GB/T 31988-2015 English PDF

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GB/T 31988-2015: Aluminium base copper clad laminate for printed circuits
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 31988-2015	509	Add to Cart	4 days	Aluminium base copper clad laminate for printed circuits	Valid

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Basic data

Standard ID: GB/T 31988-2015 (GB/T31988-2015)
Description (Translated English): Aluminium base copper clad laminate for printed circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Classification of International Standard: 31.180
Word Count Estimation: 24,220
Date of Issue: 2015-09-11
Date of Implementation: 2016-05-01
Quoted Standard: GB/T 2036; GB/T 3198; GB/T 3880.1; GB/T 3880.2; GB/T 3880.3; GB/T 4722; GB/T 5230
Regulation (derived from): National Standard Announcement 2015 No.25
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This Standard specifies the aluminum printed circuits copper clad laminates product classification, identification, structure and materials, appearance, size and performance requirements, test methods, inspection rules, packaging, labeling, transportation and storage. This Standard applies to aluminum printed circuits copper clad laminates (hereinafter referred to as aluminum clad).

GB/T 31988-2015: Aluminium base copper clad laminate for printed circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
(Printed circuits aluminum copper clad laminates) ICS 31.180 L30 National Standards of People's Republic of China Aluminum printed circuits copper clad laminates Issued on. 2015-09-11 2016-05-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Table of Contents

Introduction Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 4 Categories, Types and Identification 2 4.1 Categories 2 4.2 Type 2 4.3 Product Identification 2 5 structures and materials 3 3 5.1 Structure 5.2 material 4 6 Requirement 4 6.1 Appearance 4 6.2 Size 5 6.3 Performance Requirements 7 7 Test methods 8 8 7.1 Appearance 7.2 Size 8 7.3 Thermal conductivity (insulating bonding layer) 8 7.4 Thermal Resistance 9 7.5 The peel strength 9 7.6 9 Flammability 7.7 Thermal Stress 9 9 7.8 Glass transition temperature 9 7.9 Chemical resistance Electric strength 9 7.10 Volume resistivity and surface resistivity of 7.11 9 7.12 dielectric constant and dielectric loss tangent 9 7.13 comparative tracking index 9 7.14 Withstanding Voltage (Hi-pot) test 9 Water absorption 9 7.15 10 8 Inspection Rules 8.1 Identification Test 10 8.2 Quality conformance inspection 11 8.3 clearances 12 8.4 Material Safety Data Sheet 12 9 packaging, labeling, transportation and storage 12 9.1 Packaging 12 9.2 mark 12 9.3 Transportation and storage 12 Appendix A (normative) thermal resistance and thermal conductivity test methods 13 A.1 Scope 13 A.2 Terms and definitions 13 A.3 Principle 13 A.4 Instrument 14 A.5 Sample 15 A.6 program 15 A.7 Calculation 15 A.8 Report 17 Appendix B (normative) Withstanding Voltage (Hi-pot) test 18 B.1 Scope 18 B.2 test device 18 B.3 Sample 18 B.4 program 19 B.5 Report 19 B.6 Note 20

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points. This standard was drafted. Guangdong health benefits Technology Co., Ltd., China Electronics Standardization Institute, the national electronic circuit substrate ENGINEERING Process technology research center, Shaanxi Shengyi Technology Co., Ltd. The main drafters of this standard. Su sound, Liu Yun, Cai Qiaoer, Caiwen Ren, Zhang, She Naidong, Yang Yan, Wang Jinrui, Liushen Xing, Wang Xiang, Qi tube, Peikuai Chuan. Aluminum printed circuits copper clad laminates

1 Scope

This standard specifies the printed circuit with aluminum copper clad laminate product classification, identification, structure and materials, appearance, size and performance to Requirements, test methods, inspection rules, packaging, labeling, transportation and storage. This standard applies to aluminum printed circuits copper clad laminates (hereinafter referred to as aluminum clad).

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 2036 Printed Circuit Terminology GB/T 3198 aluminum and aluminum alloy foil GB/T 3880.1 General industrial aluminum and aluminum alloy sheet, strip - Part 1. General requirements GB/T 3880.2 General industrial aluminum and aluminum alloy sheet, strip Part 2. Mechanical Properties GB/T 3880.3 General industrial aluminum and aluminum alloy sheet, strip Part 3. size deviation GB/T 4722 printed circuits copper clad laminates Test Method GB/T 5230 electrolytic copper foil

3 Terms and Definitions

GB/T 2036 defined by the following terms and definitions apply to this document. 3.1 Thermal conductivity thermalconductivity Under steady state, through the material per unit time per unit area and the temperature gradient perpendicular to the direction of heat flow area. Note. For non-homogeneous materials, this is the apparent thermal conductivity, in this standard, referred to as thermal conductivity, the unit opened in Watts per meter [W/(m · K)] FIG. 3.2 Homogeneous material homogeneousmaterial The nature of any position inside are the same material. 3.3 Thermal thermalresistance Heat resistance in heat flow path encountered reflect the size of the heat transfer capability of the medium or media room, indicating the heat per unit area 1W The size of the temperature rise caused. Note. The thermal resistance per watt unit with a square opening [m2 · K/W] FIG. 3.4 Aluminum copper clad laminates aluminiumbasecoppercladlaminate Sheet aluminum, the insulating adhesive layer and a copper foil three kinds of composite sheet material, referred to as the aluminum clad. It is used to make printed circuits ......

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