GB/T 4724-2017 English PDF

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GB/T 4724-2017: Composite base copper clad laminated sheets for printed circuits
Status: Valid

GB/T 4724: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 4724-2017	199	Add to Cart	3 days	Composite base copper clad laminated sheets for printed circuits	Valid
GB/T 4724-1992	279	Add to Cart	3 days	Epoxide cellulose paper copper-clad laminated sheets for printed circuits	Obsolete

Similar standards

GB/T 12631   GB/T 4725   GB/T 4721   

Basic data

Standard ID: GB/T 4724-2017 (GB/T4724-2017)
Description (Translated English): Composite base copper clad laminated sheets for printed circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Classification of International Standard: 31.180
Word Count Estimation: 10,133
Date of Issue: 2017-07-31
Date of Implementation: 2018-02-01
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 4724-2017: Composite base copper clad laminated sheets for printed circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Composite base copper clad laminated sheets for printed circuits ICS 31.180 L30 National Standards of People's Republic of China Replacing GB/T 4724-1992 Printed circuit with copper clad laminate substrate 2017-07-31 Posted 2018-02-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 4724-1992 "Printed circuit with copper foil epoxy paper laminate", compared with the GB/T 4724-1992 main Technical changes are as follows. --- Added 5 models (see Chapter 3); --- Remove the copper resistance, surface corrosion, edge corrosion, pull-off strength (see 5.3); --- Increased dimensional stability, glass transition temperature, arc resistance, breakdown voltage, thermal decomposition temperature, Z-axis expansion coefficient (CTE), heat Stratified time, halogen content, compared to tracking index 9 indicators (see 5.3); --- Performance index system adjusted, the performance conditions were modified accordingly, the surface resistivity and volume resistivity of the wet heat treatment Condition C-96/40/90 was changed to C-96/35/90 (see 5.3). This standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard by the National Standardization Technical Committee printed circuit board (SAC/TC47) centralized. This standard was drafted unit. Shaanxi Health Technology Co., Ltd., Guangdong Shengyi Technology Co., Ltd., the National Electronic Circuit substrate engineering Technology Research Center, Suzhou Health Technology Co., Ltd., China Electronics Standardization Institute. The main drafters of this standard. Su Xiaosheng, Zeng Yaode, Yang Wentao, Wang Jinrui, Wang Huanbao, Cai Qiaoer, Luo Penghui, Cao Yi. This standard replaces the standards previously issued as. --- GB/T 4724-1984, GB/T 4724-1992. Printed circuit with copper clad laminate substrate

1 Scope

This standard specifies the classification of printed circuit board with copper clad laminates, materials, performance requirements, test methods, quality assurance requirements, Packaging, marking, transportation and storage. This standard applies to the thickness of 0.5mm and above the single or double-sided copper clad paper cellulose fiberglass cloth laminated veneer and copper foil Fiberglass core fiberglass cloth veneer laminate (hereinafter referred to as CCL).

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 1913.2 printed board bleached wood pulp paper GB/T 4721 printed circuit board with copper clad laminate general rules Test method for rigid copper clad laminates for printed circuits GB/T GB/T 5230 electrolytic copper foil GB/T 18373 PCB with E glass fiber cloth SJ/T 11282 printed circuit board with E glass fiber paper specification

3 product categories

This standard includes the CCL model, composition and characteristics shown in Table 1, copper clad laminate base plate model correspondence between see Appendix A. Table 1 CCL model, composition and characteristics Model composition characteristics CPFCP (G) -22F glass fiber cloth, cellulose paper core, phenolic resin as the main general-purpose, flame retardant CEPCP (G) -23F glass fiber cloth, cellulose paper core, epoxy resin as the main general, flame retardant CEPCP (G) -24F glass fiber cloth, cellulose paper core, epoxy resin as the main High thermal reliability, flame retardancy CEPCP (G) -25F fiberglass cloth, cellulose paper core, epoxy resin as the main halogen-free, flame retardant CEPGM (G) -41F glass fiber cloth, fiberglass paper core, epoxy resin as the main general-purpose, flame retardant CEPGM (G) -42F glass fiber cloth, fiberglass paper core, epoxy resin as the main high thermal reliability, flame retardancy CEPGM (G) -43F glass fiber cloth, glass fiber core, epoxy resin as the main halogen-free, flame retardant

4 material

4.1 copper foil Copper foil for CCL, GB/T 5230 should be consistent with the provisions. For GB/T 5230 does not include the copper foil, the requirements should be referred to ......

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