JB/T 6174-2020 English PDF

US$169.00 · In stock
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JB/T 6174-2020: The aging process specification for the PCB assembly of instrument
Status: Valid

JB/T 6174: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
JB/T 6174-2020	169	Add to Cart	3 days	The aging process specification for the PCB assembly of instrument	Valid
JB/T 6174-1992	199	Add to Cart	2 days	Process specification for aging process of instrumentation PCB	Obsolete

Similar standards

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Basic data

Standard ID: JB/T 6174-2020 (JB/T6174-2020)
Description (Translated English): The aging process specification for the PCB assembly of instrument
Sector / Industry: Mechanical & Machinery Industry Standard (Recommended)
Classification of Chinese Standard: N06
Classification of International Standard: 19
Word Count Estimation: 7,736
Date of Issue: 2020-12-09
Date of Implementation: 2021-07-01
Older Standard (superseded by this standard): JB/T 6174-1992
Quoted Standard: GB/T 2421; GB/T 2424.1-2015; GB/T 2424.5-2006; GB/T 2424.7-2006; GB 50169-2016
Regulation (derived from): Ministry of Industry and Information Technology Announcement No. 48 (2020)
Issuing agency(ies): Ministry of Industry and Information Technology
Summary: This standard specifies the basic content and requirements for aging screening of printed circuit board assemblies for instrumentation (hereinafter referred to as printed circuit boards). This standard applies to the aging screening of various printed circuit boards in the instrumentation industry.

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