GB/T 13557-2017 English PDF

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GB/T 13557-2017: Test methods for copper-clad material for flexible printed circuits
Status: Valid

GB/T 13557: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 13557-2017	759	Add to Cart	6 days	Test methods for copper-clad material for flexible printed circuits	Valid
GB/T 13557-1992	399	Add to Cart	3 days	Test methods for flexible copper-clad material for printed circuits	Obsolete

Similar standards

GB/T 12631   GB/T 13556   GB/T 13555   

Basic data

Standard ID: GB/T 13557-2017 (GB/T13557-2017)
Description (Translated English): Test methods for copper-clad material for flexible printed circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Classification of International Standard: 31.180
Word Count Estimation: 38,363
Date of Issue: 2017-07-31
Date of Implementation: 2018-02-01
Older Standard (superseded by this standard): GB/T 13557-1992
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 13557-2017: Test methods for copper-clad material for flexible printed circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods for copper-clad material for flexible printed circuits ICS 31.180 L30 National Standards of People's Republic of China Replacing GB/T 13557-1992 Printed circuits with flexible copper clad material test methods 2017-07-31 Posted 2018-02-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released Directory Foreword Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 test the general requirements 1 4.1 Test atmospheric conditions 1 4.2 Sample Preparation 2 4.3 Test Report 2 5 appearance 2 5.1 Purpose 2 5.2 Sample 2 5.3 Equipment and Materials 2 5.4 program 2 5.5 Report 3 6 size 4 6.1 Purpose 4 6.2 Sample 4 6.3 Equipment and Materials 4 6.4 Procedure 4 6.5 Report 5 7 Physical properties 5 7.1 Dimensional stability 5 7.2 Peel strength 7 7.3 Bending fatigue 11 7.4 folding resistance 13 8 Chemical Properties 14 8.1 Resistance to chemicals 14 8.2 Thermal stress (floating welding) 17 8.3 Solderability 18 Electrical properties 20 9.1 Dielectric constant and dielectric loss factor 20 9.2 Volume Resistivity and Surface Resistance 21 9.3 Electrical strength 24 Environmental performance 25 10.1 Water absorption 25 10.2 Flammability 26 Index 31

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 13557-1992. This standard GB/T 13557-1992 "Printed circuit with flexible copper clad material test method" compared to editorial changes outside the main Technical changes are as follows. --- Modify Chapter 2 "Normative references" content; --- Added Chapter 3, "Terms and Definitions", folding endurance, bending fatigue, release materials, vertical and horizontal are defined; --- Added Chapter 4 "General requirements for testing", provides for the test of the atmospheric conditions, sample preparation and test reports; --- Added Chapter 5 "Appearance", including the depth of scratches, inclusions and holes, pinholes, pits and indentation inspection methods; --- Added Chapter 6 "Dimensions", including width, length, thickness measurement method; --- Increased 7.1 "dimensional stability", including after etching, heat treatment, etching and dimensional stability after heat treatment; --- 7.2 increase acceptance state peel strength test method; the peel strength after thermal shock to float after the peel strength test side Method; change the peel strength after dry heat to the peel strength test method after the temperature cycle; remove the stripping strength after simulated plating condition treatment Test methods for retention of strength and retention of peel strength after dipping; --- 7.3 "bending fatigue" will be the original single bend radius to a number of typical optional or agreed upon by both supply and demand; --- Increased by 7.4 "folding resistance"; --- Added 8.1 "chemical resistance", including Peel strength retention after chemical treatment and chemical resistance; --- Increased 8.2 "thermal stress (floating welding)"; --- Increased 8.3 "weldability"; --- Added 9.1 "dielectric constant and dielectric loss factor"; --- Added 9.2 "volume resistivity and surface resistance"; --- Increased 9.3 "electrical strength"; --- Increased 10.1 "water absorption"; --- 10.2.1 "Vertical combustion" The original vertical combustion test was modified to determine the material's vertical combustion grade FV-0, FV-1, FV-2; --- Added 10.2.2 "Vertical burning of thin materials (FVTM combustion)". Please note that some of this document may be patentable. The issuing agencies of this document do not bear the responsibility of identifying these patents. This standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard by the National Standardization Technical Committee printed circuit board (SAC/TC47) centralized. This standard was drafted .Mike Luo Teke (Changzhou) Co., Ltd. Products Services, Jiujiang Folakesi Co., Ltd., Shuo Science and Technology Co., Ltd. Limited company, Guangdong Sheng Yi Technology Co., Ltd. The main drafters of this standard. Zhang Panxin, Gao Yanru, Fan Heping, Wang Hua Zhi, Liu Ying, Yang Bei, Xiong Yun, Yang Yan, Yang Hong, Cao Yi. This standard replaces the standards previously issued as. --- GB/T 13557-1992. Printed circuits with flexible copper clad material test methods

1 Scope

This standard specifies the appearance of the flexible printed circuit with copper foil material, size, physical properties, chemical properties, electrical properties and environmental performance experiment method. This standard applies to flexible printed circuit with copper foil material (hereinafter referred to as flexible copper clad material), also applies to the adhesive film.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. Printed circuit terminology GB/T 2036-1994 Test method for rigid copper clad laminates for printed circuits GB/T GB/T 5169.22 Fire hazard testing for electrician and electronic products - Part 22. Test flame 50W flame device and confirmation test Test method

3 Terms and definitions

GB/T 2036-1994 defined and the following terms and definitions apply to this document. 3.1 Folding resistancetofolding Flexible copper clad material in the event of failure to bear the bending capacity. 3.2 Flexural fatigue flexuralendurance Capability of reciprocating flexural fatigue testing of flexible copper clad laminates prior to failure. 3.3 Release material releasematerial A film or paper material that is used to protect the coated or supported product from the product and to keep the coated surface intact. 3.4 Vertical machinedirection (MD direction) In the continuous manufacturing of flexible CCL length direction, continuous with the material production in the same direction. 3.5 Transversed direction (TD) In the continuous width of flexible CCL production, it is perpendicular to the MD direction.

4 test the general requirements

4.1 Test atmospheric conditions 4.1.1 Unless otherwise specified, the normal test atmospheric conditions. a) Temperature. 15 ℃ ~ 35 ℃; ......

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