YS/T 543-2025 English PDF

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
YS/T 543-2025	RFQ	ASK	3 days	Aluminum-1% silicon filament for semiconductor bonding	Valid
YS/T 543-2015	329	Add to Cart	3 days	Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding	Valid
YS/T 543-2006	279	Add to Cart	3 days	Semiconductor bonded aluminum -1% silicon filaments	Obsolete

Basic data

Standard ID: YS/T 543-2025 (YS/T543-2025)
Description (Translated English): Aluminum-1% silicon filament for semiconductor bonding
Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard: H61
Classification of International Standard: 77.150.10
Date of Issue: 2025-04-10
Date of Implementation: 2025-11-01
Older Standard (superseded by this standard): YS/T 543-2015
Issuing agency(ies): Ministry of Industry and Information Technology

YS/T 543-2015: Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
(Semiconductor bonded aluminum silicon filament -1%) ICS 29.045 H61 People's Republic of China Nonferrous Metals Industry Standard Replacing YS/T 543-2006 Semiconductor bonded aluminum silicon filaments -1% Standardspecificationforfinealuminum-1% siliconwire Issued on. 2015-04-30 2015-10-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. Instead of the standard YS/T 543-2006 "semiconductor bonded aluminum-1% silicon filaments." Compared with this standard YS/T 543-2006, the main technical changes are as follows. --- To increase and adjust the grades, categories, sizes; --- Increasing the chemical composition requirements Mg, B, V impurity element; --- Increase the tensile force, the Elongation fluctuation; --- Added Appendix A, the filament surface informative typical defects; --- Increasing the normative Appendix B, the filament length measurement method; --- Increased normative appendix C, filament surface quality inspection method. This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points. This standard is mainly drafted by. public and Xinjiang Co., Ltd., Beijing Institute of Nonferrous Metals Rare Earth and application of Jiangyin City, ultra-fine aluminum Plastic Co., Ltd., Shandong Yankuang Light Alloy Co., Ltd., Beijing Dubbo brazing alloys, limited liability company, Northeast Light Alloy Co., Ltd. the company. The main drafters of this standard. Wu Bin, SONG, efforts ancient, Shi Xiumei, Xuyue Xing Yang Xiao, Jiao Lei, Wen Wei Xinyu high, Du Lianmin. This standard replaces the standards previously issued as follows. --- YS/T 543-2006. Semiconductor bonded aluminum silicon filaments -1%

1 Scope

This standard specifies the semiconductor device is bonded to 1% of aluminum silicon filaments requirements, test methods, inspection rules, packaging, labeling, transportation, storage Keeping and quality certificate with your order (or contract) content. This standard applies to semiconductor inner lead (hereinafter referred to as filaments) Drawn or extruded aluminum - 1% silicon filaments.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 3199 aluminum and aluminum alloy products - Packing, marking, transportation and storage GB/T 7999 aluminum and aluminum alloys Optical emission spectroscopy method GB/T 8170 repair value expressed about the rules and limit values and judgment GB/T 10573 non-ferrous metal filament tensile test method GB/T 17432 Wrought aluminum and aluminum alloys - Methods of sampling GB/T 20975 (all parts), chemical analysis of aluminum and aluminum alloys Determination glow YS/T 871 Chemical analysis methods of high purity aluminum trace elements discharge mass spectrometry

3 Requirements

3.1 Categories 3.1.1 grade, status, Dimensions Filaments grades, state, sizes are shown in Table 1. Table 1 grades, status, type, dimensions Grade status Dimensions A typical diameter/mm typical length/m Al-1% Si 0, H18 0.013,0.018,0.020,0.025,0.030,0.032,0.035, 0.038,0.040,0.045,0.050,0.060,0.070,0.080, 0.100 100-1000 3.1.2 tag example Filaments marked by product name, standard number, grade, status, and sizes of the order of representation. Tag example as follows. Example. Grades Al-1% Si, state H18, having a diameter of 0.013mm, length 100m filaments, marked. Filaments YS/T 543-Al-1% SiH18-φ0.013 × 100 ......

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