2016
|
|
SJ 21197-2016
|
(Thick film chain sintering furnace process verification method)
|
SJ 21197-2016
|
|
SJ 21198-2016
|
(Laser trimming machine process verification method)
|
SJ 21198-2016
|
|
SJ 21199-2016
|
(Horizontal plasma enhanced chemical vapor deposition (PECVD) equipment process verification method)
|
SJ 21199-2016
|
|
SJ 21200-2016
|
(General specification for flat plasma enhanced chemical vapor deposition equipment)
|
SJ 21200-2016
|
|
SJ 21227-2016
|
(Aerospace grade tantalum capacitor process validation documentation requirements)
|
SJ 21227-2016
|
|
SJ 21228-2016
|
(Aerospace grade tantalum capacitor manufacturing process control requirements)
|
SJ 21228-2016
|
|
SJ 21229-2016
|
(Aerospace grade tantalum capacitor inconsistent control requirements)
|
SJ 21229-2016
|
|
SJ 21230-2016
|
(Structural Analysis of Tantalum Capacitors)
|
SJ 21230-2016
|
|
SJ 21231-2016
|
(Key material selection and control requirements for aerospace grade tantalum capacitors)
|
SJ 21231-2016
|
|
SJ 21232-2016
|
(Limit test for tantalum capacitors for aerospace)
|
SJ 21232-2016
|
|
SJ 21233-2016
|
(Aerospace grade tantalum capacitor design requirements)
|
SJ 21233-2016
|
|
SJ 21234-2016
|
(Aerospace grade tantalum capacitor production line control requirements)
|
SJ 21234-2016
|
|
SJ 21240-2018
|
(General specification for cantilever plating systems)
|
SJ 21240-2018
|
|
SJ 21241-2018
|
(General specification for electroless plating stations)
|
SJ 21241-2018
|
|
SJ 21242-2018
|
(General specification for wafer bump plating equipment)
|
SJ 21242-2018
|
|
SJ 21243-2018
|
(Lead frame plating system general specification)
|
SJ 21243-2018
|
|
SJ 21244-2018
|
(High-speed automatic plating system general specification)
|
SJ 21244-2018
|
|
SJ 21245-2018
|
(General specification for vacuum soldering equipment)
|
SJ 21245-2018
|
|
SJ 21246-2018
|
(Precision assembly system process verification method)
|
SJ 21246-2018
|
|
SJ 21247-2018
|
(Micro-assembly electroplating system process verification method)
|
SJ 21247-2018
|
|
SJ 21248-2018
|
Technological verification procedures for vacuum soldering equipment
|
SJ 21248-2018
|
|
SJ 21256-2018
|
Technological verification procedures for film sputtering equipment
|
SJ 21256-2018
|
|
SJ 21257-2018
|
(General specification for ion beam sputtering coating equipment)
|
SJ 21257-2018
|
|
SJ 21258-2018
|
(Dry etching equipment process verification method)
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SJ 21258-2018
|
|
SJ 21259-2018
|
Technological verification procedures for polishing equipment
|
SJ 21259-2018
|
|
SJ 21260-2018
|
Technological verification procedures for metal-organic chemical vapor deposition(MOCVD)equipment
|
SJ 21260-2018
|
|
SJ 21303-2018
|
(General requirements for electronic equipment PBOM and MBOM)
|
SJ 21303-2018
|
|
SJ 21304-2018
|
(Electronic equipment digital technology basic terminology)
|
SJ 21304-2018
|
|
SJ 21305-2018
|
(Manufacturability analysis requirements for electronic equipment printed board assemblies)
|
SJ 21305-2018
|
|
SJ 21306-2018
|
(3D model simplification and lightweight requirements for electronic equipment)
|
SJ 21306-2018
|
|
SJ 21307-2018
|
(Electronic equipment sheet metal craft method graphic symbol)
|
SJ 21307-2018
|
|
SJ 21308-2018
|
(Electronic equipment based on model definition of sheet metal process representation)
|
SJ 21308-2018
|
|
SJ 21309-2018
|
(Electronic equipment assembly process method graphic symbol)
|
SJ 21309-2018
|
|
SJ 21310-2018
|
(Assembly process representation of electronic equipment based on model definition)
|
SJ 21310-2018
|
|
SJ 21311-2018
|
(Electronic equipment three-dimensional machine plus process data set requirements)
|
SJ 21311-2018
|
|
SJ 21312-2018
|
(General requirements for digital measurement of electronic equipment structures)
|
SJ 21312-2018
|
|
SJ 21313-2018
|
(General requirements for simulation analysis of electronic equipment structure dynamics)
|
SJ 21313-2018
|