GB/T 27581-2011 English PDF

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GB/T 27581-2011: Electromagnetic interference shielding film -- Electroless copper plating solution -- Method of determining concentration of Ni2+ and Cu2+
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 27581-2011	169	Add to Cart	3 days	Electromagnetic interference shielding film -- Electroless copper plating solution -- Method of determining concentration of Ni2+ and Cu2+	Valid

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Basic data

Standard ID: GB/T 27581-2011 (GB/T27581-2011)
Description (Translated English): Electromagnetic interference shielding film -- Electroless copper plating solution -- Method of determining concentration of Ni2+ and Cu2+
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: G15
Classification of International Standard: 71.080.99
Word Count Estimation: 7,743
Date of Issue: 2011-12-05
Date of Implementation: 2012-03-01
Quoted Standard: GB/T 601; GB/T 603; GB/T 6682-2008
Regulation (derived from): Announcement of Newly Approved National Standards No. 19 of 2011
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies the electromagnetic shielding film with a chemical solution by copper -nickel and copper ions in the determination method. This standard applies to the electromagnetic shielding film by electroless copper plating solution of nickel and copper ions content of the test. Measuring range: chemical nickel ions in solution by copper concentration NiSO4 �� 6H2O counted as 0. 20g/L ~ 2. 00g/L, electroless copper plating solution of copper ion concentration CuSO4 �� SH20 counted as 5. 0g/L ~ 60. 0g/L.

GB/T 27581-2011: Electromagnetic interference shielding film -- Electroless copper plating solution -- Method of determining concentration of Ni2+ and Cu2+

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Electromagnetic interference shielding film. Electroless copper plating solution. Method of determining concentration of Ni2 and Cu2 ICS 71.080.99 G15 National Standards of People's Republic of China Electromagnetic shielding film electroless copper plating solution and nickel ions Determination of copper ion content platingsolution-MethodofdeterminingconcentrationofNi2 andCu2 Issued on. 2011-12-05 2012-03-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. The standard proposed by China Petroleum and Chemical Industry Association. This standard by the National Standardization Technical Committee of the optical thin film materials function (SAC/TC431) centralized. This standard was drafted. China Lucky Film Group Corporation, Lucky Film Co., Ltd., the chemical industrial imaging and photographic chemical material Product quality inspection center. The main drafters of this standard. Korean star, INTO. Electromagnetic shielding film electroless copper plating solution and nickel ions Determination of copper ion content caveat Some chemical reagents used in this test method is toxic and corrosive, some experimental process could lead to dangerous situations, the operator shall Appropriate safety and health practices.

1 Scope

This standard specifies the method for measuring the electromagnetic shielding film by electroless copper plating solution of nickel and copper ions content. This standard applies to the electromagnetic shielding film by electroless copper plating solution of nickel and copper ions content testing. Measurement range. copper plating solution Liquid nickel ion concentration NiSO4 · 6H2O in terms of 0.20g/L ~ 2.00g/L; electroless copper plating solution of copper ion concentration CuSO4 · 5H2O calculated as 5.0g/L ~ 60.0g/L.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the edition used in this article Member. For undated references, the latest edition (including any amendments) applies to this document. Preparation of GB/T 601 chemical reagent standard titration solution GB/T 603 chemical reagent in test methods - Preparations with Laboratory use specifications and test methods GB/T 6682-2008 Analysis Principle 3 Take appropriate electromagnetic shielding film by electroless copper plating solution to EDTA masking solution of copper ions in an alkaline medium as ammonium persulfate Oxidizing agent, nickel ions and dimethylglyoxime role in the formation of red wine and physical network to spectrophotometric determination of nickel content. Use Cu2, Ni2 envelope in alkaline solution and the reaction with EDTA, copper ion selective electrode as indicator electrode potential drops Set, the end point of the titration volume of test solution Cu2, Ni2 consumed volume of EDTA standard solution and. Then according to the concentration of Ni2 Calculation of the volume consumed Ni2 EDTA standard solution, to calculate the volume consumed Cu2 EDTA standard solution, Then get the test solution concentration of Cu2.

4 Equipment and Reagents

4.1 UV-Vis spectrophotometer. 4.2 Pipette. capacity 1mL, 2mL, 5mL, 10mL, 20mL. 4.3 flask. capacity of 100mL. 4.4 Beaker. capacity of 200mL. 4.5 titrator. 4.6 copper ion selective electrode. 4.7 Ag/AgCl reference electrode. ......

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