YS/T 678-2024 English PDFUS$229.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. YS/T 678-2024: (Bonding copper wire for semiconductor packaging) Status: Valid YS/T 678: Historical versions
Basic dataStandard ID: YS/T 678-2024 (YS/T678-2024)Description (Translated English): (Bonding copper wire for semiconductor packaging) Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended) Classification of Chinese Standard: H62 Classification of International Standard: 77.150.30 Word Count Estimation: 10,122 Date of Issue: 2024-10-24 Date of Implementation: 2025-05-01 Older Standard (superseded by this standard): YS/T 678-2008 Issuing agency(ies): Ministry of Industry and Information Technology Summary: This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, accompanying documents and order forms of bonding copper wire for semiconductor packaging. This standard applies to bonding copper wire for semiconductor packaging. YS/T 678-2008: Copper wire for semiconductor lead bonding---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.Copper wire for semiconductor lead bonding ICS 77.150.10 H61 People's Republic of China Nonferrous Metals Industry Standard The semiconductor device Bonding wire Posted 2008-03-12 2008-09-01 implementation National Development and Reform Commission issued ForewordThis standard Annex A, Annex B, Appendix C, Appendix D and Appendix E are normative appendix. This standard by the National Standardization Technical Committee of non-ferrous metals and centralized. This standard by Heraeus Zhaoyuan Precious Metal Materials Co., Heraeus Zhaoyuan (Changshu) Electronics Materials Co., Ltd. is responsible for drafting. The main drafters of this standard. Liuguang Rui, Wang Weidong, MaoSongLin, Yin Yang, the Ding Ying. The semiconductor device Bonding wire1 ScopeThis standard specifies the wire for bonding semiconductor device requirements, test methods, test specifications and signs, packaging, transportation, storage and ordering Single (or contract) content. This standard applies to the semiconductor device for bonding wire (hereinafter referred to as copper).2 Normative referencesThe following documents contain provisions which, through reference in this standard and become the standard terms. For dated references, subsequent Amendments (not including errata content) or revisions do not apply to this standard, however, encourage the parties to the agreement are based on research Whether the latest versions of these documents. For undated reference documents, the latest versions apply to this standard. GB/T 10573 non-ferrous metal filament tensile test method GB/T 13293 (all parts) Methods for chemical analysis of high purity copper cathode GB/T 15077 precious metals and their alloys geometry measurement methods YS/T 586 copper and copper alloy chemical analysis by inductively coupled plasma atomic emission spectrometry3 Requirements3.1 Categories 3.1.1 Models and Specifications Copper wire models and specifications shown in Table 1. Table 1 Name Type Diameter/μm Copper HC 18 ~ 50 Note 1. You can increase the size of the diameter of the actual requirements of the specifications may be greater than 50μm. Note 2. HC high copper meaning, the suffix number is due to the technical requirements of the serial number from 1 to 10. 3.1.2 mark Copper reign marked by product, month, production order number, model representation, the month 10,11,12, respectively, with X, Y, Z represents, Production number for the serial number. Tag example as follows. □□ reign month □□□ production number □□ copper wire type Example. 06X166HC4 --- meaning production in October 2006, production number 166, the product model HC4. 3.2 Chemical composition Copper chemical composition shall comply with the requirements of Table 2. The supplier shall provide the chemical composition of the raw material quality certificate, the chemical composition of the raw materials required In accordance with Table 2. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of YS/T 678-2024_English be delivered?Answer: Upon your order, we will start to translate YS/T 678-2024_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of YS/T 678-2024_English with my colleagues?Answer: Yes. 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Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version YS/T 678-2024 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically. |
