GB/T 28858-2012 English PDFUS$279.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 28858-2012: Encapsulating material of phenolic for electronic components Status: Valid
Basic dataStandard ID: GB/T 28858-2012 (GB/T28858-2012)Description (Translated English): Encapsulating material of phenolic for electronic components Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L90 Classification of International Standard: 31.030 Word Count Estimation: 12,175 Quoted Standard: GB/T 1408.1-2006; GB/T 1409-2006; GB/T 2411-2008; GB/T 4722; GB/T 6003.1-1997; GB/T 10064-2006 Regulation (derived from): National Standards Bulletin 2012 No. 28 Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This standard specifies the phenolic encapsulation materials for electronic components (hereinafter referred to as encapsulation materials) classification, technical requirements, inspection rules, test methods, packaging, labeling, storage and transporta GB/T 28858-2012: Encapsulating material of phenolic for electronic components---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.Encapsulating material of phenolic for electronic components ICS 31.030 L90 National Standards of People's Republic of China Electronic Component encapsulation materials with phenolic Issued on. 2012-11-05 2013-02-15 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released ForewordThis standard was drafted in accordance with GB/T 1.1-2009 given rules. The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points. This standard was drafted. Xianyang Wei-hua Insulation Materials Co., Ltd., Xianyang Reid Electronic Technology Co., Ltd., Yantai namics Electronic Materials Ltd., Shandong Laizhou Smooth Electronic Materials Co., Matsuda Shantou High-tech Zone Industrial Co., Ltd., China Electronics Standardization Institute Studies, Shaanxi Huaxing Electronics Group Co., Ltd., Chengdu Hongming Electronics Co., Ltd., Beijing Seven Star flight Electronics Co., Ltd., Michael Falkenhausen G (Changzhou) Services Limited. The main drafters of this standard. High Yan Ru, Liu Nianjie, Zhang Ping, Huang Ruinan, Liu Yun, Peihui Chuan, Realing. Electronic Component encapsulation materials with phenolic1 ScopeThis standard specifies the encapsulation of electronic components with phenolic material (hereinafter referred to as encapsulation materials) classification, technical requirements, inspection rules, test methods, Packaging, labeling, storage and transportation requirements. This standard applies to ceramic capacitors, piezoelectric ceramic element, thermistor, thick film circuit and other electronic components encapsulated with phenolic wet bag Seal material.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 1408.1-2006 electrical insulating materials strength test methods - Part 1. Tests at power frequencies GB/T 1409-2006 Measurement of electrical insulating materials at power, audio, high-frequency (including meter wavelengths included) of the permittivity and dielectric loss The recommended method consumption factor GB/T 2411-2008 Plastics and ebonite - Determination of indentation hardness using a durometer (Shore hardness) GB/T 4722 printed circuits copper clad laminates Test Method GB/T 6003.1-1997 Test sieves of metal wire cloth Test methods of insulation resistance of solid insulating materials GB/T 10064-2006 Determination 3 product classification, composition and materials 3.1 Classification Encapsulation materials according to their different characteristics into conventional drying and quick-drying type, model and characteristics are shown in Table 1. Table 1 Type and characteristics of the encapsulating material Characteristics of a Model FS-150-C Drying time > 2h/25 ℃ FS-150-K Drying time ≤2h/25 ℃ NOTE. The encapsulation materials by type binder, the application form, the curing temperature of the material, the material properties of code. F codes for the phenolic resin; material is the S Application Form Code (ie wet); 150 curing temperature for the material of the code; C conventional drying; K for quick drying. a component in accordance with Appendix A encapsulation. 3.2 Composition and Materials 3.2.1 Composition Encapsulating material is a phenolic resin-based binder, adding pigments, fillers and other additives from milling. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 28858-2012_English be delivered?Answer: Upon your order, we will start to translate GB/T 28858-2012_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 28858-2012_English with my colleagues?Answer: Yes. 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