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YD/T 1687.2-2007 English PDF

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YD/T 1687.2-2007: Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication. Part 1: 2.5Gbit/s Uncooled Direct Modulation Semiconductor Laser Assembly
Status: Valid
Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
YD/T 1687.2-2007639 Add to Cart 4 days Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication. Part 1: 2.5Gbit/s Uncooled Direct Modulation Semiconductor Laser Assembly Valid

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Basic data

Standard ID: YD/T 1687.2-2007 (YD/T1687.2-2007)
Description (Translated English): Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication. Part 1: 2.5Gbit/s Uncooled Direct Modulation Semiconductor Laser Assembly
Sector / Industry: Telecommunication Industry Standard (Recommended)
Classification of Chinese Standard: M33
Classification of International Standard: 33.180.99
Word Count Estimation: 20,288
Date of Issue: 2007-09-29
Date of Implementation: 2008-01-01
Adopted Standard: MIL-STD-883F-2004, NEQ; Telcordia GR-468-CORE-2004, NEQ; Telcordia GR-326-CORE, NEQ; ITU-T G.957, NEQ
Regulation (derived from): MIIT Science [2007] No. 480
Issuing agency(ies): Ministry of Information Industry of the People's Republic of China
Summary: This standard specifies the 2. 5Gbit/s uncooled directly modulated semiconductor laser component type technical requirements and test methods, including related terms, definitions, classification, technical requirements, test methods, classification and methods of test reliability testing, product testing and product management. This standard applies to high-speed optical fiber communication systems using 1310nm and 1550nm band (including CWDM band) of 2. 5Gbit/s directly modulated uncooled type semiconductor laser components, other wavelengths 2. 5Gbit/s uncooled directly modulated semiconductor laser type components can be implemented by reference.
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