GB/T 39342-2020 English PDF

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GB/T 39342-2020: Aerospace electronic products. General specification for printed circuit board
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 39342-2020	449	Add to Cart	5 days	Aerospace electronic products. General specification for printed circuit board	Valid

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Basic data

Standard ID: GB/T 39342-2020 (GB/T39342-2020)
Description (Translated English): Aerospace electronic products. General specification for printed circuit board
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: V16
Classification of International Standard: 31.180
Word Count Estimation: 24,260
Date of Issue: 2020-11-19
Date of Implementation: 2021-06-01
Quoted Standard: GB/T 191; GB/T 2036; GB/T 4677-2002; QJ 832B-2011
Regulation (derived from): National Standard Announcement No. 26 of 2020
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration
Summary: This standard specifies the requirements, quality assurance regulations and delivery preparations for printed circuit boards for aerospace electronic products. This standard applies to the design, production and inspection of printed circuit boards for aerospace electronic products (hereinafter referred to as "printed boards").

GB/T 39342-2020: Aerospace electronic products. General specification for printed circuit board

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Aerospace electronic products - General specification for printed circuit board ICS 31.180 V16 National Standards of People's Republic of China General Specification for Printed Circuit Boards of Aerospace Electronic Products 2020-11-19 released 2021-06-01 implementation State Administration for Market Regulation Issued by the National Standardization Management Committee

Table of contents

Preface Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 Requirements 1 4.1 Design 1 4.2 Material 1 4.3 Plating and coating on printed board surface 2 4.4 General requirements 2 4.5 Appearance and basic dimensions 2 4.6 Microsection 8 4.7 Physical properties 10 4.8 Chemical properties 12 4.9 Characteristics of copper plating 12 4.10 Electrical performance 12 4.11 Environmental adaptability 14 5 Quality Assurance Regulations 14 5.1 Inspection classification 14 5.2 Inspection conditions 14 5.3 Identification inspection 15 5.4 Quality consistency inspection 16 5.5 Inspection method 19 6 Delivery preparation 20 6.1 Sign 20 6.2 Packaging 20 6.3 Transport 20 6.4 Storage 20 Appendix A (Normative Appendix) Solvent Resistance Test 21

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that certain contents of this document may involve patents. The issuing agency of this document is not responsible for identifying these patents. This standard was proposed and managed by the National Aerospace Technology and Application Standardization Technical Committee (SAC/TC425). Drafting organization of this standard. China Aerospace Science and Technology Corporation Ninth Research Institute.200 Plant. The main drafters of this standard. Baojie, Wang Jinxuan, Wang Yi. General Specification for Printed Circuit Boards of Aerospace Electronic Products

1 Scope

This standard specifies the requirements, quality assurance regulations and delivery preparations for printed circuit boards for aerospace electronic products. This standard applies to the design, production and inspection of printed circuit boards for aerospace electronic products (hereinafter referred to as "printed boards").

2 Normative references

The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this document. For undated references, the latest version (including all amendments) applies to this document. GB/T 191 Packaging, Storage and Transportation Graphic Mark GB/T 2036 Terminology for Printed Circuits GB/T 4677-2002 Printed Board Test Method QJ832B-2011 Test method for multi-layer printed circuit boards for aerospace

3 Terms and definitions

The terms and definitions defined in GB/T 2036 apply to this document.

4 requirements

4.1 Design 4.1.1 When designing a printed board, the important characteristics of the printed board related to reliability should be considered comprehensively, such as the structure of the printed board, the choice of substrate, and the layout of the printed board. Bureau, wiring, printed wire width and wire spacing, via (via), land pattern design, dielectric layer thickness, copper foil thickness and printed board manufacturing And installation process, etc., and should have an appropriate safety factor according to the importance of the printed board in the complete product. 4.1.2 The printed board design should meet the manufacturability requirements. Manufacturability includes the manufacturability of printed board manufacturing and electronic assembly Performance requirements, while testing and maintainability should be considered. The manufacturing process of the printed board mainly considers the thickness, size, number of conductor layers, and wire precision of the board. Factors such as the minimum width and spacing of wires, interconnection methods (through holes, buried holes and blind holes), minimum aperture, plate thickness and aperture ratio. 4.1.3 The material and structure of the printed board should be able to adapt to the use environment requirements of aerospace electronic and electrical products, and the maximum use of renewable, recyclable or environmentally friendly materials should be used. 4.2 Materials 4.2.1 Copper clad laminates generally use substrates with high thermal reliability and flame retardancy. When the electronic assembly uses a higher soldering temperature, the substrate glass The glass transition temperature is generally not less than 170°C. 4.2.2 When selecting a substrate, other properties should be considered on the basis of meeting the key characteristics of the product, and a suitable substrate should be selected according to the following factors. a) Type of printed board; b) manufacturing process; c) Working and storage environment; ......

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