Home Cart Quotation About-Us
www.ChineseStandard.net
SEARCH

GB/T 35010.7-2018 English PDF

Q: How long will the true-PDF of English version of GB/T 35010.7-2018 be delivered?

Upon your order, we will start to translate GB/T 35010.7-2018_English as soon as possible, and keep you informed of the progress. The lead time is typically 3 ~ 5 working days. The lengthier the document the longer the lead time.

Q: Can I share the purchased PDF of GB/T 35010.7-2018_English with my colleagues?

Yes. The purchased PDF of GB/T 35010.7-2018_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Q: Does the price include tax/VAT?

Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries). Avoidance of Double Taxation Agreements (DTAs) between Singapore and 100+ Countries: https://www.iras.gov.sg/taxes/international-tax

Q: Do you accept my currency other than USD?

Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.

US$644.00 · In stock
Delivery: <= 5 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 35010.7-2018: Semiconductor die products -- Part 7: XML schema for data exchange
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 35010.7-2018	644	Add to Cart	5 days	Semiconductor die products -- Part 7: XML schema for data exchange	Valid

Similar standards

GB/T 43770 GB/T 43978 SAMR 76 GB/T 35010.3 GB/T 35010.4 GB/T 35010.2

Basic data

Standard ID: GB/T 35010.7-2018 (GB/T35010.7-2018)
Description (Translated English): Semiconductor die products -- Part 7: XML schema for data exchange
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L55
Classification of International Standard: 31.200
Word Count Estimation: 34,346
Date of Issue: 2018-03-15
Date of Implementation: 2018-08-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 35010.7-2018: Semiconductor die products -- Part 7: XML schema for data exchange

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor die products--Part 7. XML schema for data exchange ICS 31.200 L55 National Standards of People's Republic of China Semiconductor chip products Part 7. XML format for data exchange (IEC /T R62258-7.2007, IDT) Published by.2018-03-15 2018-08-01 Implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China China National Standardization Administration released Directory Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 General 1 5 Data Exchange 2 Appendix A (Normative) XML Format 3 Appendix B (Informative) XML Example 19

Foreword

GB/T 35010 "Semiconductor Chip Products" is divided into the following parts. --- Part 1. Procurement and use requirements; --- Part 2. Data exchange format; --- Part 3. Guidelines for handling, packaging, and storage; --- Part 4. Chip user and supplier information table; --- Part 5. Electrical Simulation Requirements; --- Part 6. Thermal Simulation Requirements; --- Part 7. XML format for data exchange; --- Part 8. EXPRESS format for data exchange. This part is Part 7 of GB/T 35010. This section was drafted in accordance with the rules given in GB/T 1.1-2009. This section uses the translation method equivalent to the use of IEC /T R62258-7.2007 "semiconductor chip product part 7. data exchange XML format. The Chinese documents that have a consistent correspondence with the normatively quoted international documents in this section are as follows. ---GB/T 2900 (all parts) Electrical terminology [IEC 60050 (all parts)] --- GB/T 35010.1-2018 Semiconductor chip products - Part 1. Procurement and use (IEC 62258-1.2009, IDT) --- GB/T 35010.2-2018 Semiconductor chip products Part 2. Data exchange format (IEC 62258-2.2011, IDT) ---GB/T 35010.4-2018 Semiconductor chip products Part 4. Chip user and supplier requirements (IEC /TR 62258-4.2012, IDT) --- GB/T 35010.5-2018 Semiconductor chip products - Part 5. Electrical simulation requirements (IEC 62258-5.2006, IDT) --- GB/T 35010.6-2018 Semiconductor chip products - Part 6. Thermal simulation requirements (IEC 62258-6.2006, IDT) This section made the following editorial changes. --- Deleted the third paragraph of Chapter 5 of IEC /T R62258-7.2007 on the electronic text of IEC /T R62258-7.2007 Take the method and use the required content; --- Deleted references. Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents. This section was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section was drafted by. China Electronics Technology Group Corporation No. 58 Research Institute, Peking University, Tsinghua University, Harbin Institute of Technology, China Microelectronics Electronic Co., Ltd. The main drafters of this section. Zhang Huibin, Lu Jian, Zhao Hua, Wang Fei, Wang Yating, Wang Ziqiang, Zhang Wei, Chen Yang Semiconductor chip products Part 7. XML format for data exchange

1 Scope

This part of GB/T 35010 is used to guide the production, supply and use of semiconductor chip products. One of the semiconductor chip products includes. --- Wafers; ---Single bare chip; --- Chips and wafers with interconnect structures; --- Minimal or partially packaged chips and wafers. This section specifies an XML format that defines the elements required for data exchange to meet IEC 62258-1, IEC 62258- 5. Implementation requirements of IEC 62258-6, supplementing the exchange structure defined in IEC 62258-2. This section is also complementary and compatible Questionnaire in IEC /T R62258-4.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. IEC 60050 (all parts) Electrical vocabulary (International Electrotechnical Vocabulary) IEC 62258-1 Semiconductor chip products Part 1. Procurement and use requirements (Semiconductor die products-Part 1.Requirementsforprocurementanduse) IEC 62258-2 Semiconductor chip products Part 2. Data interchange formats (Semiconductor die products-Part 2. Exchangedataformats) IEC /TR62258-4 Semiconductor chip products Part 4. Chip user and supplier requirements (Semiconductordie products-Part 4.Questionnairefordieusersandsuppliers) IEC 62258-5 Semiconductor chip products - Part 5. Electrical simulation requirements (Semiconductordieproducts-Part 5. Requirementsforinformationconcerningelectricalsimulation) IEC 62258-6 Semiconductor chip products Part 6. Thermal simulation requirements (Semiconductor die products-Part 6. Re- Quirementsforinformationconcerningthermalsimulation)

3 Terms and definitions

The terms and definitions defined by IEC 60050 (all parts) and IEC 62258-1 apply to this document.

4 General

The format in this section is consistent with Extensible Markup Language (XML). This section requires chip device suppliers to provide users with the necessary and sufficient stages for the design, procurement, manufacturing, and testing of chip devices. Information. The format in Appendix A defines an exchange mechanism that builds information for statements in the XML language. This is also for To achieve the purpose of compliance with this section. ......

Image

Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 35010.7-2018_English be delivered?

Answer: Upon your order, we will start to translate GB/T 35010.7-2018_English as soon as possible, and keep you informed of the progress. The lead time is typically 3 ~ 5 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 35010.7-2018_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 35010.7-2018_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.