GB/T 28859-2025 English PDFUS$359.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 28859-2025: Epoxy powder encapsulation material for electronic packaging Status: Valid GB/T 28859: Historical versions
Basic dataStandard ID: GB/T 28859-2025 (GB/T28859-2025)Description (Translated English): Epoxy powder encapsulation material for electronic packaging Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L90 Classification of International Standard: 31.030 Word Count Estimation: 18,160 Date of Issue: 2025-08-01 Date of Implementation: 2026-02-01 Older Standard (superseded by this standard): GB/T 28859-2012, GB/T 28861-2012 Issuing agency(ies): State Administration for Market Regulation, Standardization Administration of China GB/T 28859-2025: Epoxy powder encapsulation material for electronic packaging---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT28859-2025ICS 31.030 CCSL90 National Standard of the People's Republic of China Replaces GB/T 28859-2012, GB/T 28861-2012 Epoxy powder encapsulant for electronic packaging Released on August 1, 2025 Implementation on February 1, 2026 State Administration for Market Regulation The National Standardization Administration issued PrefaceThis document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. This document replaces GB/T 28859-2012 “Epoxy Powder Encapsulants for Electronic Components” and GB/T 28861-2012 “Epoxy Powder Test method for melt flowability of encapsulating materials". Compared with GB/T 28859-2012 and GB/T 28861-2012, in addition to structural adjustments and editorial In addition to the modifications, the main technical changes are as follows. a) Added terms and definitions (see Chapter 3); b) The product classification has been changed (see Chapter 4, 3.1 of GB/T 28859-2012); c) Deleted composition and materials (3.2 of GB/T 28859-2012); d) The properties of the encapsulating material powder have been changed (see 5.1, 4.1 of GB/T 28859-2012); e) The properties of the cured encapsulant have been changed (see 5.2, 4.2 of GB/T 28859-2012); f) The equipment, test steps and results of softening point (Kofler hot plate method) have been changed (see 6.1.3, GB/T 28859-2012 5.1.3); g) Modified the flowability test method, sample preparation, test procedures, and test report (see 6.1.6 and Appendix B, GB/T 28859-2012 5.1.6, Chapter 5 to Chapter 8 of GB/T 28861-2012); h) The inspection requirements for cured products have been changed (see 6.2, 5.2 of GB/T 28859-2012); i) The insulation resistance description and reference documents have been changed (see 6.2.3, 5.2.3 of GB/T 28859-2012); j) The reference document for glass transition temperature has been changed (see 6.2.5, 5.2.5 of GB/T 28859-2012); k) The description of temperature shock resistance has been changed (see 6.2.9, 5.2.9 of GB/T 28859-2012); l) The test method for hardness has been changed (see 6.2.10, 5.2.10 of GB/T 28859-2012); m) Added "Flexural Strength", "Flexural Modulus", "Thermal Conductivity", "Electrical Conductivity", "Comparative Tracking Index (CTI)" and "Volume Resistivity" Test method (see 6.2.11 to 6.2.15); n) The identification inspection and quality consistency inspection items and sampling descriptions have been changed (see 7.2, 7.3, and 6.2, 6.3 of GB/T 28859-2012); o) The requirements for packaging, labeling, storage and transportation have been changed (see Chapter 8 and Chapter 7 of GB/T 28859-2012). Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203). This document was drafted by. China Electronics Technology Standardization Institute, Beijing Qixing Flight Electronics Co., Ltd., Tianjin Kaihua Insulation Materials Co., Ltd. Co., Ltd., Xianyang Xinweihua Insulation Materials Co., Ltd., Guangdong Changxing Semiconductor Technology Co., Ltd., Wuhan Shangsai Optoelectronics Technology Co., Ltd. Shenzhen Boen New Materials Co., Ltd., Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd., Zhejiang Sanshiji New Materials Technology Co., Ltd. Co., Ltd., Xi'an Hongxing Electronic Paste Technology Co., Ltd. The main drafters of this document are. Guan Qi, Li Yang, Ren Kaikuo, Cao Kewei, Zhang Baoshuai, Lian Junjie, Zhou Qingfeng, Wu Yiran, Chang Anji, Zhao Junsha, Shi Zeyuan, Zhang Hui, Liu Cheng, Yuan Feng, Liu Nianjie, Zhang Zhiqiang, Mu Guangyuan, Tang Zhengyang, Huang Chenyao, Li Wen, and Zhao Ying. The previous versions of this document and the documents it replaces are as follows. ---First published in.2012 as GB/T 28859-2012 and GB/T 28861-2012; ---This is the first revision. Epoxy powder encapsulant for electronic packaging1 ScopeThis document specifies the product classification, requirements, inspection rules and packaging of epoxy powder encapsulants for electronic packaging (hereinafter referred to as "encapsulants"). It also describes the requirements for packaging, labeling, storage and transportation, and the corresponding test methods. This document applies to electronic components such as ceramic capacitors, varistors, film capacitors, resistor networks, thermistors, etc. Encapsulation is done with epoxy powder encapsulant.2 Normative referencesThe contents of the following documents constitute the essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. GB/T 1034-2008 Determination of water absorption of plastics GB/T 1408.1 Test methods for electric strength of insulating materials Part 1.Tests at power frequency GB/T 1409-2006 Measurement of permittivity and dielectric loss of electrical insulating materials at power frequency, audio frequency and high frequency (including meter wave wavelength) Recommended method for loss factor GB/T 1636 Plastics - Determination of apparent density of materials capable of flowing from a specified funnel GB/T 2411 Plastics and hard rubber - Determination of indentation hardness (Shore hardness) using a durometer GB/T 3139 Test method for thermal conductivity of fiber reinforced plastics GB/T 4207-2022 Determination of tracking resistance index and relative tracking index of solid insulating materials GB/T 4722-2017 Test methods for rigid copper-clad laminates for printed circuits GB/T 5169.16-2017 Fire hazard tests for electric and electronic products Part 16.Test flame 50W horizontal and vertical flame Test methods GB/T 6003.1 Technical requirements and inspection of test sieves Part 1.Wire mesh test sieves GB/T 9341 Determination of flexural properties of plastics GB/T 21782.9 Powder coatings Part 9.Sampling GB/T 26572 Limit requirements for restricted substances in electrical and electronic products GB/T 28858-2012 Phenolic encapsulant for electronic components GB/T 28860 Determination of gelling time of epoxy powder encapsulants GB/T 28862 Epoxy powder encapsulant sample processing method GB/T 31838.2 Dielectric and resistive properties of solid insulating materials Part 2.Resistance properties (DC method) Volume resistance and Volume resistivity GB/T 31838.4 Dielectric and resistive properties of solid insulating materials Part 4.Resistance characteristics (DC method) Insulation resistance GB/T 36800.2 Thermomechanical analysis of plastics (TMA) Part 2.Coefficient of linear thermal expansion and glass transition temperature Determination GB/T 40564-2021 Test methods for epoxy molding compounds for electronic packaging3 Terms and DefinitionsThere are no terms or definitions that require definition in this document. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 28859-2025_English be delivered?Answer: Upon your order, we will start to translate GB/T 28859-2025_English as soon as possible, and keep you informed of the progress. 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Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.Question 5: Should I purchase the latest version GB/T 28859-2025?Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 28859-2025 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically. |
