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GB/T 34172-2017 English PDF

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GB/T 34172-2017: Microbeam analysis -- Electron backscatter diffraction -- Phase analysis method of metal and alloy
Status: Valid
Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 34172-2017279 Add to Cart 3 days Microbeam analysis -- Electron backscatter diffraction -- Phase analysis method of metal and alloy Valid

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Basic data

Standard ID: GB/T 34172-2017 (GB/T34172-2017)
Description (Translated English): Microbeam analysis -- Electron backscatter diffraction -- Phase analysis method of metal and alloy
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: G04
Classification of International Standard: 71.040.40
Word Count Estimation: 14,175
Date of Issue: 2017-09-07
Date of Implementation: 2018-08-01
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 34172-2017: Microbeam analysis -- Electron backscatter diffraction -- Phase analysis method of metal and alloy


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Microbeam analysis - Electron backscatter diffraction - Phase analysis method of metal and alloy ICS 71.040.40 G04 National Standards of People's Republic of China Microbeam analysis electron backscatter diffraction Metal and alloy phase analysis method 2017-09-07 Posted 2018-08-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released Directory Foreword Ⅲ Introduction IV 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 test parameters 3 4.1 Sample Requirements 3 4.2 Scanning electron microscope parameter setting 4.2.1 EBSD device 3 4.2.2 Acceleration voltage 3 4.2.3 Beam 3 4.3 EBSD parameter setting 3 4.3.1 EBSD System Calibration 3 4.3.2 exposure time 4 4.3.3 Step Selection 4 4.3.4 EBSD pattern pixel selection 4 4.3.5 EBSP background correction 4 4.3.6 Kikuchi detection 4 5 Analysis Process 5 5.1 Image Acquisition 5 5.2 Qualitative Analysis 5 5.2.1 Elemental chemical composition analysis 5 5.2.2 pattern collection and analysis 5 5.2.3 pattern matching 5 5.3 Quantitative Analysis 5 5.3.1 Phase Selection 5 5.3.2 Parameter Selection 5 5.3.3 Phase distribution collection 5 5.3.4 Phase distribution of the post-processing 6 6 results posted 6 Appendix A (Normative) EBSD sample preparation 7 References 8

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard by the National Microbeam Analysis Standardization Technical Committee (SAC/TC38) and focal point. This standard was drafted unit. Shanghai Electric Power Equipment Design Institute, Tess Ken Trading Co., Ltd., Central Research Institute of Baosteel Group, China Academy of Sciences Shanghai Institute of Ceramics. The main drafters of this standard. Zhang Zuo Gui, Jiaohui wins, Yao Lei, Wang Zhe Zhe.

Introduction

Electron Backscatter Diffraction (EBSD) is based on the analysis of electron beam in scanning electron microscopy (SEM) or focused ion beam (SEM-FIB) The oblique sample surface is excited by backscattered electrons and analyzed by the Kikuchi band formed by atom diffraction on the sample surface to obtain the crystallographic information of the sample Technology [1,2]. EBSD technology for the phase structure of similar crystal analysis, can be combined with the SEM (but also SEM-FIB or EPMA) On the EDS elemental chemical composition analysis to improve the reliability of the EBSD phase analysis results. EBSD data is statistically characteristic, so the phase distribution, orientation relationship and percentage content of multiphase materials can be analyzed simultaneously [3]. by The EBSD phase analysis of metals and alloys can be obtained from the metal and alloy phase morphology, distribution and area percentage of related letters Interest, the composition of the metal and alloy control, heat treatment process selection, the mechanism of alloying and component failure analysis are very heavy The meaning of Microbeam analysis electron backscatter diffraction Metal and alloy phase analysis method

1 Scope

This standard specifies the use of electron backscatter diffraction (Electronbackscatterdiffraction, EBSD) technology in metals and alloys Phase qualitative and quantitative analysis of parameters correction, data acquisition methods. This standard applies to the EBSD on the metal and alloy sample phase analysis, other polycrystalline or single crystal material EBSD phase analysis can also refer to carried out.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 27025 General requirements for testing and calibration laboratories

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 Alloy aloy A substance that has a metallic character consisting of a variety of metallic elements, or metallic and non-metallic elements. 3.2 Phase Materials in the crystal structure and chemical composition of the same part. 3.3 Crystal Consists of spatially regular, repeatable atomic arrangements. Commonly used space group, crystal system, lattice constant (including the edge length and edge between ) And the location of atoms in the unit cell. 3.4 Single crystal singlecrystaline Internal crystal lattice alignment and crystallographic orientation are consistent with the crystal material. 3.5 Grain grain Areas with points of the same orientation (within allowable tolerances) that are completely closed by grain boundaries. 3.6 Polycrystalline polycrystaline A crystalline material consisting of many different single crystals (grains).
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