YS/T 585-2013 English PDFUS$239.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. YS/T 585-2013: Method of ultrasonic inspection for copper and copper alloys plates Status: Valid YS/T 585: Historical versions
Basic dataStandard ID: YS/T 585-2013 (YS/T585-2013)Description (Translated English): Method of ultrasonic inspection for copper and copper alloys plates Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended) Classification of Chinese Standard: H26 Classification of International Standard: 77.040.20 Word Count Estimation: 9,983 Older Standard (superseded by this standard): YS/T 585-2006 Quoted Standard: GB/T 9445; JB/T 10061; JB/T 10062 Regulation (derived from): Ministry of Industry and Information Technology Bulletin 2013 No. 23; industry standard filing Notice 2013 No. 7 (No. 163 overall) Issuing agency(ies): Ministry of Industry and Information Technology Summary: This standard specifies the type A contact method ultrasonic pulse reflection manual testing of copper and copper alloy sheet of the testing method. Including schematics, general requirements, testing equipment, testing methods, defect identification and YS/T 585-2013: Method of ultrasonic inspection for copper and copper alloys plates---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.Method of ultrasonic inspection for copper and copper alloys plates ICS 77.040.20 H26 People's Republic of China Nonferrous Metals Industry Standard Replacing YS/T 585-2006 Copper and copper alloy sheet ultrasonic flaw detection method Issued on. 2013-04-25 2013-09-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released ForewordThis standard was drafted in accordance with GB/T 1.1-2009 given rules. Instead of the standard YS/T 585-2006 "copper and copper alloy sheet ultrasonic flaw detection method." This standard YS/T 585-2006 phase Than the main changes are as follows. --- Expanded the scope of testing for copper and copper alloy sheet, the original standard "plate thickness 6mm ~ 70mm" expand "in thickness A copper plate 6mm ~ 150mm thickness 6mm ~ 200mm and the copper alloy sheet. " --- Added "single defect, continuous defects, defect density and the bottom wave caused by a defect reduction amount" and other terms and definitions. --- Increasing the frequency range of the ultrasonic flaw detection, the original standard "1.25MHz ~ 5.0MHz" to "0.5MHz ~ 5.0MHz ". --- Delete "double crystal straight probes of performance requirements," a. --- The double crystal straight probes recessed flat on the test block to test block with a flat bottom hole. --- Double crystal straight probes and single crystal straight probe detection sensitivity was modified, the original standard Φ4mm flat-bottomed hole equivalent change As Φ2mm flat bottom hole equivalent. --- Defect classification and grading have been modified to meet the different requirements of users. --- The original standard was appropriate individual provisions supplement and perfect. This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized. This standard is drafted by. Chinalco Luoyang Copper Co., Ltd., China Nonferrous Metals Industry Nondestructive Testing Center, Ningbo Xingye Shengtai set Group Limited. The main drafters of this standard. Li Xianghai, Lou East Court, Ji Chang, stable - Wei Shaolin, Yuan Feng and Wang Nan, Cheung Man-kwong. This standard replaces the standards previously issued as follows. --- YS/T 585-2006. Copper and copper alloy sheet ultrasonic flaw detection method1 ScopeThis standard specifies the testing method using the A-type ultrasonic pulse echo contact method manual testing of copper and copper alloy sheet. content include Principles, general requirements, testing equipment, testing methods, and to determine the classification of defects, inspection reports. This standard applies to a thickness of 6mm ~ 150mm thickness of copper and copper alloy sheet ultrasonic 6mm ~ 200mm of flaw detection.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 9445 NDT personnel qualification and certification JB/T 10061 A-mode pulse reflection type ultrasonic flaw detector General technical requirements JB/T 10062 ultrasonic flaw detection probe performance test method3 Terms and DefinitionsThe following terms and definitions apply to this document. 3.1 Single defect singleflaw Determination by 6dB method indicating length of defects, when the probe is moving away from the center of the probe is less than the diameter of the wafer, called single defect. 3.2 Consecutive defect continuousflaws Determination indicating length of defects by 6dB method, when the probe is moving away from the center of the probe is greater than the diameter of the wafer can detect defects, or phase O defect spacing is less than the diameter of the wafer probe called continuous defects. 3.3 Intensive defect aclusterofflaws In the screen simultaneously scan line equivalent of five or more defects reflected signals within the range of 50mm sound path; or on 50mm × 50mm detecting surface found to have five or more defects reflected signal in the same depth range. Reflection amplitude greater than Reflection amplitude Φ2mm flat-bottomed hole equivalents. 3.4 Bottom wave caused by a defect reduction amount lossofbackreflectioncausedbyflaws BG/BF In the region near the defect free of defects in good condition at the end of the first wave amplitude (BG) and the first end of wave amplitude defect region (BF) of the ratio. Decibels (dB).4 principle of the methodA pulse reflection type ultrasonic flaw detector generates a high-frequency electrical pulses through the probe (wafer) to convert the incoming acoustic and elastic media (work) ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of YS/T 585-2013_English be delivered?Answer: Upon your order, we will start to translate YS/T 585-2013_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. 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Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.Question 5: Should I purchase the latest version YS/T 585-2013?Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version YS/T 585-2013 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically. |
