GB/T 28274-2012 English PDFUS$279.00 ยท In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 28274-2012: Silicon-based MEMS fabrication technology -- The basic regulation of layout design Status: Valid
Basic dataStandard ID: GB/T 28274-2012 (GB/T28274-2012)Description (Translated English): Silicon-based MEMS fabrication technology -- The basic regulation of layout design Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L55 Classification of International Standard: 31.200 Word Count Estimation: 12,193 Quoted Standard: GB/T 26111-2010 Regulation (derived from): National Standards Bulletin No. 9 of 2012 Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This standard specifies the micro- structure of machining, photolithography layout design graphic design should follow the basic rules. This standard applies to using contact single/double lithography, oxidation diffusion, chemical vapor deposition (CVD), GB/T 28274-2012: Silicon-based MEMS fabrication technology -- The basic regulation of layout design---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. ICS31.200 L55 National Standards of People's Republic of China Silicon MEMS Manufacturing Technology The basic layout design rules Issued on. 2012-05-11 2012-12-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released ForewordThis standard rule according to GB/T 1.1-2009 given draft. This standard by the National MEMS Technology Standardization Technical Committee (SAC/TC336) and focal points. This standard was drafted. Peking University, the machine on Productivity Center, China Electronics Technology Group Corporation 13th Research Institute, Chinese Academy of Sciences Sea Institute of Microsystem and Information Technology, Northwestern Polytechnical University. The main drafters of this standard. DAR ES SALAAM, Wang Wei, Liu Wei, Yang Fang, Jiang forests, Cui Bo, Xiong Bin, QIAO Da-yong. Silicon MEMS Manufacturing Technology The basic layout design rules1 ScopeThis standard specifies the time microstructure processing, the basic rules of the lithographic layout design graphic design to be followed. This standard applies to the use of contactless single/double-sided lithography, oxidation diffusion, chemical vapor deposition (CVD), physical vapor deposition (PVD), from Injection, reactive ion etching (RIE), potassium hydroxide (KOH) etching silicon - glass aligned electrostatic binding, wheel and other basic process for dicing.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated edition applies to this article Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 26111-2010 micro-electromechanical systems (MEMS) technology terms3 Terms and DefinitionsGB/T 26111-2010 defined and the following terms and definitions apply to this document. 3.1 Double-sided lithography doublesidemaskalign On one side of the substrate (A side), the substrate prepared with the other surface (B surface) of the resist pattern prior or traces patterned aligned relationship with certain the process of. 3.2 Light version lightmask A large area of \u200b\u200btranslucent lithograph. 3.3 Dark version darkmask Large opaque lithograph. 3.4 Alignment marks alignmark A step for aligning marks formed in different patterns.4 lithographic alignment and bond alignment method4.1 single-sided lithographic alignment method By using tools such as lithography lithograph corresponding to the upper substrate on the graphic graphics aligned its work process shown in Figure 1. Sided Lithography Alignment is patterned substrate surface is coated with a photoresist, photolithography equipment to existing graphics and graphics on a lithograph of the substrate After registration, then by exposing and developing the photoresist on the substrate processed into a lithographic printing plate is consistent with the graphics, and the graphics have been aligned relationship with the substrate Graphics. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 28274-2012_English be delivered?Answer: Upon your order, we will start to translate GB/T 28274-2012_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 28274-2012_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 28274-2012_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countriesQuestion 4: Do you accept my currency other than USD?Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay. |
