SJ/T 11654-2016 PDF English

SJ/T11654-2016 (SJT11654-2016): PDF in English

SJ/T 11654-2016 SJ ELECTRONIC INDUSTRY STANDARD OF THE PEOPLE’S REPUBLIC OF CHINA ICS 35.220.20 L 63 Report No.: General Specification for Solid State Disk ISSUED ON: APRIL 05, 2016 IMPLEMENTED ON: SEPTEMBER 01, 2016 Issued by: Ministry of Industry and Information Technology of the People’s Republic of China Table of Contents Foreword ... 3 1 Scope ... 4 2 Normative References ... 4 3 Terms and Definitions ... 5 4 Requirements ... 7 5 Test Method ... 12 6 Quality Assessment Procedures ... 20 7 Marking, Packaging, Transportation, and Storage ... 22 Appendix A (Informative) Product Appearance and Installation Size ... 24 Appendix B (Informative) Interface ... 28 Appendix C (Normative) Failure judgment ... 34 General Specification for Solid State Disk 1 Scope This Standard specifies the requirements, test method, quality assessment procedure, marking, packaging, transportation and storage of solid-state disk. This Standard is applicable to the design, production, manufacture and inspection of the solid- state disk (hereinafter refer to as “product”); reference may also be made to other devices containing solid-state disk functional modules. 2 Normative References The following documents are essential to the application of this Document. For the dated documents, only the versions with the dates indicated are applicable to this Document; for the undated documents, only the latest version (including all the amendments) is applicable to this Document. GB/T 191 Packaging – Pictorial Marking for Handling of Goods GB/T 2421.1 Environmental Testing for Electric and Electronic products - General and Guidance GB/T 2422 Environmental testing for electric and electronic products - Terms and definitions GB/T 2423.1 Environmental testing for electric and electronic products - Part 2: Test methods - Tests A: Cold GB/T 2423.2 Environmental testing for electric and electronic products - Part 2: Test methods - Tests B: Dry heat GB/T 2423.3 Environmental testing for electric and electronic products - Part 2: Test methods - Test Ca: Damp heat, steady state GB/T 2423.5 Environmental testing for electric and electronic products - Part 2: Test methods – Test Ea and guidance: Shock GB/T 2423.10 Environmental testing for electric and electronic products - Part 2: Test methods – Test Fc and guidance: Vibration (Sinusoidal) NOTE 3: The semiconductor memory chips that make up the solid-state disk have the ability to be programmed for many times. 3.2 Lifespan (Endurance) Under the condition that the data is guaranteed to be correct, the number of times the solid-state disk can normally perform read and write operations. 3.3 Nominal capacity The solid-state disk capacity announced by the solid-state disk manufacturer that is calculated in decimal numbers. NOTE: It is expressed by GB or TB; thereof, 1GB=109 bytes, and 1TB=1012 bytes. 3.4 Data transfer rate The number of data bits transmitted per unit time that is calculated in a binary number. NOTE: It is expressed by Mb/sec or Gb/sec; thereof, Mb/sec=220bit/sec, and Gb/sec=230bit/sec. 3.5 Read performance The number of data bytes read from the solid-state disk per unit time or the number of read operations per unit time. 3.6 Write performance The number of data bytes written to the solid-state disk per unit time or the number of write operations per unit time. 3.7 Recoverable read error An error occurred while reading data, and the error is recoverable within the specified number of retries. 3.8 Unrecoverable read error An error that is found when reading data, and the error is not recoverable within the specified number of retries. 3.9 Power on to ready time Time that is required from power-on to data readout. 3.10 Interface The interface for connecting the solid-state disk to other devices. 3.11 Active power consumption Energy consumption when the solid-state disk is in the read/write state. NOTE: The unit is Joule (J). 3.12 Idle power consumption Energy consumption when the solid-state disk is in the idle state. NOTE: The unit is Joule (J). 4 Requirements 4.1 Appearance and structure 4.1.1 General requirements There shall be no obvious dents, scratches, cracks, deformations, etc. on the surface of the product; the surface coating shall not be blistered, cracked or peeled off; and the metal parts shall not be rusted or otherwise mechanically damaged. There is no damage to the connector; and it is easy to plug and unplug. Other parts shall be firm and not loose. The texts and symbols and explaining the function, and function display shall be clear and correct. 4.1.2 Structure size 4.1.2.1 1.8’’ solid-state disk The schematic diagram of the shape and structure of 1.8’’ solid-state disk can refer to Appendix A. The pin arrangement and its dimension can refer to Appendix B. 4.1.2.2 2.5’’ solid-state disk The schematic diagram of the shape and structure of 2.5’’ solid-state disk can refer to Appendix A. The pin arrangement and its dimension can refer to Appendix B. 4.1.2.3 3.5’’ solid-state disk The schematic diagram of the shape and structure of 3.5’’ solid-state disk can refer to Appendix A. The pin arrangement and its dimension can refer to Appendix B. 4.1.2.4 Solid-state disks of other sizes a) If the power loss occurs when the product controller is writing data into the flash memory chip: in this case, the loses the file data being operated are allowed; and no hardware damage is required; b) If the power loss occurs when the product controller is not writing data to the flash memory chip: in this case, no data loss or error is allowed. 4.6 Lifespan The lifespan shall meet the lifespan requirements stipulated in the product manual. 4.7 Error rate In the 25°C temperature environment, when the relative humidity of the extreme environment does not exceed 65%, there shall be no more than one unrecoverable read error rate for every 1013 data reads. 4.8 Security 4.8.1 General requirements The general security requirements of the product shall comply with the provisions of 1.3 in GB 4943.1-2011. 4.8.2 Touch current The touch current of the product shall comply with the provisions of 5.1 in GB 4943.1-2011. 4.8.3 Dielectric strength The dielectric strength of the product shall comply with the provisions of 5.2 in GB 4943.1- 2011. 4.8.4 Ground continuity The ground continuity of the product shall comply with the provisions of 2.6 in GB 4943.1- 2011. 4.8.5 Protection function The product shall have protection functions such as overcurrent, overvoltage and short circuit, etc. 4.9 Power accommodation capacity The product shall work normally under the conditions with voltage of 12V±10% and 5V±5%. The product shall have the protection functions such as overcurrent, overvoltage and short circuit, etc. GB/T 26572. 5 Test Method 5.1 Test environmental condition In addition to climate environmental test and reliability test, other tests in this Standard shall be carried out under standard atmospheric conditions for testing: a) Temperature: 15°C~35°C; b) Relative humidity: 25%~75%; c) Atmospheric pressure: 86kPa~106kPa. In all test items, the magnetic field strength around the sample under test shall not exceed 2000 A/m; and the air shall not contain salt spray and corrosive substances. 5.2 Appearance and structure test The appearance of the product is tested by manual visual inspection; the shape dimension of the product is tested by a length measuring instrument; and the weight of the product is tested by a precision weight measuring instrument. All tests shall meet the requirements of 4.1. NOTE: The product during the appearance and weight inspection shall be the product that has been pasted with various labels. 5.3 Power on to ready time test The time interval between when the test product is powered on and ready to start read/write operations. Repeat the test 1000 times; and then take the average value as the power on to ready time. 5.4 Data transfer rate test 5.4.1 Simple sequential read data capability test Continuously send 10,000 read requests to the product; the start address of each read request is the end address of the previous read request; record the response time of each request; and calculate the data bandwidth according to Formula (1). Where: B – data bandwidth under such experimental condition; TR0 – response time at the zero request, in s; TR1 – response time at the 1st request, in s, and so on; S - the size of the requested data is set to 2KB and 1MB in the experiment, and the performance of small/large block reading and writing can be obtained, respectively. 5.4.2 Simple random read data capability test Continuously send 10,000 read requests to the product; the start address of each read request is randomly generated between 0 and the maximum logical address; record the response time of each request; and calculate the data bandwidth according to Formula (1). 5.4.3 Simple sequential write data capability test Continuously send 10,000 write requests to the product; the start address of each write request is the end address of the previous write request; record the response time of each request; and calculate the data bandwidth according to Formula (1). NOTE: The data written down is randomly generated. 5.4.4 Simple random data writing capability test Continuously send 10,000 write requests to the product; the start address of each write request is randomly generated between 0 and the large sector number; record the response time of each request; and calculate the data bandwidth according to Formula (1). NOTE: The data written down is randomly generated. 5.5 Power consumption test 5.5.1 Active power consumption Use the four methods in 5.4; record the working voltage, working current, and working time of the solid-state disk under these four methods at the same time; and then obtain the working power consumptio.......
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