GB/T 35010.3-2018 English PDF

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GB/T 35010.3-2018: Semiconductor die products -- Part 3: Guide for handling, packing and storage
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 35010.3-2018	599	Add to Cart	5 days	Semiconductor die products -- Part 3: Guide for handling, packing and storage	Valid

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Basic data

Standard ID: GB/T 35010.3-2018 (GB/T35010.3-2018)
Description (Translated English): Semiconductor die products -- Part 3: Guide for handling, packing and storage
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L55
Classification of International Standard: 31.200
Word Count Estimation: 30,396
Date of Issue: 2018-03-15
Date of Implementation: 2018-08-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 35010.3-2018: Semiconductor die products -- Part 3: Guide for handling, packing and storage

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor die products--Part 3. Guide for handling, packing and storage ICS 31.200 L55 National Standards of People's Republic of China Semiconductor chip products Part 3. Guidelines for handling, packaging and storage Published by.2018-03-15 2018-08-01 Implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China China National Standardization Administration released Directory Preface I 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Operation 1 4.1 General rule 1 4.2 Work Environment Control 1 4.3 General Notes 2 4.4 Clean Area 2 5 Process Operation 5 5.1 Wafer Thinning 5 5.2 Wafer Dicing 5 5.3 Chip Sorting Process 7 6 Transfer, Storage and Packaging of Chip Products 9 6.1 General Clause 9 6.2 Wafer Carriers and Wafer Boxes 9 6.3 Wafer Online Storage and Transmission 9 6.4 Packaging without Open Wafers 10 6.5 Wrapped wafers 11 6.6 Single Wafer Packaging 12 6.7 Chip Tray (Box) Packaging 13 6.8 Chip Carrier Packaging 16 6.9 Handling and Packaging of Thin Chip Products 18 6.10 Secondary packaging during transport 18 6.11 Recycling of packaging materials 19 7 Short-term and long-term storage of chip products 19 7.1 General 19 7.2 Short-term storage of chip products 19 7.3 Long-term storage of chip products 19 8 Traceability 21 8.1 General Rule 21 8.2 Wafer traceability 21 8.3 Traceability of Chips 21 8.4 The back of the chip product identifies 22 Appendix A (Informative) Schedule Checklist 23

Foreword

GB/T 35010 "Semiconductor Chip Products" is divided into the following parts. --- Part 1. Procurement and use requirements; --- Part 2. Data exchange format; --- Part 3. Guidelines for handling, packaging and storage; --- Part 4. Chip user and supplier requirements; --- Part 5. Electrical Simulation Requirements; --- Part 6. Thermal Simulation Requirements; --- Part 7. XML format for data exchange; --- Part 8. EXPRESS format for data exchange. This part is Part 3 of GB/T 35010. This section was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents. This section was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section was drafted by. China Electronics Technology Group Corporation No. 13 Research Institute, Jilin Hua Microelectronics Co., Ltd., Shengbang Microelectronics (Beijing) Co., Ltd. and China Electronics Standardization Institute. The main drafters of this section are. Wang Guoquan, Qi Lifang, Bo Ruiyan, Zhang Hao, Han Dong, Ma Jianguo, Zhu Hua, and Chen Dawei. Semiconductor chip products Part 3. Guidelines for handling, packaging and storage

1 Scope

This part of GB/T 35010 gives general requirements for the operation, packaging and storage of semiconductor chip products. This section applies to the operation, packaging, storage and use of semiconductor chip products (hereinafter referred to as chip products). The semiconductor chip products referred to in this section include. --- Wafers; ---Single bare chip; --- Chips and wafers with interconnect structures; ---Minimum or partially packaged chips and wafers.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 2900 (all parts) Electrical terminology GB/T 25915.1-2010 Cleanrooms and related controlled environments - Part 1. Air cleanliness class GB/T 35010.1-2018 Semiconductor chip products Part 1. Procurement and use requirements IEC 61340-5-1 Electrostatics-Section 5-1. General requirements for electrostatic protection of electronic devices (Electrostatics-Part 5-1. Protectionofelectronicdevicesfrom electrostaticphenomena-Generalrequirements) IEC 61340-5-2 Electrostatics - Part 5-2. Electrostatic Protection User Guide for Electronic Devices (Electrostatics-Part 5-2. Protectionofelectronicdevicesfromelectrostaticphenomena-Userguide)

3 Terms and definitions

The terms and definitions defined in GB/T 2900 (all parts) and GB/T 35010.1-2018 apply to this document.

4 Operation

4.1 General rules During the operation of the chip product, special tools should be used to avoid contact with the bare active surface of the chip product; when the contact is inevitable When free, special tools and materials should be used. The tools, materials and storage containers used during the operation and delivery of the chip products shall comply with the corresponding anti-static requirements (see IEC 61340-5-1, IEC 61340-5-2). During the operation of the chip product, attention should be paid to the sensitivity of the chip to specific chemical substances. Recommendations See Appendix A for an example planning checklist. 4.2 Work Environment Control The typical process environmental conditions for general-purpose semiconductor processes (excluding the storage of chip products) are as follows. ......

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