GB/T 14515-2019 English PDF

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GB/T 14515-2019: Sectional specification for single and double sided flexible printed board
Status: Valid

GB/T 14515: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 14515-2019	999	Add to Cart	8 days	Sectional specification for single and double sided flexible printed board	Valid
GB/T 14515-1993	519	Add to Cart	3 days	Specification for single and double sided flexible printed boards with through connections	Obsolete

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Basic data

Standard ID: GB/T 14515-2019 (GB/T14515-2019)
Description (Translated English): Sectional specification for single and double sided flexible printed board
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Classification of International Standard: 31.180
Word Count Estimation: 50,588
Date of Issue: 2019-03-25
Date of Implementation: 2019-10-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 14515-2019: Sectional specification for single and double sided flexible printed board

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Sectional specification for single and double sided flexible printed board ICS 31.180 L30 National Standards of People's Republic of China Replace GB/T 14515-1993, GB/T 14516-1993 Single and double-sided flexible printed boards Published on.2019-03-25 2019-10-01 implementation State market supervision and administration China National Standardization Administration issued

Content

Foreword III 1 Scope 1 2 Normative references 1 3 Application Level 1 4 Requirements 1 4.1 General 1 4.2 Priority 2 4.3 Material 2 4.4 Design 2 4.5 Appearance requirements and test methods 2 4.5.1 Inspection method 2 4.5.2 Conductor appearance 2 4.5.3 Cover and Cover Coating Appearance 6 4.5.4 Coating appearance 8 4.5.5 Appearance edge and the appearance of the punched hole 12 4.5.6 Appearance of reinforcements 13 4.5.7 Other 14 4.6 Dimensional inspection methods and requirements 18 4.6.1 Inspection method 18 4.6.2 Dimensions 18 4.6.3 Thickness 18 4.6.4 Hole 18 4.6.5 Wire width 19 4.6.6 Cumulative tolerance of conductor pitch 19 4.6.7 Hole Center Distance 20 4.6.8 Wire to board edge minimum distance 20 4.6.9 Position tolerance 20 4.6.10 Offset of plate and reinforcement to pressure sensitive adhesive or thermoset adhesive (including adhesive spillage) 22 4.6.11 Minimum thickness of copper plating for plated holes 23 4.7 Physical properties and test methods 23 4.7.1 Peel strength and test method 23 4.7.2 Pull-off strength and test method 23 4.7.3 Coating adhesion and test methods 24 4.7.4 Solderability and test methods 24 4.7.5 Flexibility and test methods 24 4.7.6 Folding resistance and test methods 24 4.8 Chemical properties and test methods 25 4.8.1 Chemical performance test method 25 4.8.2 Chemical performance requirements 25 4.9 Electrical properties and test methods 25 4.9.1 Electrical property test method 25 4.9.2 Electrical performance requirements 25 4.10 Environmental performance and test methods 26 4.10.1 Environmental performance test method 26 4.10.2 Environmental performance requirements 26 4.11 Cleanliness and test methods 27 4.11.1 Cleanliness test method 27 4.11.2 Cleanliness requirements 27 4.12 Flame retardancy and test methods 27 4.12.1 Flame retardant test method 27 4.12.2 Flame retardant inspection requirements 27 5 Quality Assurance Regulations 27 5.1 General 27 5.2 Quality Assessment 27 5.3 Inspection conditions 28 5.4 Capacity Approval 28 5.5 Approved 29 5.5.1 General 29 5.5.2 Sample size 29 5.5.3 Inspection procedures 29 5.5.4 Failure 30 5.5.5 Unqualified treatment 30 5.5.6 Maintenance of qualifications 30 5.6 Quality consistency test 30 5.6.1 General 30 5.6.2 Batch-by-batch inspection 30 5.6.3 Cycle inspection 32 6 Delivery requirements 33 6.1 Packaging Requirements 33 6.2 Transportation and handling 34 6.3 Storage 34 6.4 Use 34 Appendix A (Normative Appendix) Temperature Cycling Test Method 35 Appendix B (Normative) Ion Migration Test Method 37 Appendix C (Normative Appendix) Test Method for Whisker Testing 39 Appendix D (Normative) Comprehensive Test Graphics and Dimensions 41 Appendix E (informative) Polyimide-based flexible printed board instructions for use 44

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 14515-1993 "Technical conditions for single and double-sided flexible printed boards with through connections" and GB/T 14516- 1993 "Technical Conditions for Single and Double-Sided Flexible Printed Boards without Through Connections". Compared with GB/T 14515-1993 and GB/T 14516-1993 The main technical changes are as follows. --- Revised the contents of the scope chapter (see Chapter 1, GB/T 14515-1993 and Chapter 1 of GB/T 14516-1993); --- Increased the application level of printed boards (see Chapter 3); --- Increased the priority (see 4.2); --- Increased requirements for repeatable, recyclable or environmentally friendly materials for printed board materials (see 4.3); --- Increased design requirements (see 4.4); --- Increased cumulative tolerance of conductor pitch (see 4.6.6); --- Increase the overlap of the overlay or overlay coating (see Table 35); --- Increase the minimum thickness of the copper plating layer of the plated hole (see Table 38); --- Added quality assurance provisions (see Chapter 5); --- Increased delivery requirements (see Chapter 6). Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This standard is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47). This standard was drafted. Fujian Weiwei Circuit Board Industrial Co., Ltd., Zhuhai Yuansheng Electronic Technology Co., Ltd. The main drafters of this standard. Zhu Min, He Bo. The previous versions of the standards replaced by this standard are. ---GB/T 14515-1993; ---GB/T 14516-1993. Single and double-sided flexible printed boards

1 Scope

This standard specifies the application level, performance requirements and quality assurance of single and double-sided flexible printed boards (hereinafter referred to as flexible printed boards or FPCs). Regulations, delivery regulations, etc. This standard applies to flexible printing using single or double-sided polyester film or polyimide film copper clad laminate (including adhesive-free type) Board.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only the dated version applies to this article. Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 2423.17-2008 Environmental testing of electric and electronic products - Part 2. Test method test Ka. salt spray GB/T 4677-2002 Printed board test method GB/T 13555 Polyimide film copper clad laminate for flexible printed circuit GB/T 13556 polyester film copper clad laminate for flexible printed circuit GB/T 13557-2017 Test method for flexible copper clad materials for printed circuits GB/T 16261-2017 General specification for printed boards SJ20828 Test pattern and layout plan for qualification

3 application level

The products specified in this standard are divided into three application levels. It is the customer’s responsibility to specify the level of each product in their contract or procurement documentation. Seek, if necessary, the exception requirements for specific parameters. The specific rating is as follows. a) Level 1. General Electronics Products that require less functionality and require the printed board to have full functionality, including consumer products, certain computers, and others. Department equipment. b) Level 2. Durable electronics Products that require high performance, long life, and non-critical equipment for uninterrupted operation, including communication equipment, complex quotient Use machines and instruments. c) Level 3. High reliability electronic products Critical equipment that works continuously in harsh environments, that cannot be shut down, or that is used in life support systems and can be used whenever needed. Spare products, which have higher requirements for the materials, processes, inspections and tests used to process printed boards.

4 requirements

4.1 General Unless otherwise specified, single and double-sided flexible printed boards shall comply with all requirements of the specific performance levels specified in this standard. ......

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