GB/T 29846-2025 English PDFUS$359.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 29846-2025: Photoimageable plating and etching resist for printed circuit board Status: Valid GB/T 29846: Historical versions
Basic dataStandard ID: GB/T 29846-2025 (GB/T29846-2025)Description (Translated English): Photoimageable plating and etching resist for printed circuit board Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L90 Classification of International Standard: 31.030 Word Count Estimation: 18,166 Date of Issue: 2025-08-01 Date of Implementation: 2026-02-01 Older Standard (superseded by this standard): GB/T 29846-2013 Issuing agency(ies): State Administration for Market Regulation, Standardization Administration of China GB/T 29846-2025: Photoimageable plating and etching resist for printed circuit board---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT29846-2025Photoimageable plating and etching resist for printed circuit board Photoimageable plating resist for printed circuit boards ICS 31.030 CCS L 90 National Standard of the People's Republic of China Replaces GB/T 29846-2013 Released on August 1, 2025 Implementation on February 1, 2026 State Administration for Market Regulation The National Standardization Administration issued Table of ContentsPreface... Ⅲ 1 Scope... 1 2 Normative references... 1 3 Terms and Definitions 1 4 Requirements... 2 4.1 Before Imaging 2 4.2 After Imaging 3 5 Test methods... 4 5.1 Specimen 4 5.2 Appearance and Dimensions 6 5.3 Viscosity of liquid plating resist 6 5.4 Fineness of Liquid Electroplating Resist 7 5.5 Minimum Line Width and Line Spacing 7 5.6 Resistance to electroplating and chemical plating 7 5.7 Etching resistance 7 5.8 Sealing properties 7 5.9 Color difference... 7 5.10 Development Time 7 5.11 Film removal time... 7 5.12 Filling capacity 7 6 Inspection Rules... 7 6.1 Test conditions 7 6.2 Inspection Classification 7 6.3 Type Inspection 8 6.4 Factory Inspection 9 7 Marking, packaging, transportation and storage 9 7.1 Logo 9 7.2 Packaging 10 7.3 Transportation 10 7.4 Storage 10 References... 11 Preface This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents". Drafting is required. This document replaces GB/T 29846-2013 "Photoimageable electroplating resists for printed circuit boards". Compared with GB/T 29846-2013, In addition to structural adjustments and editorial changes, the main technical changes are as follows. Photoimageable electroless plating resists were deleted from the scope and photoimageable electroless plating resists were added (see Chapter 1, Chapter 1 of the.2013 edition); a) Increased resistance to electroplating resist, chemical plating resistance, dry film photoresist, liquid photoresist, high density interconnected printed circuit boards, The terms and definitions of package substrates (see 3.1, 3.5 to 3.9) have been deleted, including roller coating, screen printing without pattern, dip coating, exposure energy, exposure Terms and definitions for light levels and post-curing (see 3.1 to 3.3, 3.5 to 3.7 of the.2013 edition); b) Changed the viscosity requirement of liquid electroplating resist before imaging and added the thickness requirement after pre-drying (see 4.1.1,.2013 edition) 4.1); c) Added the performance, dimensional requirements (see 4.1.2) and inspection methods (see 5.2.1 and 5.2.4.1.1); d) Changed the minimum line width and line spacing requirements for liquid electroplating resist after imaging (see 4.2.1.1, 4.2.1 of the.2013 edition); e) Added the minimum line width and line spacing requirements for dry film photoresist after imaging (see 4.2.1.2); f) Changed the requirements for electroplating resistance and chemical plating resistance (see 4.2.2,.2013 edition 4.2.2) and the test methods (see 5.6,.2013 edition Version 5.7); g) The requirements for etching resistance (see 4.2.3, 4.2.3 of the.2013 edition) and the test method (see 5.7, 5.8 of the.2013 edition) have been changed; h) Added the requirements for color difference before and after exposure (see 4.2.4) and the test method (see 5.9); i) Added the requirements for the thickness of the dry film photoresist layer after exposure (see 4.2.5) and the inspection method (see 5.2.4.1.2); j) Added the requirements for the sealing properties of dry film photoresist (see 4.2.6) and the test method (see 5.8); k) Added the requirements for dry film photoresist filling ability (see 4.2.7) and test methods (see 5.12); l) Added requirements for developing time and stripping time (see 4.2.8, 4.2.9) and test methods (see 5.10, 5.11); m) The requirements for test graphic design and specimen preparation have been changed (see 5.1,.2013 edition); n) Adjust the identification test to type test, and add the type test of dry film photoresist (see 6.3, 6.3 of the.2013 edition); o) Adjust batch inspection to factory inspection, and add factory inspection for dry film photoresist (see 6.4, 6.4 of the.2013 edition); p) The requirement for periodic inspection has been deleted (see 6.4.3 of the.2013 edition); q) Changed the marking, packaging, transportation and storage requirements of liquid electroplating resist (see Chapter 7, Chapter 7 of the.2013 edition); r) Added requirements for marking, packaging, transportation and storage of dry film photoresists (see Chapter 7); s) Deleted the test and calculation of specimen manufacturing and related data (see Appendix A of the.2013 edition). Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was proposed and coordinated by the National Technical Committee for Standardization of Semiconductor Equipment and Materials (SAC/TC 203). This document was drafted by. Guangzhou Xinsen Fast Circuit Technology Co., Ltd., China Electronics Technology Standardization Institute, Hunan Chuyuan New Materials Co., Ltd., Hangzhou Foster Electronic Materials Co., Ltd., Shenzhen Rongda Photosensitive Technology Co., Ltd., Yiyang Mingzhenghong Electronics Co., Ltd., Shenzhen Linghangda Electronics Co., Ltd., Shenzhen Beijia Electronic Materials Co., Ltd., and Enda Circuit (Shenzhen) Co., Ltd. The main drafters of this document are. Cao Kewei, Qiao Shuxiao, Luo Chang, Liang Quan, Zhang Baoshuai, Shi Zeyuan, Li Weijie, Wu Yiran, Zhao Junsha, Wang Junfeng, Zhu Wenhua, Wang Chunwen, Li Rong, and Cheng Youhe. The previous versions of this document and the documents it replaces are as follows. First published in.2013 as GB/T 29846-2013; This is the first revision. Photoimageable plating resist for printed circuit boards1 ScopeThis document specifies the performance requirements, inspection rules, marking, packaging, transportation and storage requirements of photoimageable electroplating resists for printed circuit boards. The corresponding test method is described. This document applies to photoimageable electroplating and chemical plating resists, photoimageable acid etching and alkaline etching resists used in printed circuit board manufacturing.2 Normative referencesThe contents of the following documents constitute the essential clauses of this document through normative references in this document. For referenced documents without a date, only the latest version (including all amendments) applies to this document. In this document. GB/T 191 Pictorial markings for packaging, storage and transportation GB/T 1724 Paints, varnishes and printing inks - Determination of fineness of grind GB/T 2036 Terminology for Printed Circuits GB/T 2421-2020 Overview and Guidelines for Environmental Testing GB/T 4677-2002 Printed board test methods GB/T 5547 Determination of viscosity of resin finishing agents GB/T 6672-2001 Plastic film and sheeting - Determination of thickness - Mechanical measurement method GB/T 13452.2-2008 Determination of film thickness of paints and varnishes SJ/T 10668 Electronic Assembly Technical Terminology3 Terms and DefinitionsFor the purposes of this document, the terms and definitions given in GB/T 2036 and SJ/T 10668 and the following apply. 3.1 Plating and etching resist The resist used to form electroplating patterns on the board is usually a dry film or liquid photoresist or a screen-printed or printed resist ink. 3.2 Pre-drying The process of changing the photoimageable plating resist of printed circuit boards from liquid to solid. 3.3 Plating resistance The ability of the pattern mask to resist electroplating after the printed circuit board is patterned with a photoimageable electroplating-resistant resist. 3.4 etching resistance The ability of the mask to resist etching after the printed circuit board is patterned with a photoimageable electroplating resist. 3.5 Chemical plating resistance The ability of the pattern mask to resist chemical plating after the printed circuit board is patterned with a photoimageable electroplating-resistant resist. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 29846-2025_English be delivered?Answer: Upon your order, we will start to translate GB/T 29846-2025_English as soon as possible, and keep you informed of the progress. 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Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.Question 5: Should I purchase the latest version GB/T 29846-2025?Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 29846-2025 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically. |
