GB/T 8320-2017 English PDF

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GB/T 8320-2017: Copper-tungsten and silver-tungsten electrical contacts
Status: Valid

GB/T 8320: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 8320-2017	359	Add to Cart	4 days	Copper-tungsten and silver-tungsten electrical contacts	Valid
GB/T 8320-2003	639	Add to Cart	3 days	Copper-tungsten and silver-tungsten electrical contacts	Obsolete
GB/T 8320-1987	RFQ	ASK	6 days	Technical specification for copper-Tungsten and silver-Tungsten electrical contacts	Obsolete

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GB/T 38090   GB/T 29628   GB/T 3217   GB/T 5588   GB/T 5586   

Basic data

Standard ID: GB/T 8320-2017 (GB/T8320-2017)
Description (Translated English): Copper-tungsten and silver-tungsten electrical contacts
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: K14
Classification of International Standard: 29.120.20
Word Count Estimation: 18,120
Date of Issue: 2017-11-01
Date of Implementation: 2018-05-01
Older Standard (superseded by this standard): GB/T 8320-2003
Regulation (derived from): National Standard Announcement 2017 No. 29
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 8320-2017: Copper-tungsten and silver-tungsten electrical contacts

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Copper-tungsten and silver-tungsten electrical contacts ICS 29.120.20 K14 National Standards of People's Republic of China Replacing GB/T 8320-2003 Copper tungsten and silver tungsten electrical contacts Posted.2017-11-01 2018-05-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released Directory Preface Ⅰ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 Requirements 2 4.1 copper tungsten and silver tungsten electrical contacts 2 4.2 vacuum switch with copper tungsten and silver tungsten electrical contacts 4 4.3 copper tungsten overall contact 4 5 test methods 4 5.1 Appearance and Section Interlayer 4 5.2 size 4 5.3 Density, hardness, resistivity and flexural strength 5 5.4 Tensile strength 5 5.5 Chemical Composition 5 5.6 gas content 5 5.7 Metallography 5 5.8 Thermal stability 5 5.9 penetration testing 5 5.10 copper alloy copper, chromium, zirconium content analysis 5 6 test rules 5 6.1 Test classification 5 6.2 Batch 5 6.3 test items 5 6.4 qualified judgment 6 6.5 test sequence 6 7 mark, certificate of conformity, packaging, transportation and storage 6 7.1 mark 6 7.2 Certificate 6 7.3 Packaging 7 7.4 Transportation and storage 7 Appendix A (normative) copper tungsten contact product signs and dimensions 8 Appendix B (Normative) Sample form 13 Appendix C (Normative) Normal inspection subsample 14

Foreword

This standard is drafted according to the rules given in GB/T 1.1-2009. This standard replaces GB/T 8320-2003 "copper tungsten and silver tungsten electrical contacts," and GB/T 8320-2003 compared to the main changes are as follows. --- Added copper tungsten contact defect detection method (see Chapter 2); --- Remove the term "immersion infiltration" (see.2003 version 3.2) and "laminated infiltration" (see.2003 version 3.3) terms and definitions; --- Added "sintering" (see 3.2), "liquid sintering" (see 3.3), "solid phase sintering" (see 3.4) terms and definitions; --- Modify the definition of "overall electrical contact" (see 3.5,.2003 edition 3.2); --- Deleted copper tungsten contact size tolerances (see.2003 version 4.1.3); --- Modify the type of impurity and its content requirements (see 4.1.5,.2003 version 4.1.5); --- Increasing the tensile strength of the conductive end of the hard state requirements, and separate requirements for copper and copper alloys (see 4.3.2); --- The tensile strength of copper tungsten contacts and conductive terminals, broken down into copper and copper alloys (see 4.3.3); --- Increased the overall tungsten tungsten contact inspection requirements (see 4.3.6,6.10); --- Remove the "Metallographic Organization Legend" (see the.2003 edition of Appendix A), an increase of "sample shape and size" requirements (see Appendix B). This standard proposed by the China Electrical Equipment Industry Association. This standard by the National Electrotechnical Standardization Technical Committee (SAC/TC228) centralized. This standard was drafted unit. Tianshui West Great Wall Alloy Co., Ltd., Wenzhou Hongfeng Electrical Alloy Co., Ltd., Zhejiang Tianyin alloy technology Ltd., Wenzhou Zhongxi Electrotechnical Alloy Co., Ltd., Guilin Electric Apparatus Research Institute Co., Ltd., Xi'an Xidian Switch Electric Co., Ltd., Fuda Alloy Materials Co., Ltd. Chongqing Chuan-yi metal functional materials Branch, Shenyang Jinchang Lan Yu New Materials Co., Ltd., Anping County fly Cheong Electrical Alloy Co., Ltd., Wenzhou Star Contact Technology Co., Ltd., the United States and Thailand Lok Electrician (Suzhou) Co., Ltd., Shaanxi SIRI Limited liability company, Guilin Jinge Electrical and Electronic Materials Technology Co., Ltd., Guangdong Province Industry Analysis Testing Center. The main drafters of this standard. Wang Haihong, Xie Yongzhong, Chen Xiao, Mu Chengfa, Zheng Xiaojie, Zhao Liwen, Bo Xiaoping, Yan Xiaofang, Zheng Yuanlong, Feng Ruxin, Tian Maojiang, Wu Wenan, Wang Xiaojun, Yan Hongcai, Huo Zhiwen, Cao Wei Chan, Chen Jing, Hu Li Fu, Ye Fan, Liu Ying. This standard replaces the standards previously issued as. --- GB/T 8320-1987, GB/T 8320-2003. Copper tungsten and silver tungsten electrical contacts

1 Scope

This standard specifies the requirements of copper tungsten and silver tungsten electrical contacts, sampling, test methods, signs, labels and packaging. This standard applies to powder pressing sintering and infiltration process of copper tungsten and silver tungsten electrical contacts, these products are mainly used in high and low pressure Electrical appliances.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 228.1 tensile testing of metallic materials - Part 1. room temperature test method GB/T 2828.1-2012 Sampling procedures for inspection - Part 1 - Batch-by-lot inspection by acceptance quality limit (AQL) plan GB/T 2900.4 Electrotechnical terminology Electrical alloys GB/T 5121.1 Methods for chemical analysis of copper and copper alloys - Part 1. Determination of copper content GB/T 5121.16 Methods for chemical analysis of copper and copper alloys - Part 16. Determination of chromium content GB/T 5121.20 Methods for chemical analysis of copper and copper alloys - Part 20. Determination of zirconium content GB/T 5586 electrical contact materials - Basic performance test methods GB/T 5587 silver-based electrical contacts basic shape, size, symbols and labeling GB/T 24300 copper tungsten contact defect detection method GB/T 26871 electrical contact materials metallographic test methods GB/T 26872 electrical contact material metallography JB/T 4107 (All parts) Electrical contact material chemical analysis methods JB/T 5351 vacuum switch contact materials basic performance test methods

3 Terms and definitions

GB/T 2900.4 defined and the following terms and definitions apply to this document. 3.1 Infiltration infiltration With a metal or alloy having a lower melting point than the framework material, capillary action through the pores at a temperature above the melting point of the metal or alloy, Filling of unsintered or sintered porous skeleton porosity to obtain a compact product. 3.2 Sintering sintering A series of complex phenomena or processes that occur when powder or powder compacts are heated at appropriate temperatures and atmospheres so that the interparticle As bonding occurs, the strength of the powder or powder compact increases. 3.3 Liquid phase sintering liquidphasesintering A powder or powder compact of two or more components is sintered at a temperature above the melting point of the low melting point element or the low melting point eutectic therein. ......

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