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GB/T 14592-2014 English PDF

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GB/T 14592-2014: Molybdenum discs
Status: Valid

GB/T 14592: Historical versions

Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 14592-2014189 Add to Cart 3 days Molybdenum discs Valid
GB/T 14592-1993199 Add to Cart 2 days Molybdenum discs Obsolete

Similar standards

GB/T 21183   GB/T 13747.24   GB/T 8769   GB/T 44327   GB/T 26038   GB/T 23271   

Basic data

Standard ID: GB/T 14592-2014 (GB/T14592-2014)
Description (Translated English): Molybdenum discs
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H63
Classification of International Standard: 77.150
Word Count Estimation: 8,848
Date of Issue: 7/24/2014
Date of Implementation: 2/1/2015
Older Standard (superseded by this standard): GB/T 14592-1993
Quoted Standard: GB/T 2828.1; GB/T 3850; GB/T 4325.10; GB/T 4325.11; GB/T 4325.1; GB/T 4325.12; GB/T 4325.13; GB/T 4325.14; GB/T 4325.15; GB/T 4325.16; GB/T 4325.17; GB/T 4325.18; GB/T 4325.19; GB/T 4325.20; GB/T 4325.21; GB/T 4325.2; GB/T 4325.22; GB/T 4325.23; GB/T 4325
Regulation (derived from): National Standards Bulletin No. 19, 2014
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies requirements for molybdenum wafer products, test methods, inspection rules, marking, packaging, transportation, storage, quality certificate and contract (or purchase order) content. This standard applies to power semiconductor dev

GB/T 14592-2014: Molybdenum discs

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Molybdenum discs ICS 77.150 H63 National Standards of People's Republic of China Replacing GB/T 14592-1993 Molybdenum wafer Issued on. 2014-07-24 2015-02-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Foreword

This standard is in accordance with GB/T 1.1-2009 given rules drafted. This standard replaces GB/T 14592-1993 "molybdenum wafer." This standard compared with GB/T 14592-1993, the main changes are as follows. --- Modify the normative references; --- Increase the EDM wire cutting and polishing the car side products labeling and diameter tolerances; --- Modified molybdenum wafer product density requirements; --- Modify the inspection rules in the relevant provisions; --- Increase product quality certificates and contracts (or orders) content requirements. This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized. the company. This standard was drafted. light new country, Hou Juntao, Yu Ye, Zhao Juan, Shi Dawei, Jinbo. Molybdenum wafer

1 Scope

This standard specifies requirements for molybdenum wafer products, test methods, inspection rules, marking, packaging, transportation, storage, quality certificate and contract (Or orders) content. This standard applies to power semiconductor devices and vacuum devices and other molybdenum wafer.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 2828.1 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch inspection sampling plan GB/T 3850 compact sintered metal materials and hardmetals - Determination of density GB/T 4325 (all parts), chemical analysis of molybdenum YS/T 660-2007 molybdenum and molybdenum alloy grades and chemical composition of processed products

3 Requirements

3.1 Categories 3.1.1 product grades and status are shown in Table 1. Table 1 Grade Supply Status manufacturing method Example Specifications/mm Diameter Thickness Mo1, Mo2 Blank (M), annealed punching - cutting ≥4.0 ≥0.6 Sandblasting car side (P), annealed blasting - the car side ≥4.0 ≥0.6 Roughing car side (C), annealed coarse grinding - car side ≥10.0 ≥0.6 The refining side of the car (J), annealed grinding - car side ≥10.0 ≥0.6 Finishing EDM cutting (D), annealed finish - line cutting ≥4.0 ≥0.1 Mo1 polishing the car side (Y), annealed polishing - car side ≥15.0 ≥0.9 3.1.2 Model representation. Model By grade, supply status, and sizes of the order of representation and markers as an example. Example 1. Nominal diameter 20mm, thickness of 2mm blank Mo1 grade molybdenum wafer products is expressed as. Mo1M20 × 2.0. Example 2. Nominal diameter 45mm, thickness of 3mm Mo2 grade molybdenum wafer blasting car side is expressed as. Mo2P45 × 3.0.
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