|
Std ID |
Description (Standard Title) |
Detail |
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SJ/Z 21357-2018
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Design guidelines for chip stacking process of SiP products
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SJ/Z 21357-2018
|
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SJ/Z 21409-2018
|
(Radar Safeguard Design Guide)
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SJ/Z 21409-2018
|
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SJ/Z 21412-2018
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(Radar Admission Terminal Equipment Test Performance Design Guide)
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SJ/Z 21412-2018
|
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SJ/Z 21413-2018
|
(Command Information System Reliability Design Guide)
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SJ/Z 21413-2018
|
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SJ/Z 21414-2018
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(Command Information System Maintainability Design Guide)
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SJ/Z 21414-2018
|
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SJ/Z 21415-2018
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(Electronic countermeasures system reliability design guide)
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SJ/Z 21415-2018
|
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SJ/Z 21416-2018
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(Electronic countermeasures system testability design guide)
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SJ/Z 21416-2018
|
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SJ/Z 21417-2018
|
(Military Embedded Computer Reliability Design Guide)
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SJ/Z 21417-2018
|
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SJ/Z 21426-2018
|
(Military electronic equipment electrical performance simulation model guide)
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SJ/Z 21426-2018
|
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SJ/Z 21427-2018
|
(Military Electronic Equipment Antenna Array Simulation Guide)
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SJ/Z 21427-2018
|
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SJ 20611A-2018
|
(Microwave noise source test method)
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SJ 20611A-2018
|
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SJ 20749A-2018
|
Specification for copper-clad PTFE woven Mass fabric laminate for microwave circuit
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SJ 20749A-2018
|
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SJ 21250-2018
|
(Process verification method for cooked ceramic laser cutting machine)
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SJ 21250-2018
|
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SJ 21251-2018
|
(General specification for automated optical inspection systems)
|
SJ 21251-2018
|
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SJ 21252-2018
|
(Automatic optical inspection system process verification method)
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SJ 21252-2018
|
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SJ 21253-2018
|
(Screen printing machine process verification method)
|
SJ 21253-2018
|
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SJ 21254-2018
|
(Double-sided lithography machine process verification method)
|
SJ 21254-2018
|
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SJ 21255-2018
|
(Monolithic rotary developing device process verification method)
|
SJ 21255-2018
|
|
SJ 21275-2018
|
(Protection requirements for electrostatic sensitive and humidity sensitive components for microwave components)
|
SJ 21275-2018
|
|
SJ 21276-2018
|
(Microwave component bonding process technical requirements)
|
SJ 21276-2018
|
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SJ 21277-2018
|
Technical requirements for semi-aqueous cleaning technology of microwave assembly
|
SJ 21277-2018
|
|
SJ 21278-2018
|
(Microwave limiter test method)
|
SJ 21278-2018
|
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SJ 21279-2018
|
(Microwave detection logarithmic video amplifier test method)
|
SJ 21279-2018
|
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SJ 21280-2018
|
(Printed board rework and rework)
|
SJ 21280-2018
|
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SJ 21282-2018
|
(Printed onboard flow design requirements)
|
SJ 21282-2018
|
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SJ 21283-2018
|
(Printed board impedance control and high speed logic design requirements)
|
SJ 21283-2018
|
|
SJ 21285-2018
|
(Buried component printed board design requirements)
|
SJ 21285-2018
|
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SJ 21286-2018
|
Specification for fabric woven from glass for printed circuit boards
|
SJ 21286-2018
|
|
SJ 21287-2018
|
Specification for resin coated copper foil of HDI printed circuit board
|
SJ 21287-2018
|
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SJ 21288-2018
|
Specification of embedded component resistive materials for printed circuit boards
|
SJ 21288-2018
|
|
SJ 21289-2018
|
Specification of embedded components capacitor materials for printed circuit boards
|
SJ 21289-2018
|
|
SJ 21290-2018
|
Technical requirements of carbide drills for printed circuit boards
|
SJ 21290-2018
|
|
SJ 21291-2018
|
(Printed board pad specification)
|
SJ 21291-2018
|
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SJ 21292-2018
|
(Phosphorus copper anode specification for printed boards)
|
SJ 21292-2018
|
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SJ 21293-2018
|
Specification of photo imageable etching and plating resist ink
|
SJ 21293-2018
|
|
SJ 21294-2018
|
Performance specification for embedded passive devices printed circuit boards
|
SJ 21294-2018
|
|
SJ 53931/1-2018
|
(GJZH2s / 2-04 photoelectric composite rotary connector detailed specification)
|
SJ 53931/1-2018
|
|
SJ 53931/2-2018
|
(GJZH2s / 2-05 photoelectric composite rotary connector detailed specification)
|
SJ 53931/2-2018
|
|
SJ 53931/3-2018
|
(GJZH2s / 4-02 photoelectric composite rotary connector detailed specification)
|
SJ 53931/3-2018
|
|
SJ 54409/10-2016
|
(Detailed specification of CY-YZ-103 gauge pressure sensor)
|
SJ 54409/10-2016
|
|
SJ 54409/11-2016
|
(Detailed specification of CY-YZ-104 gauge pressure sensor)
|
SJ 54409/11-2016
|
|
SJ 54409/12-2016
|
(Detailed specification of CY-YZ-105 gauge pressure sensor)
|
SJ 54409/12-2016
|
|
SJ 54409/13-2016
|
(Detailed specification of CY-YZ-106 gauge pressure sensor)
|
SJ 54409/13-2016
|
|
SJ 54409/8-2016
|
(Detailed specification of CY-YZ-101 gauge pressure sensor)
|
SJ 54409/8-2016
|
|
SJ 54409/9-2016
|
(Detailed specification of CY-YZ-102 gauge pressure sensor)
|
SJ 54409/9-2016
|
|
SJ 54411/3-2018
|
(GZH-004 photoelectric composite cable assembly detailed specification)
|
SJ 54411/3-2018
|
|
SJ 56790/1-2018
|
(GLH-2/2 / Z-02 socket connector detailed specification)
|
SJ 56790/1-2018
|
|
SJ 57244/1-2018
|
(Detailed specification of GLH-2S / 2 / 27M / T(Z)-03 photoelectric composite watertight connector)
|
SJ 57244/1-2018
|
|
SJ 57244/2-2018
|
(Detailed specification of GLH-10/12 / 56M-01 photoelectric composite watertight connector)
|
SJ 57244/2-2018
|
|
SJ/Z 20694A-2018
|
(Radar maintainability design guide)
|
SJ/Z 20694A-2018
|
|
SJ/Z 21329-2018
|
(Metal Housing Design Guide)
|
SJ/Z 21329-2018
|
|
SJ/Z 21335-2018
|
(Radar Reliability Design Guide)
|
SJ/Z 21335-2018
|
|
SJ/Z 21338-2018
|
(Radar Admission Terminal Equipment Reliability Design Guide)
|
SJ/Z 21338-2018
|
|
SJ/Z 21339-2018
|
(Radar Admission Terminal Equipment Maintainability Design Guide)
|
SJ/Z 21339-2018
|
|
SJ/Z 21340-2018
|
Design guideline for superconducting filter
|
SJ/Z 21340-2018
|
|
SJ/Z 21341-2018
|
(Low Temperature Low Noise Amplifier Design Guide)
|
SJ/Z 21341-2018
|
|
SJ/Z 21350-2018
|
(Erbium-doped silicate scintillation crystal design guide)
|
SJ/Z 21350-2018
|
|
SJ/Z 21354-2018
|
Design guidelines for assemblability of SiP products
|
SJ/Z 21354-2018
|
|
SJ/Z 21355-2018
|
Design guidelines for hermetic package of SiP products
|
SJ/Z 21355-2018
|
|
SJ/Z 21356-2018
|
Design guidelines for flip chip bonding process of SiP products
|
SJ/Z 21356-2018
|
|
SJ 21321-2018
|
(General specification for grinding wheel dicing machine)
|
SJ 21321-2018
|
|
SJ 21322-2018
|
(Grinding wheel dicing machine process verification method)
|
SJ 21322-2018
|
|
SJ 21323-2018
|
(Fully automatic wire bonding machine general specification)
|
SJ 21323-2018
|
|
SJ 21333-2018
|
(Ceramic shell and metal shell brazing process technical requirements)
|
SJ 21333-2018
|
|
SJ 21334-2018
|
Ceramic packages and metal packages Technical requirements for nickel electroplating process
|
SJ 21334-2018
|
|
SJ 21366-2018
|
(Disposable battery 钽 column housing specifications)
|
SJ 21366-2018
|
|
SJ 21367-2018
|
(Disposable lithium battery T-shaped circular pole shell specification)
|
SJ 21367-2018
|
|
SJ 21368-2018
|
(Disposable lithium battery split housing specification)
|
SJ 21368-2018
|
|
SJ 21369-2018
|
(Disposable lithium battery flat case specification)
|
SJ 21369-2018
|
|
SJ 21372-2018
|
(Highly reliable traveling wave tube thermal measurement process control requirements)
|
SJ 21372-2018
|
|
SJ 21373-2018
|
(Highly reliable traveling wave tube attenuator manufacturing process control requirements)
|
SJ 21373-2018
|
|
SJ 21374-2018
|
(High reliability traveling wave tube slow wave component clamping process control requirements)
|
SJ 21374-2018
|
|
SJ 21375-2018
|
(High reliability traveling wave tube electron gun mounting process control requirements)
|
SJ 21375-2018
|
|
SJ 21376-2018
|
(Highly reliable traveling wave tube cold test process control requirements)
|
SJ 21376-2018
|
|
SJ 21377-2018
|
(Highly reliable traveling wave tube exhaust process control requirements)
|
SJ 21377-2018
|
|
SJ 21378-2018
|
(High reliability traveling wave tube spiral winding process control requirements)
|
SJ 21378-2018
|
|
SJ 21379-2018
|
(Electromigration effect test method)
|
SJ 21379-2018
|
|
SJ 21380-2018
|
(Hot carrier effect test method)
|
SJ 21380-2018
|
|
SJ 21381-2018
|
Test method for time dependent dielectric breakdown (TDDB)
|
SJ 21381-2018
|
|
SJ 21382-2018
|
(Ion implantation uniformity test method)
|
SJ 21382-2018
|
|
SJ 21383-2018
|
(P-N junction isolation test method)
|
SJ 21383-2018
|
|
SJ 21384-2018
|
(Capacitor-voltage test method for movable charge of oxide layer)
|
SJ 21384-2018
|
|
SJ 21392-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21392-2018
|
|
SJ 21393-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21393-2018
|
|
SJ 21394-2018
|
(Technical requirements for metallization of multi-layer co-fired ceramics)
|
SJ 21394-2018
|
|
SJ 21395-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21395-2018
|
|
SJ 21396-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21396-2018
|
|
SJ 21397-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21397-2018
|
|
SJ 21398-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21398-2018
|
|
SJ 21406-2018
|
(Microelectronics packaged ceramic housings)
|
SJ 21406-2018
|
|
SJ 21407-2018
|
(Microelectronics package ceramics and metal casings)
|
SJ 21407-2018
|
|
SJ 21408-2018
|
(Microelectronic package ceramic housing Laser cutting and marking process technical requirements)
|
SJ 21408-2018
|
|
SJ 21418-2018
|
Terminology of software defined radio
|
SJ 21418-2018
|
|
SJ 21419-2018
|
General requirements for reconfiguration of software defined radio
|
SJ 21419-2018
|
|
SJ 21420-2018
|
General requirements for hardware architecture of software defined radio
|
SJ 21420-2018
|
|
SJ 21421-2018
|
(General requirements for software radio software architecture)
|
SJ 21421-2018
|
|
SJ 21422-2018
|
General requirements for integration bus of software defined radio
|
SJ 21422-2018
|
|
SJ 21423-2018
|
(General requirements for the software radio software platform framework)
|
SJ 21423-2018
|
|
SJ 21424-2018
|
General requirements for data transmission format of software defined radio
|
SJ 21424-2018
|
|
SJ 21425-2018
|
(General requirements for software radio resource management)
|
SJ 21425-2018
|