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GB/T 43087-2023 English PDF

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GB/T 43087-2023: Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 43087-2023	799	Add to Cart	6 days	Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials	Valid

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Basic data

Standard ID: GB/T 43087-2023 (GB/T43087-2023)
Description (Translated English): Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: N33
Classification of International Standard: 71.040.50
Word Count Estimation: 42,491
Date of Issue: 2023-09-07
Date of Implementation: 2024-04-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 43087-2023: Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 71.040.50 CCSN33 National Standards of People's Republic of China microbeam analysisanalytical electron microscopy Method for determining the interface position in cross-sectional images of layered materials (ISO 20263.2017,MOD) Published on 2023-09-07 2024-04-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Preface III Introduction IV 1 Scope 1 2 Normative reference documents 1 3 Terms, definitions and symbols 1 3.1 Terms and definitions 1 3.2 Symbol 3 4 Preparation of cross-section specimens 3 4.1 General 3 4.2 Requirements for cross-section samples 4 5 Determination of interface location 4 5.1 Overview 4 5.2 Preparation 4 6 Interface position determination step 6 6.1 Overview 6 6.2 Obtaining cross-sectional TEM images/STEM images 8 6.3 ROI settings 9 6.4 Obtaining the mean intensity curve 14 6.5 Moving average processing 16 6.6 Differential processing 17 6.7 Determination of interface location 17 7 Uncertainty 18 7.1 Uncertainties accumulated at various steps in the process18 7.2 Uncertainty of measurement results in image analysis18 Appendix A (informative) Processing examples of three types of actual TEM images/STEM images 20 A.1 Overview 20 A.2 Example of processing of type 1 images 20 A.3 Processing examples of type 2 images 22 A.4 Example of processing of type 3 images 25 Appendix B (informative) Two main applications of this method30 B.1 Overview 30 B.2 Application 1.Measurement of layer thickness 30 B.3 Application 2.Calibration of image magnification 32 Appendix C (Informative) Calibration of ruler units. Calibration of pixel size 36 C.1 Overview 36 C.2 Calibration step 36 Reference 37

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. This document is modified using ISO 20263.2017 "Microbeam analysis - Determination of interface position in cross-sectional images of layered materials using electron microscopy" method". The technical differences between this document and ISO 20263.2017 and their reasons are as follows. ---Changed the ordinates of Figure 10c), Figure 11 and Figure 12a) (see 6.4, 6.5, 6.6) to increase operability and facilitate the application of this document; ---Changed the expression of the number of measurements, the expression formula of the total data set and the expression of formula (9) (see 7.1) to improve the accuracy of calculations to facilitate the application of this document; ---Changed the length of R in Figure A.6 (see A.3.1) to improve the accuracy of the data; ---Changed the pixel value of S6 in Figure A.18 to 1779pix (see A.4.5) to increase operability and facilitate the application of this document. The following editorial changes have been made to this document. ---Added range notes (see Chapter 1) to improve the operability of the method of determining the interface location; ---Deleted terms that are not used or used only once (see 3.1); ---Replace ISO 29301.2010 with the informative GB/T 34002-2017 (see 3.1.3, 3.1.6, 3.1.10, 3.1.14, 6.2.1, 7.2, references); --- Added a note on the term multi-layer simulation method, and gave another name for the multi-layer simulation method, multi-chip method (see 3.1.12); ---Changed the expression of EDS and EDX definitions (see 3.2); ---Added the abbreviations RM and CRM (see 3.2); ---Added a note on determining the interface position (see 6.7), explaining that the selected cross-sectional image range and the quality of the cross-sectional image determine the interface position. Important reference; ---Deleted the interface position sequence (see Appendix A) and changed it to as shown in Figure A.5, Figure A.10, and Figure A.18 respectively. (See A.2.5, A.3.5, A.4.6). Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed and coordinated by the National Microbeam Analysis Standardization Technical Committee (SAC/TC38). This document was drafted by. University of Science and Technology Beijing. The main drafters of this document. Quan Maohua and Liu Delu.

Introduction

Layered materials are widely used in semiconductor devices, various sensors, optical element coatings, new functional materials and other fields. Evaluating products When validating production processes, layer thickness is one of the factors that determines the properties of layered materials. In practice, the total thickness of the material, the measurement of the thickness of each layer, and the Inspection of thickness uniformity and interface flatness is usually performed using recorded images of the material. The cross-sectional TEM image/STEM image can confirm Determine the average interface position between two different materials. If the atomic structure model of the material can be established, the interface position in the high-resolution atomic image can be determined by applying the multilayer simulation (MSS) method. However, in real materials, there are many cases where the multi-layer simulation method cannot be applied, such as. ---The interface between the amorphous layer or amorphous substrate and the crystalline layer; ---Interfaces recorded in low-resolution images of atomic columns that cannot identify. 1) thicker single-layer materials; 2) thicker multi-layer materials. This document explains how to obtain intensity curves from the region of interest (ROI) of cross-sectional TEM images/STEM images of layered materials for differential processing. method to determine the average interface position. The layer thickness that can be measured ranges from a few nanometers to a few micrometers. microbeam analysisanalytical electron microscopy Method for determining the interface position in cross-sectional images of layered materials

1 Scope

This document specifies a method for the determination of the average interface position between two different materials recorded using cross-sectional images of layered materials. This document is applicable to cross-sectional images of layered materials recorded by transmission electron microscopy (TEM) or scanning transmission electron microscopy (STEM). and the cross-sectional element surface distribution map recorded by X-ray energy spectrometer (EDS) or electron energy loss spectrometer (EELS). Also suitable for digital The digital image collected by the camera, computer memory and imaging board image sensor, and the analog image recorded on the film are converted into a digital image by the scanner. This document does not apply to the determination of interface positions obtained by the multilayer simulation method (MSS). Note. When the contrast difference on both sides of the interface in the TEM image/STEM image is small, it will cause the pixel intensity to oscillate violently, and the noise generated will affect the average interface position. judgment.

2 Normative reference documents

This document has no normative references. 3 Terms, definitions and symbols 3.1 Terms and definitions The following terms and definitions apply to this document. 3.1.1 cross-sectionalimage cross-sectionalimage TEM image/STEM image of multi-layer materials along the direction perpendicular to the stacking direction. 3.1.2 Calculates the difference between adjacent pixel data in an intensity distribution plot. 3.1.3 digital cameradigitalcamera By chip array image sensors [such as charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS) sensors, see 3.17] A device that converts visual images into electrical signals. [Source. GB/T 34002-2017, 3.8, with modifications] 3.1.4 An image generated from the signal of a selected specific element on an EDS/EELS spectrum. 3.1.5 filtering mask filteringmask Mask defining the cutoff frequency in reciprocal space. ......

Image

Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 43087-2023_English be delivered?

Answer: Upon your order, we will start to translate GB/T 43087-2023_English as soon as possible, and keep you informed of the progress. The lead time is typically 4 ~ 6 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 43087-2023_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 43087-2023_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.