YS/T 28-2024 English PDF

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
YS/T 28-2024	RFQ	ASK	3 days	(Wafer packaging and marking)	Valid
YS/T 28-2015	319	Add to Cart	3 days	Package of silicon wafers	Obsolete
YS/T 28-1992	199	Add to Cart	2 days	Silicon wafer packaging	Obsolete

Basic data

Standard ID: YS/T 28-2024 (YS/T28-2024)
Description (Translated English): (Wafer packaging and marking)
Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard: H80
Classification of International Standard: 29.045
Date of Issue: 2024-10-24
Date of Implementation: 2025-05-01
Older Standard (superseded by this standard): YS/T 28-2015
Issuing agency(ies): Ministry of Industry and Information Technology
Summary: This standard specifies the packaging, marking, transportation and storage of silicon wafers. This standard applies to silicon single crystal polished wafers, silicon epitaxial wafers, SOI silicon wafers, silicon single crystal etching wafers, silicon single crystal grinding wafers, and silicon wafers for solar cells. Other wafers can be used as a reference.

YS/T 28-2015: Package of silicon wafers

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Package of silicon wafers ICS 29.045 H80 People's Republic of China Nonferrous Metals Industry Standard Replacing YS/T 28-1992 Wafer packaging 2015-04-30 released 2015-10-01 implementation Issued by the Ministry of Industry and Information Technology of the People's Republic of China

Foreword

This standard is drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces YS/T 28-1992 "wafer packaging". The main changes in this standard compared with YS/T 28-1992 are as follows. --- to expand the scope of the standard, an increase of silicon polishing film packaging and solar cell packaging with silicon; - Added normative references to documents, terms and definitions; --- increase the packaging of interference factors. This standard is proposed by the National Committee for Standardization of Nonferrous Metals (SAC/TC243). The drafting of this standard unit. Hangzhou Heiner Semiconductor Co., Ltd., a new research materials Co., Ltd., Nanjing Guosheng Electronics Co., Ltd., Jiang Su Xixin Silicon Materials Technology Development Co., Ltd., Zhejiang Province, silicon material quality inspection center, Dongguan City Huayuan Optoelectronics Technology Co., Ltd. The main drafters of this standard. Wang Feiyao, Sun Yan, Ma Linbao, Xia Genping, Lin Qingxiang, Lou Chunlan, Wang Zhitong. This standard replaced the previous version of the standard release. YS/T 28-1992. Wafer packaging

1 Scope

This standard specifies the packaging of wafers. This standard applies to silicon single crystal polishing film, epitaxial wafers, SOI and other silicon wafer clean packaging, silicon single crystal grinding film (referred to as silicon grinding film) packaging And solar cells with silicon packaging, so that in the transport, storage process to avoid contamination and broken again.

2 normative reference documents

The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article Pieces. For undated references, the latest edition (including all modifications) applies to this document. GB/T 12964 silicon single crystal polishing sheet GB/T 12965 silicon single crystal cutting disc and grinding plate GB/T 14139 silicon epitaxial wafers GB/T 14264 terminology for semiconductor materials GB/T 26071 silicon single crystal cutting sheet for solar cells GB/T 29055 Polycrystalline silicon wafers for solar cells GB/T 29506 300mm silicon single crystal polishing sheet Code for design of clean building of GB 50073

3 terms and definitions

GB/T 14264 The definitions and definitions of the following terms and definitions apply to this document. 3.1 Clean packaging With a special transport cassette on the polishing film, epitaxial wafers, SOI and other wafers to be packaged in the transport, storage process to avoid particles, gold And organic matter on the wafer in the chip stains. 3.2 Combination tape seamtape Adhesive tape for sealing the interface between the seat and the cover of the wafer cassette. 3.3 Filmbox waferbox A closed container consisting of a cartridge holder and a lid, with a chip basket loaded with wafers to form a set of wafer cassettes. Used for Storage and transport of wafers. 3.4 Inner bag innerwrap The inner bag of the package is specially packed with a clean plastic bag. 3.5 Outer bag outerwrap The outer bag of the package for the package which has been enclosed in the package is usually coated with a moisture-proof and anti-static aluminum foil bag. ......

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