SJ 21454-2018 English PDF

US$299.00 · In stock
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SJ 21454-2018: (Integrated circuit ceramic package silicon aluminum wire bonding technology technical requirements)
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
SJ 21454-2018	299	Add to Cart	3 days	(Integrated circuit ceramic package silicon aluminum wire bonding technology technical requirements)	Valid

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Basic data

Standard ID: SJ 21454-2018 (SJ21454-2018)
Description (Translated English): (Integrated circuit ceramic package silicon aluminum wire bonding technology technical requirements)
Sector / Industry: Electronics Industry Standard
Classification of Chinese Standard: L56
Word Count Estimation: 12,151
Issuing agency(ies): Ministry of Industry and Information Technology

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