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GB/T 42905-2023 English PDF

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GB/T 42905-2023: Test method for thickness of silicon carbide epitaxial layer - Infrared reflectance method
Status: Valid
Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 42905-2023189 Add to Cart 3 days Test method for thickness of silicon carbide epitaxial layer - Infrared reflectance method Valid

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Basic data

Standard ID: GB/T 42905-2023 (GB/T42905-2023)
Description (Translated English): Test method for thickness of silicon carbide epitaxial layer - Infrared reflectance method
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H21
Classification of International Standard: 77.040
Word Count Estimation: 10,165
Date of Issue: 2023-08-06
Date of Implementation: 2024-03-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 42905-2023: Test method for thickness of silicon carbide epitaxial layer - Infrared reflectance method


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 77.040 CCSH21 National Standards of People's Republic of China Testing of silicon carbide epitaxial layer thickness by infrared reflection method Published on 2023-08-06 2024-03-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is jointly developed by the National Semiconductor Equipment and Materials Standardization Technical Committee (SAC/TC203) and the National Semiconductor Equipment and Materials Standards It was jointly proposed and coordinated by the Materials Sub-Technical Committee of the Chemistry Technical Committee (SAC/TC203/SC2). This document was drafted by. Anhui Changfei Advanced Semiconductor Co., Ltd., Anhui Xinle Semiconductor Co., Ltd., Hebei Puxing Electronic Technology Co., Ltd. Co., Ltd., Guangdong Tianyu Semiconductor Co., Ltd., Nanjing Guosheng Electronics Co., Ltd., Zhejiang Xinke Semiconductor Co., Ltd., Bruker (Beijing) Technology Co., Ltd., Institute of Semiconductors, Chinese Academy of Sciences, and Institute of Nonferrous Metals Technology and Economics Co., Ltd. The main drafters of this document. Niu Yingxi, Liu Min, Yuan Song, Zhao Lixia, Ding Xiongjie, Wu Huiwang, Qiu Guangyin, Li Suqing, Li Jingbo, Zhang Huijuan, Zhao Yue, Peng Tiekun, Lei Haodong, Yan Guoguo. Testing of silicon carbide epitaxial layer thickness by infrared reflection method

1 Scope

This document describes a method for testing the thickness of silicon carbide epitaxial layers using infrared reflection. This document is applicable to silicon carbide substrates with n-type doping concentration greater than 1×1018cm-3 and homogeneous doping concentration less than 1×1016cm-3. Testing of homogeneous silicon carbide epitaxial layer thickness, the test range is 3μm~200μm.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 6379.2 Accuracy of measurement methods and results (correctness and precision) Part 2.Determination of repeatability of standard measurement methods Basic methods of sex and reproducibility GB/T 14264 Semiconductor material terminology

3 Terms and definitions

The terms and definitions defined in GB/T 14264 apply to this document.

4 Method Principles

The difference in optical constants between the silicon carbide substrate and the epitaxial layer causes optical interference of continuous maximum and minimum characteristic spectra in the reflection spectrum of the sample. Phenomenon, calculated based on the extreme wave number of the interference fringe in the reflection spectrum, the optical constants of the epitaxial layer and the substrate, and the incident angle of the infrared beam on the sample. Find the corresponding epitaxial layer thickness. The schematic diagram of the thickness detection principle of the silicon carbide epitaxial layer is shown in Figure 1.
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