YS/T 935-2013 English PDF

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YS/T 935-2013: Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
YS/T 935-2013	159	Add to Cart	3 days	Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications	Valid

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Basic data

Standard ID: YS/T 935-2013 (YS/T935-2013)
Description (Translated English): Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications
Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard: H68
Classification of International Standard: 77.150.99
Word Count Estimation: 6,677
Quoted Standard: GB/T 14265; GB/T 29658; YS/T 871; YS/T 922; GB/T 20975.1; GB/T 20975.2; GB/T 20975.3; GB/T 20975.4; GB/T 20975.5; GB/T 20975.6; GB/T 20975.7; GB/T 20975.8; GB/T 20975.9; GB/T 20975.10; GB/T 20975.11; GB/T 20975.12; GB/T 20975.13; GB/T 20975.14; GB/T 20975
Adopted Standard: ASTM F2113-01(2011), NEQ
Regulation (derived from): Ministry of Industry and Information Technology Bulletin No. 52, 2013; industry standard for filing Notice No. 1 of 2014 (No. 169 overall)
Issuing agency(ies): Ministry of Industry and Information Technology
Summary: This standard specifies the electronic thin films with high purity metal sputtering target purity levels defined method, impurity content analysis methods, sampling target purity level reporting rules and standards and so on. This standard applies to all

YS/T 935-2013: Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications ICS 77.150.99 H68 People's Republic of China Nonferrous Metals Industry Standard Electronic film with high purity metal sputtering target purity levels And impurities analysis and reporting standards guidelines Issued on. 2013-10-17 2014-03-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. The reference to the standard analysis ASTMF2113-01 (2011) "electronic film with high purity metal sputtering targets purity grade and impurity content Reporting standards and guidelines. " This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized. This standard was drafted. Yes REVIEW billion of the new Materials Co., Ltd.. The main drafters. Zhang Tao, He Jinjiang, according to Ding Chong, Wan Xiaoyong, Xu Wei, Liao Chan, yet again Yan, Wang Xinping, Xiong, Lv Baoguo. Electronic film with high purity metal sputtering target purity levels And impurities analysis and reporting standards guidelines

1 Scope

This standard specifies the electronic film prepared by sputtering targets of high purity metal purity levels defined method, impurity content analysis methods, sampling Rules and target purity grade reporting standards and so on. This standard applies to all types of electronic film with a high purity metal sputtering target (hereinafter referred to as the target). Other requirements for a higher purity target Degree of purity, impurity content analysis and report specifications can also refer to use.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 14265 metallic materials hydrogen, oxygen, nitrogen, carbon and sulfur analysis General GB/T 20975 (all parts), chemical analysis of aluminum and aluminum alloys GB/T 29658 electronic film with a high aluminum and aluminum alloy sputtering targets Determination glow YS/T 871 high purity aluminum chemical analysis of trace elements in the discharge mass spectrometry Determination glow YS/T 922 high copper chemical analysis of trace element content of the discharge mass spectrometry

3 Terms and Definitions

The following terms and definitions apply to this document. 3.1 Target target Physical vapor deposition (PVD) process for sputtering cathode portion of the standard post-processing inactive middle target. 3.2 Raw material lot materiallotbatch Ingot manufacturing batches of the same batch of raw materials used in the target range. 3.3 Target specification targetspecification Sputtering Targets for Electronic Thin Film product specifications.

4 Requirements

4.1 Content Requirements Preparation varies depending on the use of electronic film with high purity metal sputtering targets, targets of different materials purity requirements are inconsistent. Target component Requirements, generally it contains metal impurities and non-metallic impurity detection requirements are as follows. 4.1.1 target made of pure metal, according to the target specifications of metal impurities detection batches of raw materials, and provide the subject in the target specification ......

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