YS/T 863-2025 English PDF

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
YS/T 863-2025	RFQ	ASK	3 days	Copper profile for computer cooling systems	Valid
YS/T 863-2013	319	Add to Cart	3 days	Copper profiles for computer heat sink	Valid

Basic data

Standard ID: YS/T 863-2025 (YS/T863-2025)
Description (Translated English): Copper profile for computer cooling systems
Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard: H62
Classification of International Standard: 77.150.30
Date of Issue: 2025-04-10
Date of Implementation: 2025-11-01
Older Standard (superseded by this standard): YS/T 863-2013
Issuing agency(ies): Ministry of Industry and Information Technology

YS/T 863-2013: Copper profiles for computer heat sink

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Copper profiles for computer heat sink ICS 77.150.30 H62 People's Republic of China Nonferrous Metals Industry Standard Computer radiator copper profiles Issued on. 2013-04-25 2013-09-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. The standard reference adopted EU EN13605.2002 "conductive copper and copper alloy profiles and profile." This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized. This standard is drafted by. Foshan Huahong Copper Tube Co., Ltd. The main drafters of this standard. Kongrui Xiang, Jiang Jie, Liu Yicheng, Jingshuitan Song Zhijian, Ruanlian Ying, Liu Jinxiang, Wang, Yu-hong high. Computer radiator copper profiles

1 Scope

This standard specifies the requirements for copper profiles with computers, test methods, inspection rules and signs, packaging, transportation, storage, and quality certificate Contracts (or orders) and so on. This standard applies to computer use radiator is not greater than the width of 180mm and a thickness of not more than 25mm of copper profiles.

2 Normative references

The following documents for the application of this document is essential. For cited documents with dates, only the dated edition applies to this document. For undated references, the latest edition (including any amendments) applies to this document. GB/T 228.1-2010 metal material tensile test - Part 1. room temperature test methods (ISO 6892-1.2009, MOD) GB/T 231.1 metallic materials Brinell hardness test - Part 1. Test methods GB/T 2828.1 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch inspection sampling plan GB/T 3048.2 wire and cable electrical performance test methods - Part 2. Metal resistivity test GB/T 4340.1 metallic materials - Vickers hardness test - Part 1. Test methods GB/T 5121 (all parts) of copper and copper alloys - GB/T 5231 Wrought copper and copper alloy chemical composition and shape of the product GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation and storage GB/T 23606 copper embrittlement test methods GB/T 26303.2 copper and copper alloy processing material Dimensions detection methods - Part 2. rods, wire, profiles YS/T 478 copper and copper alloy conductivity eddy current testing method YS/T 482 copper and copper alloy analysis photoemission spectroscopy

3 Requirements

3.1 Categories 3.1.1 grade, status, specifications Grade profiles, status, size should be in accordance with Table 1. Product cross-section shown in Figure 1. Table 1 grade profile, status, size Grade Availability shape state width mm thickness mm length mm TU1 TU2 T1 T2 TAg0.1 Straight strip Extruded drawn state (H50) Semi-hard state (H55) Hard (H80) Soft state (O60) ≤180 ≤25 ≤6000 NOTE. If you have other demand-side grade, status, specifications, when desired shape, agreement by both parties. ......

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